Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2004
05/18/2004US6737351 Versatile system for diffusion limiting void formation
05/18/2004US6737350 Method of manufacturing semiconductor device
05/18/2004US6737349 Method of forming a copper wiring in a semiconductor device
05/18/2004US6737348 Plug is formed in hole in first insulating film, second insulating film is deposited on first insulating film and buried interconnect is formed in interconnect groove in second insulating film
05/18/2004US6737347 Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device
05/18/2004US6737346 Integrated circuit with modified metal features and method of fabrication therefor
05/18/2004US6737344 Method for manufacturing nonvolatile semiconductor memory with narrow variation in threshold voltages of memory cells
05/18/2004US6737343 Method for manufacturing an integrated circuit structure with limited source salicidation
05/18/2004US6737342 Composite spacer scheme with low overlapped parasitic capacitance
05/18/2004US6737341 Semiconductor integrated circuit device and method for manufacturing the same
05/18/2004US6737340 Method and apparatus for self-doping contacts to a semiconductor
05/18/2004US6737339 Semiconductor device having a doped lattice matching layer and a method of manufacture therefor
05/18/2004US6737337 Method of preventing dopant depletion in surface semiconductor layer of semiconductor-on-insulator (SOI) device
05/18/2004US6737336 Semiconductor device and manufacturing method therefor
05/18/2004US6737335 Shallow trench isolation type semiconductor device and method of manufacturing the same
05/18/2004US6737334 Method of fabricating a shallow trench isolation structure
05/18/2004US6737333 Semiconductor device isolation structure and method of forming
05/18/2004US6737332 Semiconductor device formed over a multiple thickness buried oxide layer, and methods of making same
05/18/2004US6737330 Isolation structure and fabricating method therefor
05/18/2004US6737329 Static charge dissipation pads for sensors
05/18/2004US6737328 Methods of forming silicon dioxide layers, and methods of forming trench isolation regions
05/18/2004US6737326 Method of integrating a thin film resistor in a multi-level metal tungsten-plug interconnect
05/18/2004US6737325 Method and system for forming a transistor having source and drain extensions
05/18/2004US6737324 Method for fabricating raised source/drain of semiconductor device
05/18/2004US6737323 Method of fabricating a trench structure substantially filled with high-conductivity material
05/18/2004US6737322 Method for manufacturing semiconductor device
05/18/2004US6737321 Method of manufacturing flash memory device
05/18/2004US6737320 Double-doped polysilicon floating gate
05/18/2004US6737319 Method of manufacturing semiconductor device and semiconductor device
05/18/2004US6737318 Semiconductor integrated circuit device having switching misfet and capacitor element and method of producing the same, including wiring therefor and method of producing such wiring
05/18/2004US6737317 Method of manufacturing a capacitor having RuSixOy-containing adhesion layers
05/18/2004US6737316 Method of forming a deep trench DRAM cell
05/18/2004US6737315 Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate
05/18/2004US6737314 Semiconductor device manufacturing method and semiconductor device
05/18/2004US6737313 Surface treatment of an oxide layer to enhance adhesion of a ruthenium metal layer
05/18/2004US6737311 Semiconductor device having a buried layer for reducing latchup and a method of manufacture therefor
05/18/2004US6737310 Self-aligned process for a stacked gate RF MOSFET device
05/18/2004US6737309 With a gate insulation film of hafnium oxide formed as a high dielectric constant insulator over the entire structure
05/18/2004US6737308 Semiconductor device having LDD-type source/drain regions and fabrication method thereof
05/18/2004US6737307 Method for forming amorphous silicon film on single crystal silicon and structure formed
05/18/2004US6737306 Semiconductor device having a tapered gate and method of manufacturing the same
05/18/2004US6737305 Thin film transistor manufacture method
05/18/2004US6737304 Process of fabricating a semiconductor device
05/18/2004US6737303 Process for forming organic semiconducting layer having molecular alignment
05/18/2004US6737302 Manufacturing method for field-effect transistor
05/18/2004US6737300 Chip scale package and manufacturing method
05/18/2004US6737297 Process for making fine pitch connections between devices and structure made by the process
05/18/2004US6737296 Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings
05/18/2004US6737295 Chip scale package with flip chip interconnect
05/18/2004US6737294 Method of reducing surface leakage currents of a thin-film transistor substrate
05/18/2004US6737292 Method of fabricating an image sensor module at the wafer level and mounting on circuit board
05/18/2004US6737291 Method for fabricating image sensor using salicide process
05/18/2004US6737288 Method for fabricating a semiconductor device
05/18/2004US6737286 Apparatus and method for fabricating arrays of atomic-scale contacts and gaps between electrodes and applications thereof
05/18/2004US6737285 Semiconductor device manufacturing method
05/18/2004US6737284 Contact structure for semiconductor devices and corresponding manufacturing process
05/18/2004US6737283 Method to isolate device layer edges through mechanical spacing
05/18/2004US6737265 Microelectronic unit forming methods and materials
05/18/2004US6737222 Depositing layered photoresist above a substrate, patterning the first lower layer using the patterned first upper layer as a hard mask; depositing a second layered photoresist above the first layer photoresist, patterning
05/18/2004US6737221 Lithography
05/18/2004US6737217 Photoresist monomers containing fluorine-substituted benzylcarboxylate and photoresist polymers comprising the same
05/18/2004US6737215 Photoresist composition for deep ultraviolet lithography
05/18/2004US6737213 Pattern formation material and method
05/18/2004US6737208 Method and apparatus for controlling photolithography overlay registration incorporating feedforward overlay information
05/18/2004US6737206 Pre-alignment system of exposure apparatus having wafer cooling means and exposure method using the same
05/18/2004US6737202 Stabilized resist layer that provides for the prevention of interlayer intermixing with the deposition of subsequent resist layers; t-gate structure; optical lithography
05/18/2004US6737198 Transparent substrate; shield pattern
05/18/2004US6737173 Pretreating method before plating and composites having a plated coat
05/18/2004US6737123 Silicon-based film formation process, silicon-based film, semiconductor device, and silicon-based film formation system
05/18/2004US6737118 Low dielectric constant materials and their production and use
05/18/2004US6737108 Microcapsulating conductive metal particles with polymerized monomers
05/18/2004US6736993 Silicon reagents and low temperature CVD method of forming silicon-containing gate dielectric materials using same
05/18/2004US6736992 Chemical mechanical planarization of low dielectric constant materials
05/18/2004US6736987 Silicon etching apparatus using XeF2
05/18/2004US6736986 Chemical synthesis of layers, coatings or films using surfactants
05/18/2004US6736952 Platen of conductive material is disposed proximate to the polishing pad and is configured to have a negative charge during planarization process; demetallization of a workpiece surface such as semiconductor
05/18/2004US6736947 Sputtering target, A1 interconnection film, and electronic component
05/18/2004US6736946 Sputtering apparatus that allows the use of a shutter and shutter arm assembly that do not require long down time to transfer a wafer or shutter disk into the pasting or cleaning position
05/18/2004US6736945 Wafer plating apparatus
05/18/2004US6736931 Inductively coupled RF plasma reactor and plasma chamber enclosure structure therefor
05/18/2004US6736930 Microwave plasma processing apparatus for controlling a temperature of a wavelength reducing member
05/18/2004US6736929 Distributed control system for semiconductor manufacturing equipment
05/18/2004US6736928 Exposure apparatus and semiconductor device manufacturing method
05/18/2004US6736927 Apparatus for increased workpiece throughput
05/18/2004US6736926 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
05/18/2004US6736896 Gas spray arm for spin coating apparatus
05/18/2004US6736895 Silicon crystallization method
05/18/2004US6736894 Method of manufacturing compound single crystal
05/18/2004US6736893 Process for growing calcium fluoride monocrystals
05/18/2004US6736720 Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
05/18/2004US6736714 Endless belt comprising continuous textile fabric supporting a polishing layer comprising polymer for coating
05/18/2004US6736710 Polisher for polishing end surface of semiconductor wafer
05/18/2004US6736703 Cutting apparatus and cutting method
05/18/2004US6736699 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
05/18/2004US6736698 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
05/18/2004US6736665 Contact structure production method
05/18/2004US6736636 Thermal processor with gas supply
05/18/2004US6736582 Device for manipulating an object for loading and unloading a clean room
05/18/2004US6736556 Resist coating unit includes a cup surrounding a wafer held by a spin chuck; air blower
05/18/2004US6736386 Covered photomask holder and method of using the same