Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2013
12/04/2013CN103426778A Tamper resistant IC (integrated circuit)
12/04/2013CN103426777A Method for manufacturing electronic component, and electronic apparatus
12/04/2013CN103426776A Smart card carrier tape manufacturing method
12/04/2013CN103426775A Method for manufacturing semiconductor device
12/04/2013CN103426774A Substrate-bonding apparatus for display device and method for manufacturing bonded substrate
12/04/2013CN103426773A Manufacturing method of cooling fin
12/04/2013CN103426772A Method of forming finFET devices with alternative channel materials
12/04/2013CN103426771A Method of making an insulated gate semiconductor device having a shield electrode structure
12/04/2013CN103426770A Metal gate finFET device and method of fabricating same
12/04/2013CN103426769A Method for manufacturing semiconductor device
12/04/2013CN103426768A Method for manufacturing semiconductor device
12/04/2013CN103426767A Forming method of PMOS transistor
12/04/2013CN103426766A Pmos晶体管及其形成方法 Pmos transistor and method of forming
12/04/2013CN103426765A Forming method of semiconductor device and forming method of fin type field effect transistor
12/04/2013CN103426764A Forming method of transistor
12/04/2013CN103426763A Method for manufacturing transistor
12/04/2013CN103426762A Depletion transistor and manufacture method thereof
12/04/2013CN103426761A MOSFET element and preparation method
12/04/2013CN103426760A Manufacture technology of P-type LDMOS surface channel component
12/04/2013CN103426759A PLDMOS manufacturing method
12/04/2013CN103426758A Deep-exhausting channel field effect transistor and preparing method thereof
12/04/2013CN103426757A Omega-shaped fin type field effect crystal valve forming method
12/04/2013CN103426756A Semiconductor component and manufacture method thereof
12/04/2013CN103426755A Semiconductor component and forming method thereof
12/04/2013CN103426754A Method for forming transistor
12/04/2013CN103426753A Preparation method for source drain region and metal oxide semiconductor (MOS) device
12/04/2013CN103426752A Heater block and a substrate treatment apparatus
12/04/2013CN103426751A Semiconductor structure forming method
12/04/2013CN103426750A Metal wet etching method without metal wire cut problem
12/04/2013CN103426749A Method for forming opening and stacking structure
12/04/2013CN103426748A 光刻胶层去除方法及刻蚀装置 Etch photoresist layer removal method and apparatus
12/04/2013CN103426747A Method for controlling thickness of wafer oxidation layer generated in furnace tube
12/04/2013CN103426746A Substrate processing apparatus and substrate processing method
12/04/2013CN103426745A Method for forming semiconductor structure
12/04/2013CN103426744A Compositions and methods for texturing of silicon wafers
12/04/2013CN103426743A Method of dicing semiconductor wafer, and dicing tape for processing semiconductor using the same
12/04/2013CN103426742A Methods for forming semiconductor structure and transistor
12/04/2013CN103426741A Method for improving uniformity of thickness of side wall spacing nitride of gate electrode
12/04/2013CN103426740A Method for reducing ohmic contact resistance of high electronic-mobility transistor source drain region
12/04/2013CN103426739A Methods of forming semiconductor devices using pre-amorphization implants, and devices formed so
12/04/2013CN103426738A Trench semiconductor device with edge end portion structure and manufacturing method of trench semiconductor device
12/04/2013CN103426737A Method for manufacturing Damascus metal grid
12/04/2013CN103426736A Laser chemical order controllable preparation method of monocrystalline silicon inverted pyramid suede
12/04/2013CN103426735A Forming method of semiconductor structure and forming method of MOS transistor
12/04/2013CN103426734A Ion implantation method and device, field-effect tube manufacturing method and field-effect tube
12/04/2013CN103426733A Ultra-low-K dielectric layer treatment method
12/04/2013CN103426732A Low-temperature wafer bonding method and structure formed with method
12/04/2013CN103426731A Methods for forming a semiconductor device using masks with non-metallic portions
12/04/2013CN103426730A Method for improving Q value of inductor which is integrated passive device
12/04/2013CN103426729A Method for improving Q value of inductor which is integrated passive device
12/04/2013CN103426728A 电容器结构及其制作方法 Capacitor structure and manufacturing method thereof
12/04/2013CN103426727A Split-grid resistor structure and manufacturing method thereof
12/04/2013CN103426726A Spalling method utilizing stressor layer portions
12/04/2013CN103426725A Layered bonded structures formed from reactive bonding of zinc metal and zinc peroxide
12/04/2013CN103426724A Method and apparatus for adjusting wafer warpage
12/04/2013CN103426723A Method for improving gap filling capability
12/04/2013CN103426722A Processing method for substrate
12/04/2013CN103426721A Method for processing a wafer at unmasked areas and previously masked areas
12/04/2013CN103426452A Memory cascade and packaging methods, and device thereof
12/04/2013CN103425066A Wafer batch operation dynamic processing system and method
12/04/2013CN103424991A Silicon wafer linear exchange device and method
12/04/2013CN103424945A Liquid crystal display panel and manufacturing method of TFT (Thin Film Transistor) array substrate of liquid crystal display panel
12/04/2013CN103423649A LED (Light-Emitting Diode) lamp bead string free of divider resistance
12/04/2013CN103422069A Low K precursors having superior integration attributes
12/04/2013CN103419121A Magnetic suspension polishing device based on monitorable temperature
12/04/2013CN103418908A 改性层形成方法 The method for forming the modified layer
12/04/2013CN103418592A Upper pressure roller assembly
12/04/2013CN103418574A Ultrasonic cleaning method and ultrasonic cleaning apparatus
12/04/2013CN103418558A 基板清洗方法 Substrate cleaning method
12/04/2013CN103418551A Pick and place apparatus for test handler
12/04/2013CN102884632B Contact structure, substrate, display device, and processes for producing contact structure and substrate
12/04/2013CN102822401B Method for assembling at least one chip using fabric, and fabric including chip device
12/04/2013CN102509717B Solar battery recovery decomposition device and its rotation balance disk
12/04/2013CN102509709B Point measurement device for LED (light-emitting diode) crystalline grain point measurement equipment
12/04/2013CN102496594B Lifting and putting suction nozzle suitable for light and lamellate component
12/04/2013CN102487038B 铜互连结构及其形成方法 Copper interconnect structure and method of forming
12/04/2013CN102479921B Manufacture method of phase change memory
12/04/2013CN102479748B Forming method of semiconductor device
12/04/2013CN102479745B Field plate metal preparation method suitable for gallium nitride monolithic microwave integrated circuit (GaN MMIC)
12/04/2013CN102479688B Method of wafer surface photoresistance edge removal
12/04/2013CN102479682B Method of lift off and manufacturing method of TFT array substrate
12/04/2013CN102468206B Wafer base, and using and cleaning method thereof
12/04/2013CN102468152B Manufacturing method of gate medium layer and transistor
12/04/2013CN102468150B Method for forming semiconductor device
12/04/2013CN102468146B Method for forming metal gates
12/04/2013CN102446895B Metal-oxide-metal capacitor and manufacturing method thereof
12/04/2013CN102446882B Semiconductor PiP (package in package) system structure and manufacturing method thereof
12/04/2013CN102446858B Gate oxide precleaning method used for improving performance of floating body dynamic random access memory unit
12/04/2013CN102446857B Silicide mask etching method for enhancing performances of semiconductor device
12/04/2013CN102446844B Method for filling silicon through hole with conductive polymer gel
12/04/2013CN102446810B Method for forming shallow trench isolation
12/04/2013CN102446786B Device monitoring method during semiconductor process
12/04/2013CN102446769B Method used for reducing resistance of polysilicon gate in carbon auxiliary injection technological process
12/04/2013CN102446712B Method for increasing double patterning process windows
12/04/2013CN102446710B Method for manufacturing multilayer metal-silicon nitride-metal capacitor
12/04/2013CN102439724B Ferro-resistive random access memory (ferro-rram), operation method and manufacturing mehtod thereof
12/04/2013CN102437094B Method for improving etching of through holes in double-through-hole etching stop layer crossover region
12/04/2013CN102437091B Copper subsequent interconnection technique using metallic copper alloy as etching barrier layer
12/04/2013CN102437024B Method for manufacturing multilayer metal-silicon oxide-metal (MOM) capacitor
12/04/2013CN102427065B One transistor dynamic random access memory (1T-DRAM) preparation method based on GIDL effect
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