| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/06/2004 | WO2004038275A1 Microfabrication tool pedestal and method of use |
| 05/06/2004 | WO2004038072A2 Plating uniformity control by contact ring shaping |
| 05/06/2004 | WO2004038065A1 Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon |
| 05/06/2004 | WO2004037962A2 Aqueous phosphoric acid compositions for cleaning semiconductor devices |
| 05/06/2004 | WO2004037937A1 A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces |
| 05/06/2004 | WO2004037878A2 Co-curable compositions |
| 05/06/2004 | WO2004037877A2 Organosiloxanes |
| 05/06/2004 | WO2004037866A2 Photoresists containing sulfonamide component |
| 05/06/2004 | WO2004037711A2 Processes for hermetically packaging wafer level microscopic structures |
| 05/06/2004 | WO2004037490A1 Transparent microporous materials for cmp |
| 05/06/2004 | WO2004037452A1 Equipment and method for washing parts |
| 05/06/2004 | WO2004025712A3 Method for p-type doping wide band gap oxide semiconductors |
| 05/06/2004 | WO2004017423A3 Sensor arrangement |
| 05/06/2004 | WO2004017378A3 Atomic layer deposition of high k metal silicates |
| 05/06/2004 | WO2004010485A3 Semiconductor element with stress-carrying semiconductor layer and corresponding production method |
| 05/06/2004 | WO2004010458A3 Plasma implantation system and method with target movement |
| 05/06/2004 | WO2004006140A3 Method and apparatus for automatic sensor installation |
| 05/06/2004 | WO2003100826A3 Lithography laser with beam delivery and beam pointing control |
| 05/06/2004 | WO2003090347A3 Acoustic wave sensor apparatus, method and system using wide bandgap materials |
| 05/06/2004 | WO2003063239A3 Method and apparatus for controlling die attach fillet height to reduce die shear stress |
| 05/06/2004 | WO2003054256B1 Method and device for depositing crystalline layers on crystalline substrates |
| 05/06/2004 | WO2003017479A3 Electronic device and method of testing and of manufacturing |
| 05/06/2004 | WO2002073699A9 Nanofabrication |
| 05/06/2004 | WO2002048432A9 Method for patterning metal using nanoparticle containing precursors |
| 05/06/2004 | WO2002004711A3 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 05/06/2004 | US20040088675 Method of and computer program product for designing patterns, and method of manufacturing semiconductor device |
| 05/06/2004 | US20040088672 Architecture and interconnect scheme for programmable logic circuits |
| 05/06/2004 | US20040088667 Semiconductor integrated circuit capable of facilitating layout modification |
| 05/06/2004 | US20040088659 Semiconductor device having scan flip-flop and design method therefor |
| 05/06/2004 | US20040088658 Method of designing semiconductor device |
| 05/06/2004 | US20040088471 Equi-potential sensing magnetic random access memory (MRAM) with series diodes |
| 05/06/2004 | US20040088416 Printed circuit board and method manufacturing the same |
| 05/06/2004 | US20040088071 Aligner evaluation system, aligner evaluation method, a computer program product, and a method for manufacturing a semiconductor device |
| 05/06/2004 | US20040088068 Method and apparatus for providing first-principles feed-forward manufacturing control |
| 05/06/2004 | US20040087694 Positive type resist composition |
| 05/06/2004 | US20040087681 Toughened epoxy-anhydride no-flow underfill encapsulant |
| 05/06/2004 | US20040087456 enables damage-free, residue-free cleaning of substrates having particulate contamination on Si/SiO2 substrates |
| 05/06/2004 | US20040087263 Semiconductor wafer handler |
| 05/06/2004 | US20040087262 Polishing silicon wafers |
| 05/06/2004 | US20040087258 Polishing method and apparatus |
| 05/06/2004 | US20040087257 CMP equipment for use in planarizing a semiconductor wafer |
| 05/06/2004 | US20040087254 Fluid-pressure regulated wafer polishing head |
| 05/06/2004 | US20040087251 Semiconductor processing methods of removing conductive material |
| 05/06/2004 | US20040087250 Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| 05/06/2004 | US20040087249 Alignment mark and exposure alignment system and method using the same |
| 05/06/2004 | US20040087248 Polishing method and apparatus |
| 05/06/2004 | US20040087187 Recipe cascading in a wafer processing system |
| 05/06/2004 | US20040087186 Using sonic energy in connection with laser-assisted direct imprinting |
| 05/06/2004 | US20040087185 Heat treatment method and heat treatment system |
| 05/06/2004 | US20040087184 Ionic additives for extreme low dielectric constant chemical formulations |
| 05/06/2004 | US20040087183 Selectively growing a polymeric material on a semiconductor substrate |
| 05/06/2004 | US20040087182 Method for synthesizing polymeric material, method for forming polymer thin film and method for forming interlayer insulating film |
| 05/06/2004 | US20040087180 Oxide film forming method |
| 05/06/2004 | US20040087179 Method for forming integrated dielectric layers |
| 05/06/2004 | US20040087178 Method for manufacturing semiconductor device |
| 05/06/2004 | US20040087177 Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same |
| 05/06/2004 | US20040087176 Forming a self-aligned pattern on an existing pattern on a substrate by coating a masking material to the substrate and allowing a portion of the masking material to preferentially attach to portions of the existing pattern; including metal elements and dielectrics; microelectronics; simplifification |
| 05/06/2004 | US20040087175 Application of impressed-current cathodic protection to prevent metal corrosion and oxidation |
| 05/06/2004 | US20040087174 Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal |
| 05/06/2004 | US20040087171 Combined conformal/non-conformal seed layers for metallic interconnects |
| 05/06/2004 | US20040087169 Dry etching method and semiconductor device manufacturing method |
| 05/06/2004 | US20040087168 Method and apparatus for supporting a semiconductor wafer during processing |
| 05/06/2004 | US20040087167 Method for removing polymeric residue contamination on semiconductor feature sidewalls |
| 05/06/2004 | US20040087166 Method for making a dual damascene interconnect using a dual hard mask |
| 05/06/2004 | US20040087164 Scum solution for chemically amplified resist patterning in cu/low k dual damascene |
| 05/06/2004 | US20040087163 Method for forming magnetic clad bit line |
| 05/06/2004 | US20040087161 Code implantation process |
| 05/06/2004 | US20040087160 Method and structure for controlling the interface roughness of cobalt disilicide |
| 05/06/2004 | US20040087159 Method for manufacturing multi-thickness gate dielectric layer of semiconductor device |
| 05/06/2004 | US20040087158 Substrate processing method and substrate processing apparatus |
| 05/06/2004 | US20040087156 Method of manufacturing semiconductor device |
| 05/06/2004 | US20040087155 Method of removing sidewall spacers in the fabrication of a semiconductor device using an improved removal process |
| 05/06/2004 | US20040087154 System architecture of semiconductor manufacturing equipment |
| 05/06/2004 | US20040087153 Method of etching a silicon-containing dielectric material |
| 05/06/2004 | US20040087150 Structural element and process for its production |
| 05/06/2004 | US20040087149 Method for reducing contamination, copper reduction, and depositing a dielectric layer on a semiconductor device |
| 05/06/2004 | US20040087148 Copper interconnect by immersion/electroless plating in dual damascene process |
| 05/06/2004 | US20040087147 Fast ramp anneal for hillock suppression in copper-containing structures |
| 05/06/2004 | US20040087146 Method of preparing whole semiconductor wafer for analysis |
| 05/06/2004 | US20040087145 Semiconductor device and method of manufacturing |
| 05/06/2004 | US20040087144 Cobalt silicide formation method employing wet chemical silicon substrate oxidation |
| 05/06/2004 | US20040087143 Process for atomic layer deposition of metal films |
| 05/06/2004 | US20040087142 Method for electroless plating a contact pad |
| 05/06/2004 | US20040087141 Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application |
| 05/06/2004 | US20040087140 Process for fabricating an electrical circuit comprising a polishing step |
| 05/06/2004 | US20040087139 Nitrogen-free antireflective coating for use with photolithographic patterning |
| 05/06/2004 | US20040087138 Method for manufacturing buried wiring structure |
| 05/06/2004 | US20040087137 Method of manufacturing interconnection structure applied to semiconductor device |
| 05/06/2004 | US20040087136 Metal barrier integrity via use of a novel two step PVD-ALD deposition procedure |
| 05/06/2004 | US20040087135 Very low effective dielectric constant interconnect Structures and methods for fabricating the same |
| 05/06/2004 | US20040087134 Method for writing to the magnetoresistive memory cells of an integrated magnetoresistive semiconductor memory |
| 05/06/2004 | US20040087133 Method for manufacturing semiconductor device having porous structure with air-gaps |
| 05/06/2004 | US20040087131 Method for the solder-stop structuring of elevations on wafers |
| 05/06/2004 | US20040087130 Semiconductor device and mounted semiconductor device structure |
| 05/06/2004 | US20040087129 Solder bump structure and laser repair process for memory device |
| 05/06/2004 | US20040087128 Method and materials for printing particle-enhanced electrical contacts |
| 05/06/2004 | US20040087127 Process and arrangement for the selective metallization of 3D structures |
| 05/06/2004 | US20040087126 Method of forming a through-substrate interconnect |
| 05/06/2004 | US20040087125 Method for manufacturing semiconductor device |
| 05/06/2004 | US20040087124 Method for fabricating semiconductor device |