Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2007
04/03/2007US7198447 Semiconductor device producing apparatus and producing method of semiconductor device
04/03/2007US7198276 Adaptive electrostatic pin chuck
04/03/2007US7198141 Shock absorbing apparatus in a positioning apparatus
04/03/2007US7198055 Meniscus, vacuum, IPA vapor, drying manifold
04/03/2007US7197817 Method for forming contact bumps for circuit board
03/2007
03/29/2007WO2007035788A2 DENSE CHEVRON finFET AND METHOD OF MANUFACTURING SAME
03/29/2007WO2007035761A2 Planarization of metal layer over photoresist
03/29/2007WO2007035731A2 Defectivity and process control of electroless deposition in microelectronics applications
03/29/2007WO2007035660A1 Method to form a device on a soi substrate
03/29/2007WO2007035442A2 Conductive silicone and methods for preparing same
03/29/2007WO2007035423A2 Method and apparatus for vertically orienting substrate processing tools in a clean space
03/29/2007WO2007035398A2 Control of strain in device layers by selective relaxation and prevention of relaxation
03/29/2007WO2007035333A1 Methods of processing semiconductor wafers having silicon carbide power devices thereon
03/29/2007WO2007035304A1 Methods of forming sic mosfets with high inversion layer mobility
03/29/2007WO2007035245A1 Spacers between bitlines in virtual ground memory array
03/29/2007WO2007035200A2 Improved, higher selectivity, method for passivating short circuit current paths in semiconductor devices
03/29/2007WO2007035097A2 Device and method for separating electronic components
03/29/2007WO2007035071A1 Apparatus and method for treating substrate
03/29/2007WO2007035050A1 Sputtering deposition device
03/29/2007WO2007035041A1 Method of and apparatus for fabricating thermal oxide film using single chamber-type cvd apparatus
03/29/2007WO2007035024A1 Wafer map loading to own wafer
03/29/2007WO2007034980A1 Polymer material, foam obtained from same, and polishing pad using those
03/29/2007WO2007034957A1 Substrate processing device
03/29/2007WO2007034929A1 Method for cutting solid-state image pickup device
03/29/2007WO2007034902A1 Resin composition, varnish, resin film and semiconductor device
03/29/2007WO2007034893A1 Pasty metal particle composition, method of hardening pasty metal particle composition, method of bonding metal member, process for producing printed wiring board
03/29/2007WO2007034871A1 Selective plasma processing method
03/29/2007WO2007034863A1 Wafer inspecting apparatus, wafer inspecting method and computer program
03/29/2007WO2007034838A1 Exposure device, exposure method, and device fabrication method
03/29/2007WO2007034791A1 Solder layer, heat sink using such solder layer and method for manufacturing such heat sink
03/29/2007WO2007034764A1 Noncontact information storage medium and method for manufacturing same
03/29/2007WO2007034761A1 Semiconductor device and method for fabrication thereof
03/29/2007WO2007034718A1 Semiconductor device
03/29/2007WO2007034707A1 Heat treatment apparatus, computer program and storage medium
03/29/2007WO2007034659A1 Electron beam exposure system, and method for cleaning electron beam exposure system
03/29/2007WO2007034654A1 Cover body for thin-sheet supporting container
03/29/2007WO2007034624A1 Method for treating substrate and recording medium
03/29/2007WO2007034604A1 Negative photosensitive resin composition, method of pattern forming and electronic part
03/29/2007WO2007034596A1 Active matrix substrate, display, television set, method for producing active matrix substrate, and method for manufacturing display
03/29/2007WO2007034553A1 Semiconductor device and its fabrication method
03/29/2007WO2007034548A1 Signal transmission circuit, semiconductor device containing the signal transmission circuit, method for designing the semiconductor circuit device, and cad device for realizing the design method
03/29/2007WO2007034540A1 Power supply voltage adjusting device
03/29/2007WO2007034534A1 Semiconductor device manufacturing method and semiconductor manufacturing apparatus
03/29/2007WO2007034304A1 Point-of-use process control blender systems and corresponding methods
03/29/2007WO2007034117A2 Electroplating method for coating a substrate surface with a metal
03/29/2007WO2007034116A2 Electroplating composition for coating a substrate surface with a metal
03/29/2007WO2007033701A1 Method and device for depositing electronic components on a substrate
03/29/2007WO2007033692A1 High-voltage transistor and method for its manufacture
03/29/2007WO2007019002A3 Methods for fabricating a stressed mos device
03/29/2007WO2007019002A2 Methods for fabricating a stressed mos device
03/29/2007WO2007016699A3 Method and system for debug and test using replicated logic
03/29/2007WO2007015938A3 Method for patterning an underbump metallizattion layer using a dry etc process
03/29/2007WO2007013009A3 Thin film circuits having transistors comprising a light shield
03/29/2007WO2007006166A3 Device for storing substrates
03/29/2007WO2007005642A3 Electrical components and method of manufacture
03/29/2007WO2007002689A3 Semiconductor device having firmly secured heat spreader
03/29/2007WO2007002603A3 Optically-triggered power system and devices
03/29/2007WO2007000683A3 Bipolar transistor and method op manufacturing the same
03/29/2007WO2006138492A3 Post & penetration interconnection
03/29/2007WO2006135237A3 Device and method for processing electronic components with a double cutting flow
03/29/2007WO2006134206A3 Functionalized silane monomers with bridging hydrocarbon group and siloxane polymers of the same
03/29/2007WO2006127787A3 A method of seating an electronic component and an electronic component handler
03/29/2007WO2006127334A3 Integrated circuit with silicon oxycarbonitride interconnect
03/29/2007WO2006116770A3 Method of passivating chemical mechanical polishing compositions for copper film planarization processes
03/29/2007WO2006112964A3 Method of forming trench isolation in a semiconductor device
03/29/2007WO2006109221A3 Lateral bipolar transistor
03/29/2007WO2006104937A3 Building fully-depleted and partially-depleted transistors on same chip
03/29/2007WO2006066962A3 Selective oxidation and selective etching of allnn layers for manufacturing group iii nitride semiconductor devices
03/29/2007WO2006063007A3 Method and system for providing a highly textured magnetoresistance element and magnetic memory
03/29/2007WO2006009881A3 Process and apparatus for forming nanoparticles using radiofrequency plasmas
03/29/2007WO2005111267A3 Gas distribution member supplying process gas and rf power for plasma processing
03/29/2007WO2005079308A3 One dimensional nanostructures for vertical heterointegration on a silicon platform and method for making same
03/29/2007WO2005074449A3 Structure comprising amorphous carbon film and method of forming thereof
03/29/2007WO2004095527A3 Method for fabricating dual-metal gate device
03/29/2007US20070072995 Thermoplastic resin composition with improved properties
03/29/2007US20070072782 Unsaturated dicarboxylic acid and ethylene urea containing formulation for cleaning semiconductor and cleaning method
03/29/2007US20070072478 Semiconductor device
03/29/2007US20070072439 Semiconductor device and manufacturing method thereof
03/29/2007US20070072438 Method of forming an oxide layer
03/29/2007US20070072437 Method for forming narrow structures in a semiconductor device
03/29/2007US20070072436 Substrate processing apparatus and substrate processing method
03/29/2007US20070072435 Method for plasma etching a chromium layer through a carbon hard mask suitable for photomask fabrication
03/29/2007US20070072434 Method and system for operating a physical vapor deposition process
03/29/2007US20070072433 Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor
03/29/2007US20070072432 Apparatus for the removal of a metal oxide from a substrate and methods therefor
03/29/2007US20070072431 Method for cleaning substrate having exposed silicon and silicon germanium layers and related method for fabricating semiconductor device
03/29/2007US20070072430 Method of manufacturing semiconductor device
03/29/2007US20070072429 Pattern enhancement by crystallographic etching
03/29/2007US20070072428 Method for manufacturing a micro-electro-mechanical structure
03/29/2007US20070072427 Method for fabricating semiconductor device and polishing method
03/29/2007US20070072426 Chemical mechanical polishing process and apparatus therefor
03/29/2007US20070072425 Substrate and method for producing same
03/29/2007US20070072424 Method of manufacturing silicon rich oxide (SRO) and semiconductor device employing SRO
03/29/2007US20070072423 Unpolished semiconductor wafer and method for producing an unpolished semiconductor wafer
03/29/2007US20070072422 Hydrogen treatment to improve photoresist adhesion and rework consistency
03/29/2007US20070072421 Method to passivate defects in integrated circuits
03/29/2007US20070072420 Method of forming copper interconnection using dual damascene process and semiconductor device having copper interconnection according to the same
03/29/2007US20070072419 Chip, ship stack, and method of manufacturing the same
03/29/2007US20070072418 Method of forming tungsten silicide layer and method of fabricating semiconductor element using same
03/29/2007US20070072417 Method for forming wiring structure, wiring structure, method for forming semiconductor device, and display device
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