Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/29/2007DE10306310B4 Dual-Gateoxid-Verfahren ohne kritischen Resist und ohne N2-Implantierung Dual gate oxide process without critical resist and without N2-implantation
03/29/2007DE10234488B4 Verfahren zur Herstellung einer lokalisierten Implantationsbarriere in einer Polysiliziumleitung A process for producing a localized implantation barrier in a polysilicon line
03/29/2007DE10232425B4 Halbleiterelement Semiconductor element
03/29/2007DE10214702B4 Verfahren zur Herstellung von Elektroden auf einem Halbleitersubstrat A process for the manufacture of electrodes on a semiconductor substrate
03/29/2007DE102006043360A1 Halbleitervorrichtung mit dreidimensionalem Aufbau und Verfahren zu ihrer Herstellung A semiconductor device having three-dimensional structure and process for their preparation
03/29/2007DE102006042282A1 Halbleiterbauteil und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
03/29/2007DE102006037722A1 Verdrahtungsstruktur für einen integrierten Schaltkreis und Verfahren zur Herstellung derselben Wiring structure for an integrated circuit and method of manufacturing the same
03/29/2007DE102006036797A1 Einzel-Damascene mit Einwegschablone und Verfahren dafür Single damascene with disposable mask and method therefor
03/29/2007DE102006005645A1 Stapelbarer Baustein, Bausteinstapel und Verfahren zu deren Herstellung Stackable building block, block stack and processes for their preparation
03/29/2007DE102005047567B3 Power semiconductor module comprises a housing, connecting elements and an electrically insulated substrate arranged within the housing and semiconductor components with a connecting element and an insulating molded body
03/29/2007DE102005046216A1 Distributing device used in the photovoltaic industry for sorting silicon wafers comprises an eccentric unit for lifting a wafer/cell via an electric motor drive
03/29/2007DE102005046057A1 Process to manufacture e.g. a 'silicon/semiconductor on insulator' by transfer of donor substrate to mono-crystalline structure on an acceptor substrate
03/29/2007DE102005045636A1 Halbleiterspeicherbauelement und Herstellungsverfahren The semiconductor memory device and manufacturing method
03/29/2007DE102005045613A1 Method of preparing SiC semiconductor elements having predetermined number of individual functional elements useful for elements subjected to very high temperatures and stringent environmental conditions, of electrically insulating film
03/29/2007DE102005045375A1 New hydroxyperylene-bisimide-, aliphatic ether and aliphatic N-substituted perylene-lactamimide dyes, useful e.g. as intercalating or fluorescent dyes, pigments, tracers or starting materials for organic superconductor or in data storage
03/29/2007DE102005045100A1 Verfahren zum Herstellen eines Leistungshalbleitermoduls Method for producing a power semiconductor module
03/29/2007DE102005045097A1 Charge-Trapping-Speicherbauelement und Herstellungsverfahren Charge-trapping memory device and manufacturing method
03/29/2007DE102005045080A1 Device for temperature stabilization of substrates, especially of thin curved wafers, has fluid supply connection, and fluid flow channel formed in main body
03/29/2007DE102005045056A1 Integrierte Schaltungsanordnung mit mehreren Leitstrukturlagen und Kondensator An integrated circuit device having a plurality of conductive structure and capacitor
03/29/2007DE102005044425A1 Transportvorrichtung für ein flexibles Trägerband Transport device for a flexible carrier tape
03/29/2007DE102005044216A1 Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module,
03/29/2007DE102005044165A1 Power-switching semiconductor component for e.g. three phase motor control, includes laterally-adjacent junction and regions of varied doping
03/29/2007DE102005044124A1 Verfahren zur Herstellung einer integrierten Schaltung mit Gate-Selbstschutz, und integrierte Schaltung mit Gate-Selbstschutz A method of fabricating an integrated circuit with self-protection gate, and an integrated circuit with gate self-protection
03/29/2007DE102005043808A1 Außenkontaktmaterial für Außenkontakte eines Halbleiterbauteils und Verwendung des Außenkontaktmaterials External contact material for external contacts of a semiconductor device and use of outer contact material
03/29/2007DE102005042868A1 Field effect power component comprises a field effect element and an integral complementary metal oxide semiconductor structure surrounded by an outer trench structure
03/29/2007DE102005042754A1 Selective plasma treatment of semiconductor substrate, as pre-treatment prior to of coating or prior to bonding process useful for semiconductor involves dielectric, e.g. glass mask having surface coated with electrically conductive layer
03/29/2007DE102005041099A1 LED-Chip mit Glasbeschichtung und planarer Aufbau- und Verbindungstechnik LED chip with glass coating and planar packaging technology
03/29/2007DE102005039479B3 Halbleiterbauteil mit gedünntem Halbleiterchip und Verfahren zur Herstellung des gedünnten Halbleiterbauteils A semiconductor device comprising gedünntem semiconductor chip and method for producing the thinned semiconductor component
03/29/2007DE102005027713B4 Halbleiterspeicherbauelement und Herstellungsverfahren The semiconductor memory device and manufacturing method
03/29/2007DE102005016411B4 Vorrichtung zur hochgenauen Oberflächenbearbeitung eines Werkstückes The high-precision surface machining of a workpiece
03/29/2007DE102005005732B4 Verfahren zur Herstellung eines Speicherkondensators sowie einer flaschenförmig geätzten Struktur Process for the preparation of a storage capacitor as well as a bottle-shaped structure etched
03/29/2007DE102004030813B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement
03/29/2007DE102004030122B4 Verfahren zum Charakterisieren einer auf einem Tägersubstrat ausgebildeten regelmäßigen Struktur A method for characterizing a regular structure formed on a Tägersubstrat
03/29/2007DE102004005697B4 Herstellungsverfahren für eine widerstandsfähige Via-Struktur und zugehörige Via-Struktur Production method for a durable via structure and associated via structure
03/29/2007CA2622918A1 Electroplating method for coating a substrate surface with a metal
03/29/2007CA2622917A1 Electroplating composition for coating a substrate surface with a metal
03/28/2007EP1768480A1 Device to orient a supporting plate with respect to a plurality of axes
03/28/2007EP1768194A2 Method of manufacturing nitride semiconductor device
03/28/2007EP1768188A1 Electronic device manufacturing method and electronic device
03/28/2007EP1768185A1 Process for producing simox substrate and simox substrate produced by the process
03/28/2007EP1768183A2 Microdevices with bump contacts on two sides and manufacturing method thereof
03/28/2007EP1768181A1 Nitride semiconductor substrate, and method for working nitride semiconductor substrate
03/28/2007EP1768177A2 Method of manufacturing semiconductor chip
03/28/2007EP1768176A2 Method of producing a thin layer of semiconductor material
03/28/2007EP1768175A1 Method for forming trench isolation structure
03/28/2007EP1768174A1 Robotized device to move an object
03/28/2007EP1768173A1 Method for evaluating soi wafer
03/28/2007EP1768172A1 Projection optical system, exposure device, and exposure method
03/28/2007EP1768171A1 Exposure apparatus, exposure method, and device producing method
03/28/2007EP1768170A1 Exposure equipment, exposure method and device manufacturing method
03/28/2007EP1768169A1 Exposure apparatus, exposure method, and device producing method
03/28/2007EP1768168A2 Method of resin seal moulding electronic component and apparatus therefor
03/28/2007EP1768167A2 Method of resin-seal molding electronic component and apparatus therefor.
03/28/2007EP1768166A2 Method of resin-seal molding electronic component and apparatus therefor
03/28/2007EP1767989A1 Method of forming graft pattern, graft pattern material, method of lithography, method of forming conductive pattern, conductive pattern, process for producing color filter, color filter and process for producing microlens
03/28/2007EP1767978A1 Optical system, exposing apparatus and exposing method
03/28/2007EP1767602A2 Metal-polishing liquid and chemical-mechanical polishing method
03/28/2007EP1767491A1 Method for manufacturing nanostructure and nanostructure
03/28/2007EP1766691A2 Selective implementation of barrier layers to achieve threshold voltage control in cmos device fabrication with high k dielectrics
03/28/2007EP1766679A2 Method for improving heat dissipation in encapsulated electronic components
03/28/2007EP1766678A1 Method for manufacturing an electric device with a layer of conductive material contacted by nanowire
03/28/2007EP1766677A1 ISOLATION STRUCTURE FOR A MEMORY CELL USING Al2O3 DIELECTRIC
03/28/2007EP1766676A1 Hybrid epitaxy support and method for making same
03/28/2007EP1766675A1 Method of manufacture of electronic or functional devices
03/28/2007EP1766674A2 Method and device for the alternate contacting of two wafers
03/28/2007EP1766673A1 Methods of forming lead free solder bumps and related structures
03/28/2007EP1766672A2 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same
03/28/2007EP1766671A1 Method of making mirror image memory cell transistor pairs featuring poly floating spaces
03/28/2007EP1766670A2 Method and forming a semiconductor device having air gaps and the structure so formed
03/28/2007EP1766669A1 Reactive fluid systems for removing deposition materials and methods for using same
03/28/2007EP1766668A1 Formation of active area using semiconductor growth process without sti integration
03/28/2007EP1766667A1 METHOD FOR MATERIAL GROWTH OF GaN-BASED NITRIDE LAYER
03/28/2007EP1766666A2 High density bonding of electrical devices
03/28/2007EP1766665A2 Improved method and apparatus for the etching of microstructures
03/28/2007EP1766664A1 Stackable tray for integrated circuit chips
03/28/2007EP1766663A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
03/28/2007EP1766427A1 Substrate with patterned conductive layer
03/28/2007EP1766108A1 Formation of nanowhiskers on a substrate of dissimilar material
03/28/2007EP1766103A2 Method and system for supplying carbon dioxide
03/28/2007EP1639157B1 Method of synthesising a crystalline material and material thus obtained
03/28/2007EP1620891A4 Multi-height finfets
03/28/2007EP1617957A4 Ultra low k (ulk) sicoh film and method
03/28/2007EP1608575B1 Device for producing a predetermined orientation
03/28/2007EP1590510B1 Device for producing electroconductive passages in a semiconductor wafer by means of thermomigration
03/28/2007EP1569867B1 Method of manufacturing metallised nanoparticles and nanoscopic structures
03/28/2007EP1540423B1 Grating based spectral filter for eliminating out of band radiation in an extreme ultra-violet lithography system
03/28/2007EP1518281B1 Buffer layers for organic electroluminescent devices and methods of manufacture and use
03/28/2007EP1428248A4 Self-aligned transistor and diode toplogies in silicon carbide through the use of selective epitaxy or selective implantation
03/28/2007EP1399953B1 Opto-electronic device integration
03/28/2007EP1364076B1 Device and method for supplying a cvd reactor with a liquid starting material entering into a gaseous phase
03/28/2007EP1352417B1 Device for the plasma-mediated working of surfaces on planar substrates
03/28/2007EP0777910B1 Process for manufacture of mos gated device with reduced mask count
03/28/2007CN2884528Y Clamp group for producing LED
03/28/2007CN2884527Y Precision ceramic packed hot pressing head for making COG
03/28/2007CN2884263Y Apparatus for making photon crystal mask layer on light-emitting diode
03/28/2007CN2882878Y Ultrasonic welding line appts.
03/28/2007CN1939108A Mounting system for high-mass heatsinks
03/28/2007CN1938901A 半导体器件 Semiconductor devices
03/28/2007CN1938871A 半导体发光器件 Semiconductor light emitting device
03/28/2007CN1938870A Phosphor and blends thereof for use in LED
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