| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/22/2004 | US20040075129 Oxidation resistant microelectronic capacitor structure with l shaped isolation spacer |
| 04/22/2004 | US20040075127 Thin-film capacitor device, mounting module for the same, and method for fabricating the same |
| 04/22/2004 | US20040075126 Top electrode of an intermetallic, a ferroelectric thin film of a perovskite oxide, and a bottom electrode |
| 04/22/2004 | US20040075125 Magnetic random access memory |
| 04/22/2004 | US20040075124 Device using gelable self-organizable polymer |
| 04/22/2004 | US20040075123 Lateral flanks running parallel and perpendicular to the barriers defined by etching and formed by damascening |
| 04/22/2004 | US20040075122 Double and triple gate MOSFET devices and methods for making same |
| 04/22/2004 | US20040075121 Semiconductor device having a U-shaped gate structure |
| 04/22/2004 | US20040075120 Process and device using gelable composition |
| 04/22/2004 | US20040075119 Forming polysilicon structures |
| 04/22/2004 | US20040075118 Layers in substrate wafers |
| 04/22/2004 | US20040075116 Transistor array and method of layout |
| 04/22/2004 | US20040075113 Semiconductor equipment |
| 04/22/2004 | US20040075111 High performance logic and high density embedded dram with borderless contact and antispacer |
| 04/22/2004 | US20040075109 Method of fabricating semiconductor device |
| 04/22/2004 | US20040075108 Bipolar transistor |
| 04/22/2004 | US20040075107 Insulating structures of buried layers with buried trenches and method for making same |
| 04/22/2004 | US20040075106 Manufacturing method for semiconductor substrate, semiconductor substrate and semiconductor device |
| 04/22/2004 | US20040075105 Semiconductor heterostructures having reduced dislocation pile-ups and related methods |
| 04/22/2004 | US20040075104 Semiconductor integrated circuit comprising sense amplifier activating circuit for activating sense amplifier circuit |
| 04/22/2004 | US20040075103 Semiconductor circuit, especially for ignition purposes, and the use of the same |
| 04/22/2004 | US20040075099 Position detecting method and apparatus |
| 04/22/2004 | US20040075094 Semiconductor display device and manufacturing method thereof |
| 04/22/2004 | US20040075093 Organic semiconductor device and process of manufacturing the same |
| 04/22/2004 | US20040075092 Semiconductor device and method for manufacturing the same |
| 04/22/2004 | US20040075090 Modulation doped thyrisor and complementary transistors combination for a monolithic optoelectric integrated circuit |
| 04/22/2004 | US20040075078 Method for producing highly pure solutions using gaseous hydrogen fluoride |
| 04/22/2004 | US20040075068 Wafer defect detection system with traveling lens multi-beam scanner |
| 04/22/2004 | US20040075064 Method for correcting a proximity effect, an exposure method, a manufacturing method of a semiconductor device and a proximity correction module |
| 04/22/2004 | US20040075063 Differential pumping system and exposure apparatus |
| 04/22/2004 | US20040075055 Method for measuring localized region lattice strain by means of convergent beam electron diffraction, and measurement device thereof |
| 04/22/2004 | US20040074899 Encapsulated graphite heater and process |
| 04/22/2004 | US20040074898 Encapsulated graphite heater and process |
| 04/22/2004 | US20040074881 Laser irradiation apparatus and method of manufacturing semiconductor device by using the laser irradiation apparatus |
| 04/22/2004 | US20040074872 Laminated silicate glass layer etch stop method for fabricating microelectronic product |
| 04/22/2004 | US20040074870 Etching method and apparatus |
| 04/22/2004 | US20040074869 Fluorine free integrated process for etching aluminum including chamber dry clean |
| 04/22/2004 | US20040074867 Pre-endpoint techniques in photoresist etching |
| 04/22/2004 | US20040074866 Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials |
| 04/22/2004 | US20040074865 Hybrid interconnect substrate and method of manufacture thereof |
| 04/22/2004 | US20040074808 Fire retardant wafer carrier |
| 04/22/2004 | US20040074807 Wafer carrying system |
| 04/22/2004 | US20040074777 Cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical |
| 04/22/2004 | US20040074763 Plating device and plating method |
| 04/22/2004 | US20040074761 An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating |
| 04/22/2004 | US20040074660 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 04/22/2004 | US20040074609 Multi-part electrode for a semiconductor processing plasma reactor and method of replacing a portion of a multi-part electrode |
| 04/22/2004 | US20040074606 Electrode-built-in susceptor and a manufacturing method therefor |
| 04/22/2004 | US20040074605 Focus ring for semiconductor treatment and plasma treatment device |
| 04/22/2004 | US20040074604 Neutral particle beam processing apparatus |
| 04/22/2004 | US20040074603 Vacuum processing method |
| 04/22/2004 | US20040074602 Plasma etching apparatus |
| 04/22/2004 | US20040074601 Apparatus and method for etching insulating film |
| 04/22/2004 | US20040074600 Wet etch system with overflow particle removing feature |
| 04/22/2004 | US20040074599 Methods and apparatus for conditioning and temperature control of a processing surface |
| 04/22/2004 | US20040074585 Method for applying a semiconductor chip to a carrier element |
| 04/22/2004 | US20040074526 Stripping agent is sprayed from the tip of the nozzle 33 onto the wafer surface, while the first supply nozzle 33 is actuated to scan from the central portion of the wafer to the outer portion thereof. This operation provides the situation, |
| 04/22/2004 | US20040074521 Tool for cleaning substrates |
| 04/22/2004 | US20040074518 Compositions are disclosed for chemical mechanical polishing (CMP) of semiconductor substrates, post-CMP storage of semiconductor substrates and post-CMP cleaning of semiconductor substrates. The methods and compositions feature |
| 04/22/2004 | US20040074516 The versatile operation of process equipment, and especially semiconductor process chamber clean equipment, from any pressure level ranging from a vacuum to just less than one atmosphere absolute. The system of the present invention |
| 04/22/2004 | US20040074515 Manufacturing a semiconductor device by removing impurities from a substrate in the processing chamber with a plasma of a first gas including hydrogen gas. After the substrate is removed from the processing chamber, the processing chamber |
| 04/22/2004 | US20040074514 Method & apparatus for single disc ultrasonic cleaning |
| 04/22/2004 | US20040074451 System and method for utilization of waste heat of semiconductor equipment and heat exchanger used for utilization of waste heat of semiconductor equipment |
| 04/22/2004 | US20040074437 Method of growing single crystal Gallium Nitride on silicon substrate |
| 04/22/2004 | US20040074353 Method and apparatus for removing a carrier part from a carrier, and a product removed from a carrier |
| 04/22/2004 | US20040074323 Process condition sensing wafer and data analysis system |
| 04/22/2004 | US20040074322 Buffer system for a wafer handling system |
| 04/22/2004 | US20040074301 Sensor structure and a silicon sensor. According to the method, into a single-crystal silicon wafer (10) is formed by etched opening at least one spring element configuration (7) and at least one seismic mass (8) connected to said spring |
| 04/22/2004 | US20040074288 Method of manufacturing the multi-tip probe, a multi-tip probe, and surface characteristic analysis apparatus |
| 04/22/2004 | US20040074211 Method of making package containing semiconductor devices and desiccant |
| 04/22/2004 | US20040074104 Vacuum processing apparatus and operating method therefor |
| 04/22/2004 | US20040074103 Vacuum processing apparatus and operating method therefor |
| 04/22/2004 | US20040074102 Dryer lid for substrate dryer |
| 04/22/2004 | US20040074088 Method for manufacturing multilayer circuit board for semiconductor device |
| 04/22/2004 | US20040074086 Method for forming conductor wire on a substrate board |
| 04/22/2004 | US20040074085 Integrated air flow control for a pick and place spindle assembly |
| 04/22/2004 | US20040074029 Substrate cleaning apparatus and cleaning member |
| 04/22/2004 | DE19918360B4 Verfahren zur Bestimmung der Rekombinationslebensdauer an Metall-Isolator-Halbleiter-Strukturen Method for determining the recombination lifetime of the metal-insulator-semiconductor structures |
| 04/22/2004 | DE19508746B4 Belichtungsmaske Exposure mask |
| 04/22/2004 | DE10390694T5 Halbleiterchip-Aufnahmevorrichtung A semiconductor chip pick-up apparatus |
| 04/22/2004 | DE10346561A1 Manufacturing photomask for photolithography involves selecting transparency-adjusting pattern features during exposure process, and ascertaining densities of pattern features |
| 04/22/2004 | DE10344273A1 Verbesserter Kontakt für Speicherzellen Improved contact for memory cells |
| 04/22/2004 | DE10340751A1 Etching apparatus for solar cell, has lattice-shaped protrusion wall provided at peripheral portion of plate formed on surface of silicon substrate |
| 04/22/2004 | DE10339920A1 Feldeffekttransistoren mit vielfach gestapelten Kanälen Field-effect transistors with multiple stacked channels |
| 04/22/2004 | DE10325812A1 Halbleitervorrichtung Semiconductor device |
| 04/22/2004 | DE10311702A1 Transistorstrukturen mit getrennten Anti-Durchschlagspannungsschichten und Verfahren zur Herstellung derselben Transistor structures with separate anti-breakdown voltage layers and methods of making same |
| 04/22/2004 | DE10296935T5 Barrierenverstärkungsprozess für Kupferdurchkontaktierungen(oder Zwischenverbindungen) Barriers amplification process for Kupferdurchkontaktierungen (or intermediates) |
| 04/22/2004 | DE10296740T5 Ableitende Keramik-Bondwerkzeugspitze Dissipative ceramic bonding tool tip |
| 04/22/2004 | DE10296668T5 Verfahren zur Züchtung von Kalziumfluorid-Monokristallen A method of growing monocrystals of calcium fluoride |
| 04/22/2004 | DE10296662T5 Systeme und Verfahren zum epitaxialen Aufwachsen von Filmen auf ein Halbleitersubstrat Systems and methods for epitaxial growth of films on a semiconductor substrate |
| 04/22/2004 | DE10296608T5 Strukturieren eines vertikalen Gates zum Erzielen verbesserter GC- und CB-Prozessbedingungen Structuring a vertical gates to achieve improved GC and CB-process conditions |
| 04/22/2004 | DE10296589T5 Herstellung von bei 157 nm transmittierenden Bariumfluorid-Kristallen mit permeablem Graphit Manufacture of transmitting at 157 nm barium fluoride crystals with porous graphite |
| 04/22/2004 | DE10296550T5 Verfahren zum Füllen eines Durchgangs oder einer Ausnehmung in einem Halbleitersubstrat A method of filling a passage or a recess in a semiconductor substrate, |
| 04/22/2004 | DE10296468T5 Bearbeitung einer Speicherverbindungsleitung mit einer Gruppe von mindestens zwei Laserimpulsen Processing a memory connection line with a group of at least two laser pulses |
| 04/22/2004 | DE10292284T5 Nichtflüchtiger Halbleiterspeicher A non-volatile semiconductor memory |
| 04/22/2004 | DE10291412T5 Selbsteinstellender, grabenfreier Magneto-Widerstands-Zufallszugriffsspeicher (MRAM) Struktur mit Seitenwandeinschließung für die MRAM-Struktur Self-adjusting, grave free magnetoresistive random access memory (MRAM) structure with Seitenwandeinschließung for MRAM structure |
| 04/22/2004 | DE10255203B3 Dynamic memory cell with 2 vertical selection transistors integrated in substrate on either side of trough capacitance |
| 04/22/2004 | DE10247913A1 Process for the anisotropic etching of structures in a substrate arranged in an etching chamber used in semiconductor manufacture comprises using an etching gas and a passivating gas which is fed to the chamber in defined periods |
| 04/22/2004 | DE10247746A1 Production of conducting fine, very fine and micro-structures and other flat constructions on a support used in electronic devices, involves applying conducting particles on the support body and forming a non-conducting layer on its surface |
| 04/22/2004 | DE10246949A1 Isolation trench for insulating high voltage power components has an alternating row of insulating material and filler material formed in the trench and aligned parallel to the trench wall |