Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2013
12/04/2013CN102427064B Preparation method of gate-last two-transistor zero capacitor dynamic RAM
12/04/2013CN102421935B 锶钌氧化物界面 Strontium ruthenium oxide interface
12/04/2013CN102420189B Method for improving reliability of under-gate technology high-K gate dielectric medium CMOS (complementary metal oxide semiconductor)
12/04/2013CN102420188B Strain silicon technological manufacturing method for double-etching barrier layer technology
12/04/2013CN102420175B Method for adding contact hole etching process window by setting top etching barrier layer
12/04/2013CN102420165B Strain silicon process integration method for doubly-etching barrier layer technology
12/04/2013CN102420153B Method for judging whether hole depth and aperture morphology are normal or not
12/04/2013CN102420151B Detection method used for characterizing damage of low-dielectric material
12/04/2013CN102420148B Production process of aluminum pad based on polyimide matrix
12/04/2013CN102420132B Method for removing NiPt metallic silicide
12/04/2013CN102420126B All-wet process for improving integration of double-stress silicon nitride film and structure used in all-wet process
12/04/2013CN102420121B Processing method of titanium nitride film subjected to fluorine group plasma etching
12/04/2013CN102420116B Method for eliminating recess defect of gate electrode
12/04/2013CN102420113B Method for preventing photoetching machine from being stained by metal on back of silicon chip
12/04/2013CN102420107B Copper Damascus process MIM (metal-insulator-metal) capacitor manufacturing process and structure
12/04/2013CN102420106B Metal-insulator-metal capacitor structure and process for manufacturing metal-insulator-metal capacitor structure by adopting copper damascene process
12/04/2013CN102420104B Manufacturing method of MIM (Metal-Insulator-Metal) capacitor
12/04/2013CN102420100B Method for clearing memory effect of etching cavity
12/04/2013CN102412269B CMOS spacer structure and preparation method thereof
12/04/2013CN102412125B Method for manufacturing silicon nitride film with high tensile stress
12/04/2013CN102378462B Plasma processing apparatus
12/04/2013CN102376705B ESD protection device and method for fabricating the same, and integrated circuit
12/04/2013CN102361030B 一次性可编程存储单元阵列及其制造方法 A one-time programmable memory cell array and its manufacturing method
12/04/2013CN102354689B Quad flat non-lead (QFN) package with leads arranged in plane array and manufacturing method
12/04/2013CN102339756B Methods for modification and preparation of ZnO thin film transistor
12/04/2013CN102325739B Ceramic-metal junction and method of fabricating same
12/04/2013CN102315265B Semiconductor device and making method thereof
12/04/2013CN102308379B Colored ceramic vacuum chuck and manufacturing method thereof
12/04/2013CN102306209B Clocktree tuning shims and shim tuning method
12/04/2013CN102299171B Silicon nanowire apparatus compatible with complementary metal oxide semiconductor (CMOS) process and manufacturing method thereof
12/04/2013CN102299081B Method for manufacturing packaging substrate and packaging substrate
12/04/2013CN102292795B Device and method for coating a substrate using CVD
12/04/2013CN102290369B Thin GOI (germanium-on-insulator) wafer and preparation method thereof
12/04/2013CN102270603B Manufacturing method of silicon through hole interconnect structure
12/04/2013CN102268224B Chemical mechanical polishing liquid with controllable silicon oxide removal rate
12/04/2013CN102248241B Method for connecting bump bottom metal layer containing Co-based film with lead-free welding spot
12/04/2013CN102224579B Semiconductor device and electronic device
12/04/2013CN102224577B Composition for sealing semiconductor, semiconductor device, and process for manufacturing semiconductor device
12/04/2013CN102222657B Multi-ring-arranged double-integrated circuit (IC) chip packaging piece and production method thereof
12/04/2013CN102207655B Array substrate and manufacturing method thereof, and liquid crystal display device
12/04/2013CN102199404B Film-like circuit connecting material and connection structure for circuit member
12/04/2013CN102194875B Method and apparatus for forming semiconductor element
12/04/2013CN102187436B Pre-coating and wafer-less auto-cleaning system and method
12/04/2013CN102163574B Silicon-on-insulator device and manufacture method thereof
12/04/2013CN102160167B Electrostatic chuck assembly
12/04/2013CN102122635B Method for forming trench array
12/04/2013CN102117789B Semiconductor chip packaging structure and packaging method
12/04/2013CN102110645B Cleaning method used after chemical mechanical polishing
12/04/2013CN102110639B Method for preparing diffusion impervious layer
12/04/2013CN102097378B Method for manufacturing trench metal-oxide semiconductor field effect transistor (MOSFET)
12/04/2013CN102096327B Exposure device, exposure method and producing method of display panel substrate
12/04/2013CN102088002B Method for manufacturing memory device
12/04/2013CN102067288B Wire saw device and method for operating same
12/04/2013CN102056658B Light applying device and light applying method
12/04/2013CN102027588B Read-only memory with EEPROM structure
12/04/2013CN101996943B Method for separating material layer
12/04/2013CN101986429B Chip package and forming method thereof
12/04/2013CN101971371B Opto-electronic semiconductor chip and method for producing the same
12/04/2013CN101960630B Method of forming a magnetic tunnel junction structure
12/04/2013CN101960606B 碳化硅半导体器件及其制造方法 The silicon carbide semiconductor device and its manufacturing method
12/04/2013CN101923294B Composition for cleaning microelectronic substrates containing halogen oxygen acids, salts and derivatives thereof
12/04/2013CN101847597B 集成电路结构 Integrated circuit structure
12/04/2013CN101814911B Semiconductor component and method of determining temperature
12/04/2013CN101812677B Plasma-reinforced chemical vapor deposition process cavity
12/04/2013CN101770991B Nonvolatile memory of gate-distribution embedding type floating gate and manufacturing method thereof
12/04/2013CN101697346B Method for increasing length of effective channel of PMOS
12/04/2013CN101620352B Display substrate, method of manufacturing the same and display device having the same
12/04/2013CN101593703B Method for manufacturing metal oxide semiconductor field effect transistor and device thereof
12/03/2013US8601429 Method for connecting flip chip components
12/03/2013US8601405 Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
12/03/2013US8601332 Systems and methods for monitoring a memory system
12/03/2013US8600540 Methods for non-lot-based manufacturing of articles
12/03/2013US8600539 Substrate processing apparatus
12/03/2013US8600198 Semiconductor optical modulator, semiconductor optical integrated device, and method of manufacturing the same
12/03/2013US8599616 Three-dimensional NAND memory with stacked mono-crystalline channels
12/03/2013US8599531 Electrostatic end effector apparatus, systems and methods
12/03/2013US8598709 Method and system for routing electrical connections of semiconductor chips
12/03/2013US8598699 Semiconductor device having a ground metal layer through which at least one hole is formed, and a ground patch disposed in the at least one hole
12/03/2013US8598698 Package substrate with an embedded stiffener
12/03/2013US8598696 Multi-surface IC packaging structures
12/03/2013US8598694 Chip-package having a cavity and a manufacturing method thereof
12/03/2013US8598693 Die pad package with a concave portion in the sealing resin
12/03/2013US8598690 Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground
12/03/2013US8598681 Temperature switch with resistive sensor
12/03/2013US8598678 Parasitic vertical PNP bipolar transistor and its fabrication method in BiCMOS process
12/03/2013US8598677 Semiconductor device including metal lines
12/03/2013US8598675 Isolation structure profile for gap filling
12/03/2013US8598670 Semiconductor device with increased breakdown voltage
12/03/2013US8598663 Semiconductor structure having NFET and PFET formed in SOI substrate with underlapped extensions
12/03/2013US8598662 Semiconductor device and method for forming the same
12/03/2013US8598661 Epitaxial process for forming semiconductor devices
12/03/2013US8598654 MOSFET device with thick trench bottom oxide
12/03/2013US8598653 FinFET having cross-hair cells
12/03/2013US8598649 Nonvolatile semiconductor memory device and method for manufacturing same
12/03/2013US8598642 Very dense NVM bitcell
12/03/2013US8598623 Nanotube semiconductor devices and nanotube termination structures
12/03/2013US8598605 Semiconductor light-emitting device
12/03/2013US8598596 Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip
12/03/2013US8598595 Semiconductor device and method for manufacturing the same
12/03/2013US8598594 Semiconductor device and its fabrication method
1 ... 410 411 412 413 414 415 416 417 418 419 420 421 422 423 424 425 426 427 428 429 430 ... 6590