Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2004
04/27/2004US6727132 Method of manufacturing a dual gate semiconductor device with a poly-metal electrode
04/27/2004US6727131 System and method for addressing junction capacitances in semiconductor devices
04/27/2004US6727130 Method of forming a CMOS type semiconductor device having dual gates
04/27/2004US6727129 Method for manufacturing a semiconductor device
04/27/2004US6727128 Method of preparing polysilicon FET built on silicon carbide diode substrate
04/27/2004US6727127 Laterally diffused MOS transistor (LDMOS) and method of making same
04/27/2004US6727126 Masking member for forming fine electrode and manufacturing method therefor, method for forming electrode, and field effect transistor
04/27/2004US6727125 Multi-pattern shadow mask system and method for laser annealing
04/27/2004US6727124 Method of manufacturing a TFT using a catalytic element to promote crystallization of a semiconductor film and gettering the catalytic element
04/27/2004US6727123 Method for manufacturing a thin-film transistor comprising a recombination center
04/27/2004US6727122 Method of fabricating polysilicon thin film transistor
04/27/2004US6727121 Method for crystallizing a silicon layer and fabricating a TFT using the same
04/27/2004US6727119 Method of encapsulating a semiconductor device attached to a wiring substrate using sealing resin
04/27/2004US6727118 Power distribution design method for stacked flip-chip packages
04/27/2004US6727115 Back-side through-hole interconnection of a die to a substrate
04/27/2004US6727114 Semiconductor device and a method of manufacturing the same
04/27/2004US6727108 Apparatus and method for optical evaluation, apparatus and method for manufacturing semiconductor device, method of controlling apparatus for manufacturing semiconductor device, and semiconductor device
04/27/2004US6727107 Method of testing the processing of a semiconductor wafer on a CMP apparatus
04/27/2004US6727106 System and software for statistical process control in semiconductor manufacturing and method thereof
04/27/2004US6727105 Method of fabricating an MRAM device including spin dependent tunneling junction memory cells
04/27/2004US6727047 Method of extending the stability of a photoresist during direct writing of an image upon the photoresist
04/27/2004US6727040 Positive resist composition to be irradiated with one of an electron beam and X-ray
04/27/2004US6727033 Positive resist composition
04/27/2004US6727032 Useful in micro-processing using various radiations, e.g., far-ultraviolet radiation such as krf excimer laser or arf excimer laser, x rays such as synchrotron radiation, charged particle radiation such as electron beam, etc.
04/27/2004US6727028 Separating masking pattern into zones; overcoating semiconductor wafer
04/27/2004US6727027 Seed layer is formed of a chromium material containing atleast one of oxygen, nitrogen and carbon, disposed between the transparent substrate and the light-shielding film or the antireflective film
04/27/2004US6727026 Semiconductor integrated circuit patterns
04/27/2004US6726996 Useful as a dielectric capping layer for interconnect structures that include wiring regions that are surrounded by organic interlevel dielectrics, or porous dielectrics (including organic and inorganic)
04/27/2004US6726984 Ceramic structure using a support sheet
04/27/2004US6726955 Method of controlling the crystal structure of polycrystalline silicon
04/27/2004US6726954 Method and system for forming copper thin film
04/27/2004US6726886 Apparatus for cleaning semiconductor device
04/27/2004US6726880 Device comprising support substrate, array of microlocations comprising electronically addressable electrodes, two collection electrodes adjacent to opposite sides of array, and flow cell adapted to be supported on substrate
04/27/2004US6726848 Enclosing only one substrate within process chamber proportioned to process only one substrate at time, exposing substrate to chemical treatment fluid, exposing to rinse fluid, exposing to drying vapor
04/27/2004US6726826 Method of manufacturing a semiconductor component
04/27/2004US6726815 Electrochemical etching cell
04/27/2004US6726814 Process for producing optical article
04/27/2004US6726805 Pedestal with integral shield
04/27/2004US6726803 Multi-sectional plasma generator with discharge gaps between multiple elements forming a plasma discharge cavity
04/27/2004US6726802 Plasma processing apparatus
04/27/2004US6726801 Dry etching apparatus for manufacturing semiconductor devices
04/27/2004US6726800 Ashing apparatus, ashing methods, and methods for manufacturing semiconductor devices
04/27/2004US6726799 Plasma etching apparatus with focus ring and plasma etching method
04/27/2004US6726776 Low temperature integrated metallization process and apparatus
04/27/2004US6726771 Treatment solution supply method and treatment solution supply unit
04/27/2004US6726769 Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition
04/27/2004US6726768 Method of crystallizing amorphous silicon
04/27/2004US6726554 Guide ring removal device
04/27/2004US6726550 Polishing apparatus
04/27/2004US6726540 Polishing cloth and method of manufacturing semiconductor device using the same
04/27/2004US6726538 Sample polishing apparatus and sample polishing method
04/27/2004US6726537 Polishing carrier head
04/27/2004US6726535 Method for preventing localized Cu corrosion during CMP
04/27/2004US6726534 Preequilibrium polishing method and system
04/27/2004US6726533 Automatic, masking
04/27/2004US6726529 Low temperature chemical mechanical polishing of dielectric materials
04/27/2004US6726528 Polishing pad with optical sensor
04/27/2004US6726526 Cutting machine
04/27/2004US6726429 Local store for a wafer processing station
04/27/2004US6726319 Method for inspecting surface of semiconductor wafer
04/27/2004US6725869 Protective barrier for cleaning chamber
04/27/2004US6725868 Liquid processing apparatus
04/27/2004US6725565 Heating a semiconductor substrate and vaccuming the removed vapor
04/27/2004US6725564 Multistage semiconductor processing tool
04/27/2004US6725557 Thickness measuring apparatus and method
04/27/2004US6725536 Methods for the fabrication of electrical connectors
04/27/2004CA2351568C Method for forming transparent conductive film by using chemically amplified resist
04/27/2004CA2260489C Process of reclamation of soi substrate and reproduced substrate
04/25/2004WO2004038805A1 Lateral short-channel dmos, method for manufacturing same and semiconductor device
04/25/2004CA2458992A1 Lateral short-channel dmos, method of manufacturing the same, and semiconductor device
04/22/2004WO2004034758A1 Process for producing ceramic multilayer board
04/22/2004WO2004034478A2 Layer arrangement of hetero-connected semiconductor layers, comprising at least one intermediate separation layer, and method for the production thereof
04/22/2004WO2004034476A2 Flip chip imaging sensor
04/22/2004WO2004034475A1 Plasma oscillation switching device
04/22/2004WO2004034474A1 Semiconductor storage
04/22/2004WO2004034470A2 Dual-port memory cell and layout design
04/22/2004WO2004034469A1 Magnetic storage device using ferromagnetic tunnel junction element
04/22/2004WO2004034468A2 Flash memory array with increased coupling between floating and control gates
04/22/2004WO2004034467A2 Sublithographic nanoscale memory architecture
04/22/2004WO2004034464A1 Forming polysilicon structures
04/22/2004WO2004034462A1 Trench insulation in substrate disks comprising logic semiconductors and power semiconductors
04/22/2004WO2004034461A1 Electrode configuration for retaining cooling gas on electrostatic wafer clamp
04/22/2004WO2004034460A2 Method for eliminating voiding in plated solder
04/22/2004WO2004034459A2 Method for producing a thinned down stack of chips
04/22/2004WO2004034458A1 Field effect transistor with local source/drain insulation and associated method of production
04/22/2004WO2004034457A1 Annealed wafer and annealed wafer manufacturing method
04/22/2004WO2004034456A1 Method of forming wiring
04/22/2004WO2004034455A1 Plasma processing apparatus, processing vessel used in plasma processing apparatus, dielectric plate used in plasma processing apparatus
04/22/2004WO2004034454A1 Substrate treating appratus
04/22/2004WO2004034453A1 Method for treating semiconductor material
04/22/2004WO2004034451A1 Substrate detergent
04/22/2004WO2004034449A2 Transparent oxide semiconductor thin film transistors
04/22/2004WO2004034446A1 Exposure device, alignment method, and semiconductor device manufacturing method
04/22/2004WO2004034445A2 A method for plasma etching performance enhancement
04/22/2004WO2004034444A1 Heated substrate support
04/22/2004WO2004034443A1 Atomic layer deposition methods and atomic layer deposition tools
04/22/2004WO2004034442A2 Method for semiconductor gate width reduction
04/22/2004WO2004034441A2 Apparatus and method for assembling arrays of functional elements to substrates
04/22/2004WO2004034438A2 Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
04/22/2004WO2004034437A2 Improved performance of electronic and optoelectronic devices using a surfactant during epitaxial growth