Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2004
04/29/2004US20040081917 Method of manufacturing an electronic device and a semiconductor integrated circuit device
04/29/2004US20040081916 Scattering-reticle assemblies for electron-beam microlithography including a scattering-stencil reticle portion and a scattering-membrane reticle portion
04/29/2004US20040081898 Mask can be used independently of its height tolerances and of the membrane holder to be mounted thereon for a distortion-free lithographic imaging
04/29/2004US20040081841 Using a magneto resistive effect element
04/29/2004US20040081833 Process for depositing a tungsten-based and/or molybdenum-based layer on a rigid substrate, and substrate thus coated
04/29/2004US20040081805 Method of producing a bonded wafer and the bonded wafer
04/29/2004US20040081803 Thermal interface wafer and method of making and using the same
04/29/2004US20040081800 Micro-casted silicon carbide nano-imprinting stamp
04/29/2004US20040081798 Hardened nano-imprinting stamp
04/29/2004US20040081790 Method of increasing the area of a useful layer of material transferred onto a support
04/29/2004US20040081762 Applying to substrate a photosensitive resin composition containing polysilane, photosensitive radical generator, oxidizing agent, alkoxy containing containing silicone compound, exposing to radiation, plating
04/29/2004US20040081757 Substrate treatment device, substrate treatment method, and cleaning method for substrate treatment device
04/29/2004US20040081754 Where, even in cases of relatively large batch sizes, only slight fluctuations in layer properties between two wafers are observed or in which fluctuations in layer thickness of a layer deposited on a semiconductor substrate can be reduced
04/29/2004US20040081547 Substrate storage cassette with substrate alignment feature
04/29/2004US20040081546 Method and apparatus for supplying substrates to a processing tool
04/29/2004US20040081545 Substrate carrier having door latching and substrate clamping mechanisms
04/29/2004US20040081538 Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
04/29/2004US20040081467 Optoelectronic clock generator producing high frequency optoelectronic pulse trains with variable frequency and variable duty cycle and low jitter
04/29/2004US20040081439 Actively-controlled electrostatic chuck heater
04/29/2004US20040081224 Device for measuring temperature of semiconductor integrated circuit
04/29/2004US20040081216 Optoelectronic device employing at least one semiconductor heterojunction thyristor for producing variable electrical/optical delay
04/29/2004US20040081004 MRAM and data writing method therefor
04/29/2004US20040081002 Flash memory having memory section and peripheral circuit section and manufacturing the same
04/29/2004US20040080999 Configurable storage device
04/29/2004US20040080991 Method of forming ferroelectric film, ferroelectric memory, method of manufacturing the same, semiconductor device, and method of manufacturing the same
04/29/2004US20040080988 Flash EEprom system
04/29/2004US20040080982 Complementary non-volatile memory cell
04/29/2004US20040080981 Eeprom writing method
04/29/2004US20040080972 Non-volatile SRAM
04/29/2004US20040080971 Semiconductor device
04/29/2004US20040080970 Semiconductor circuit device with mitigated load on interconnection line
04/29/2004US20040080919 Methods for producing passive components on a semiconductor substrate
04/29/2004US20040080902 Chip module and chip card module for producing a chip card
04/29/2004US20040080883 Compensated-well electrostatic discharge protection devices
04/29/2004US20040080850 Magnetic memory, magnetic memory array, method for recording in a magnetic memory and method for reading out from a magnetic memory
04/29/2004US20040080757 Integrated surface metrology
04/29/2004US20040080742 Device inspecting for defect on semiconductor wafer surface
04/29/2004US20040080740 Wafer defect detection system with traveling lens multi-beam scanner
04/29/2004US20040080737 Off-axis levelling in lithographic projection apparatus
04/29/2004US20040080735 Plain surface stage apparatus
04/29/2004US20040080734 Method and apparatus for forming pattern on thin substrate or the like
04/29/2004US20040080732 Near-field photomask, near-field exposure apparatus using the photomask, dot pattern forming method using the exposure apparatus, and device manufactured using the method
04/29/2004US20040080727 EUV exposure apparatus with cooling device to prevent overheat of electromagnetic motor in vacuum
04/29/2004US20040080688 Accuracy connecting terminals; covering with reflective film; multilayer device
04/29/2004US20040080681 Liquid crystal display device array substrate and method of manufacturing the same
04/29/2004US20040080638 CMOS image sensor including photodiodes having different depth accordong to wavelength of light
04/29/2004US20040080481 Semiconductor device and method for manufacturing the same
04/29/2004US20040080474 Light-emitting device and driving method thereof
04/29/2004US20040080396 High value resistors in gallium arsenide
04/29/2004US20040080384 Surface acoustic wave filter and communication device
04/29/2004US20040080377 Waveguide structured package and method for fabricating the same
04/29/2004US20040080352 Clamp circuit
04/29/2004US20040080341 Electronic circuit apparatus and integrated circuit device
04/29/2004US20040080340 Low power consumption MIS semiconductor device
04/29/2004US20040080339 Semiconductor device with bus terminating function
04/29/2004US20040080256 Composite oxide; fine particle size; generating aerosols, heating to remove liquid, coating surfaces
04/29/2004US20040080225 Bearing assembly, stage device using same, and exposure apparatus using same
04/29/2004US20040080056 Die connecting packages; flattening electroconductive sphere connecting to die contactors; tracers or wires running under die
04/29/2004US20040080055 No flow underfill material and method for underfilling semiconductor components
04/29/2004US20040080053 Electropolishing metal layers on wafers having trenches or vias with dummy structures
04/29/2004US20040080051 Semiconductor device
04/29/2004US20040080050 Method and apparats for detecting endpoint during plasma etching of thin films
04/29/2004US20040080049 Adhesion metal layer overcoating electrode pad of semiconductor; heat diffusion barrier; accuracy ; prevent wetting, spreading of solder
04/29/2004US20040080047 Semiconductor device and resin binder for assembling semiconductor device
04/29/2004US20040080045 Semiconductor device and chip-stack semiconductor device
04/29/2004US20040080043 Semiconductor device with reinforced under-support structure and method of fabricating the same
04/29/2004US20040080041 Semiconductor device with improved heatsink structure
04/29/2004US20040080040 Semiconductor device and chip-stack semiconductor device
04/29/2004US20040080033 Flip chip assembly and method for producing the same
04/29/2004US20040080032 Semiconductor device and manufacturing method thereof, electro optic device, liquid crystal display device, electronics device
04/29/2004US20040080030 Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
04/29/2004US20040080029 Images; connector frame; labeled die; exterior bonding pad; radio transparent covering
04/29/2004US20040080026 Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same
04/29/2004US20040080025 Die pads with wire bonding on edges; exterior terminals supported by adhesive tape
04/29/2004US20040080024 Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps
04/29/2004US20040080022 Semiconductor device
04/29/2004US20040080020 Semiconductor device having two-layered charge storage electrode
04/29/2004US20040080019 Methods for manufacturing integrated circuit devices including an isolation region defining an active region area
04/29/2004US20040080018 Method and device for forming an STI type isolation in a semiconductor device
04/29/2004US20040080017 Electronics supoported on semiconductor substrate; contactor; polysilicon overcoating
04/29/2004US20040080016 Integrated circuit cells
04/29/2004US20040080014 Transistor in semiconductor devices and method of fabricating the same
04/29/2004US20040080013 Chip-stack semiconductor device and manufacturing method of the same
04/29/2004US20040080012 Nonvolatile memory device having asymmetric source/drain region and fabricating method thereof
04/29/2004US20040080009 Fabrication of semiconductor devices using anti-reflective coatings
04/29/2004US20040080008 Image sensor having micro-lenses with integrated color filter and method of making
04/29/2004US20040080003 MOS transistor and method of manufacturing the same
04/29/2004US20040080002 Boron incorporated diffusion barrier material
04/29/2004US20040080001 Complementary integrated circuit and method of manufacturing same
04/29/2004US20040080000 Gate structure of metal oxide semiconductor field effect transistor
04/29/2004US20040079999 Semiconductor device and protable electronic device
04/29/2004US20040079998 Semiconductor device and method for fabricating the same
04/29/2004US20040079997 Semiconductor device and metal-oxide-semiconductor field-effect transistor
04/29/2004US20040079996 Semiconductor device and method for fabricating the same
04/29/2004US20040079995 Body contact mosfet
04/29/2004US20040079994 Semiconductor device and method for manufacturing the same
04/29/2004US20040079993 Silicon-on-insulator (SOI) integrated circuit (IC) chip with the silicon layers consisting of regions of different thickness
04/29/2004US20040079992 Forming barrier structure; then dielectric and intake, drain zones; masking
04/29/2004US20040079991 Premature breakdown in submicron device geometries
04/29/2004US20040079990 Memory cell having a trench and method for fabricating the memory cell