Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2004
05/11/2004US6733902 Liquid epoxy resin composition and semiconductor device
05/11/2004US6733901 Grinding a premix of an epoxy resin, a phenolic resin, a curing accelerator and an inorganic filler to obtain a specific particle size distribution and melt-kneading the ground material under a reduced pressure.
05/11/2004US6733899 Metal plate and method of shaping the same
05/11/2004US6733895 ZnO film, method for manufacturing the same, and luminescent element including the same
05/11/2004US6733848 Thin film forming equipment and method
05/11/2004US6733830 Vapor deposited film
05/11/2004US6733829 Reducing maintainence; forming cut out on interior circum-ferential edge to increase spacing from chuck
05/11/2004US6733822 Firing an aluminum nitride molding having at least one highly isolated through-hole for via hole formation; specified shrinkage factor; noncracking
05/11/2004US6733703 Mixed with an organic binder so that parts produced from such compounds will have a precisely controlled shrinkage upon sintering; allows the use of a single molding tool to fabricate parts to very tight manufacturing tolerances
05/11/2004US6733695 Silver powder and thermosetting resin
05/11/2004US6733686 Method and device for removing an unnecessary film
05/11/2004US6733685 Methods of planarizing structures on wafers and substrates by polishing
05/11/2004US6733649 Electrochemical processing method
05/11/2004US6733624 Apparatus for holding an object to be processed
05/11/2004US6733620 Process apparatus
05/11/2004US6733619 Apparatus for integrated monitoring of wafers and for process control in semiconductor manufacturing and a method for use thereof
05/11/2004US6733618 Disturbance-free, recipe-controlled plasma processing system and method
05/11/2004US6733616 Surface isolation device
05/11/2004US6733615 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
05/11/2004US6733613 An anisotropic conductive compound is cured by exposing it to heat while in the presence of an ac magnetic field followed by a static, substantially homogeneous dc magnetic field.
05/11/2004US6733607 Burning out parrafin wax in a channel, lamination
05/11/2004US6733602 Polycrystalline material with surface features projecting from a surface thereof
05/11/2004US6733597 Method of cleaning a dual damascene structure
05/11/2004US6733596 Substrate cleaning brush preparation sequence, method, and system
05/11/2004US6733594 Method and apparatus for reducing He backside faults during wafer processing
05/11/2004US6733593 Film forming device
05/11/2004US6733592 High-temperature and high-pressure treatment device
05/11/2004US6733591 Method and apparatus for producing group-III nitrides
05/11/2004US6733584 Method of forming crystalline silicon film
05/11/2004US6733553 Water, microparticles of a cerium oxide abrasive, and a chelating agent; forming a shallow trench isolation structure during planarization of a semiconductor
05/11/2004US6733377 Dicing machine
05/11/2004US6733370 In-situ pad conditioning apparatus for CMP polisher
05/11/2004US6733363 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
05/11/2004US6733268 Dividing apparatus
05/11/2004US6733250 Filter unit, chemical liquid supply system, and chemical liquid supply method
05/11/2004US6733243 Method of interbay transportation
05/11/2004US6733174 Semiconductor temperature detecting method and its circuit
05/11/2004US6733165 Optical integrator for an illumination device
05/11/2004US6732945 Chemical solutions methods for processing semiconductor materials
05/11/2004US6732912 Solder ball attaching process
05/11/2004US6732911 Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
05/11/2004US6732908 Microjoint chip carrier including multilayer substrate with plurality of receptacles in top surface, set of microjoint pads on device chips with conductive studs extending outwardly above surface, interconnect wiring connecting receptacles
05/11/2004US6732902 Lead penetrating clamping system
05/11/2004US6732855 Conveying element and conveyor means for conveying wafer receptacles, and method
05/11/2004US6732750 Semiconductor wafer cleaning apparatus and method of using the same
05/11/2004US6732746 Reduced particle contamination manufacturing and packaging for reticles
05/11/2004US6732612 Blade exchanging device and blade exchanging method therefor
05/11/2004US6732610 Slide apparatus and its stage mechanism for use in vacuum
05/11/2004US6732446 Cooling device for wafer machine
05/11/2004US6732442 Precise mechanism for load port adjustment
05/11/2004US6732422 Method of forming resistors
05/11/2004CA2319430C A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
05/11/2004CA2274785C A chip module and process for the production thereof
05/06/2004WO2004039132A2 Method for surface processing by means of a microwave vacuum-plasma associated with electron-cyclotron resonance
05/06/2004WO2004039129A1 Ceramics heater for semiconductor production system
05/06/2004WO2004039128A1 Ceramics heater for semiconductor production system
05/06/2004WO2004038870A2 Selectable area laser assisted processing of substrates
05/06/2004WO2004038812A1 Optoelectronic circuits employing one or more heterojunction thyristor devices
05/06/2004WO2004038809A2 Formation of contacts on semiconductor substrates
05/06/2004WO2004038808A2 Double and triple gate mosfet devices and methods for making same
05/06/2004WO2004038807A1 Mosfets incorporating nickel germanosilicided gate and methods of their formation
05/06/2004WO2004038804A2 Semiconductor device having a u-shaped gate structure
05/06/2004WO2004038802A2 Integrated circuit arrangement comprising capacitors and preferably planar transistors, and production method
05/06/2004WO2004038799A1 Electronic member, method for making the same, and semiconductor device
05/06/2004WO2004038798A2 Stacked electronic structures including offset substrates
05/06/2004WO2004038796A1 Method for producing a stepped edge profile comprised of a layered construction.
05/06/2004WO2004038794A1 Semiconductor device and resin binder for assembling semiconductor device
05/06/2004WO2004038793A1 Non-contact id card and the like and method for manufacturing same
05/06/2004WO2004038792A2 Barc shaping for improved fabrication of dual damascene integrated circuit features
05/06/2004WO2004038791A1 A method of forming shallow trench isolation structure in a semiconductor device
05/06/2004WO2004038790A1 Pasted soi substrate, process for producing the same and semiconductor device
05/06/2004WO2004038789A1 Substrate storage container
05/06/2004WO2004038788A2 Method and apparatus for detecting endpoint during plasma etching of thin films
05/06/2004WO2004038787A2 Using scatterometry to optimize circuit structure manufacturing processes
05/06/2004WO2004038785A1 Method of forming a self-aligned, selectively etched, double recess high electron mobility transistor
05/06/2004WO2004038784A1 Automatically adjustable transistor and the production method thereof
05/06/2004WO2004038783A2 Pecvd of organosilicate thin films
05/06/2004WO2004038782A1 Semiconductor device and process for producing the same
05/06/2004WO2004038780A1 Semiconductor manufacturing apparatus system and semiconductor device manufacturing method using the same
05/06/2004WO2004038779A1 Expansion method and device
05/06/2004WO2004038778A1 Gate material for semiconductor device fabrication
05/06/2004WO2004038777A1 Heat treatment apparatus
05/06/2004WO2004038776A1 Heat treatment system and heat treatment method
05/06/2004WO2004038775A1 Method of polycyrstallization, method of manufacturing polysilicon thin film transistor, and laser irradiation device therefor
05/06/2004WO2004038774A2 Method for producing semi-conducting devices and devices obtained with this method
05/06/2004WO2004038772A2 Method to control dimensions of features on a substrate with an organic anti-reflective coating
05/06/2004WO2004038771A1 Ceramics heater for semiconductor production system
05/06/2004WO2004038770A2 Integrated circuit arrangement comprising a capacitor, and production method
05/06/2004WO2004038769A2 Flip-chip system and method of making same
05/06/2004WO2004038768A1 Encapsulated graphite heater and process
05/06/2004WO2004038766A2 Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging
05/06/2004WO2004038765A2 Optoelectronic clock generator and other optoelectronic devices and systems employing at least one heterojunction thyristor device
05/06/2004WO2004038764A2 Semiconductor device with quantum well and etch stop
05/06/2004WO2004038757A2 Transistor structures and methods for making the same
05/06/2004WO2004038733A1 Ferroelectric film, ferroelectric capacitor, ferroelectric memory, piezoelectric device, semiconductor device, method for manufacturing ferroelectric film, and method for manufacturing ferroelectric capacitor
05/06/2004WO2004038728A1 Self-aligned 2-bit 'double poly cmp' flash memory cell
05/06/2004WO2004038726A1 Flash eeprom unit cell and memory array architecture including the same
05/06/2004WO2004038502A1 Pattern forming materials and pattern formation method using the materials
05/06/2004WO2004038433A1 Sheet-form connector and production method and application therefor
05/06/2004WO2004038327A1 Film-thickness inspection method for thin-film device and production method for thin-film device