Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/29/2007US20070072416 Method of forming a low resistance semiconductor contact and structure therefor
03/29/2007US20070072415 Method for integrating a ruthenium layer with bulk copper in copper metallization
03/29/2007US20070072414 Method for controlling the step coverage of a ruthenium layer on a patterned substrate
03/29/2007US20070072413 Methods of forming copper interconnect structures on semiconductor substrates
03/29/2007US20070072412 Preventing damage to interlevel dielectric
03/29/2007US20070072411 Method for forming metal line in semiconductor device
03/29/2007US20070072410 Method of forming copper interconnection using dual damascene process
03/29/2007US20070072409 Reflector with non-uniform metal oxide layer surface
03/29/2007US20070072408 Fabrication Method of Semiconductor Integrated Circuit Device
03/29/2007US20070072407 Method of fabricating self-aligned contact pad using chemical mechanical polishing process
03/29/2007US20070072406 Methods of forming integrated circuit devices having metal interconnect structures therein
03/29/2007US20070072405 Semiconductor device and method for manufacturing the same
03/29/2007US20070072404 Phase-change optical disk
03/29/2007US20070072403 Semiconductor device and method for fabricating the same
03/29/2007US20070072402 Method of fabricating semiconductor devices and method of removing a spacer
03/29/2007US20070072401 Method for purifying a metal carbonyl precursor
03/29/2007US20070072400 Apparatus and methods for thermally processing undoped and lightly doped substrates without pre-heating
03/29/2007US20070072399 Semiconductor Devices Having Epitaxial Layers with Suppressed Lateral Growth and Related Methods of Manufacturing Such Devices
03/29/2007US20070072398 Method for manufacturing semiconductor device and epitaxial growth equipment
03/29/2007US20070072397 Semiconductor device, method for manufacturing the same and method for evaluating the same
03/29/2007US20070072396 Method of producing self supporting substrates comprising iii-nitrides by means of heteroepitaxy on a sacrificial layer
03/29/2007US20070072395 Substrate and method of separating components from a substrate
03/29/2007US20070072394 Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device
03/29/2007US20070072393 Method for preparing and assembling substrates
03/29/2007US20070072392 Method of cleaning cover glass having spacer
03/29/2007US20070072391 Method of sealing two plates with the formation of an ohmic contact therebetween
03/29/2007US20070072390 Techniques for removal of photolithographic films
03/29/2007US20070072389 Method for fabricating semiconductor device having taper type trench
03/29/2007US20070072388 Bottle-shaped trench and method of fabricating the same
03/29/2007US20070072387 Method of fabricating shallow trench isolation structure
03/29/2007US20070072386 Method of forming an alignment key having a capping layer and method of fabricating a semiconductor device using the same
03/29/2007US20070072385 Electrical Open/Short Contact Alignment Structure for Active Region vs. Gate Region
03/29/2007US20070072384 Plastically deformable irreversible storage medium and method of producing one such medium
03/29/2007US20070072383 Phosphorus Activated NMOS Using SiC Process
03/29/2007US20070072382 Method of manufacturing semiconductor device
03/29/2007US20070072381 Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN, SiCN or SiOCN
03/29/2007US20070072380 Methods for fabrication of a stressed MOS device
03/29/2007US20070072379 MOS transistor and manufacturing method thereof
03/29/2007US20070072378 Method of manufacturing metal-oxide-semiconductor transistor devices
03/29/2007US20070072377 Process of making a III-V compound semiconductor heterostructure MOSFET
03/29/2007US20070072376 Strained-induced mobility enhancement nano-device structure and integrated process architecture for CMOS technologies
03/29/2007US20070072375 Method for manufacturing semiconductor device
03/29/2007US20070072374 Semiconductor device
03/29/2007US20070072373 Fabrication method of an non-volatile memory
03/29/2007US20070072372 Method for forming metal line in flash memory device
03/29/2007US20070072371 Semiconductor device and method for fabricating the same
03/29/2007US20070072370 Non-volatile memory and fabricating method thereof
03/29/2007US20070072369 Non-volatile memory and fabricating method thereof
03/29/2007US20070072368 Method of cleaning semiconductor surfaces
03/29/2007US20070072367 Method of manufacturing semiconductor silicon substrate
03/29/2007US20070072366 Transistor structure for semiconductor device and method of fabricating the same
03/29/2007US20070072365 Methods of forming a recessed gate
03/29/2007US20070072364 Method for fabricating transistor gate structures and gate dielectrics thereof
03/29/2007US20070072363 Method for fabricating transistor gate structures and gate dielectrics thereof
03/29/2007US20070072362 Solid electrolytic capacitor, fabrication method thereof, and coupling agent utilizing in the same
03/29/2007US20070072361 Method of reducing current leakage in a metal insulator metal semiconductor capacitor and semiconductor capacitor thereof
03/29/2007US20070072360 Method for using a memory cell comprising switchable semiconductor memory element with trimmable resistance
03/29/2007US20070072359 Semiconductor device, the method of manufacturing the same, and two-way switching device using the semiconductor devices
03/29/2007US20070072358 Method of manufacturing metal-oxide-semiconductor transistor devices
03/29/2007US20070072357 Method of manufacturing devices having vertical junction edge
03/29/2007US20070072356 Method for reducing positive charges accumulated on chips during ion implantation
03/29/2007US20070072355 Method of manufacturing semiconductor device
03/29/2007US20070072354 Structures with planar strained layers
03/29/2007US20070072353 Method of fabricating strained-silicon transistors and strained-silicon CMOS transistors
03/29/2007US20070072352 Insulated gate field effect transistor and manufacturing method thereof
03/29/2007US20070072351 Method of fabricating semiconductor device
03/29/2007US20070072350 Method of manufacturing semiconductor device
03/29/2007US20070072349 Manufacturing method of a display device
03/29/2007US20070072348 Method of manufacturing an amoled
03/29/2007US20070072347 Method of assembly for multi-flip chip on lead frame on overmolded ic package
03/29/2007US20070072346 Method of resin-seal-molding electronic component and apparatus therefor
03/29/2007US20070072345 Semiconductor device and method for manufacturing the same
03/29/2007US20070072344 Gel package structural enhancement of compression system board connections
03/29/2007US20070072343 Semiconductor constructions comprising multi-level patterns of radiation-imageable material
03/29/2007US20070072342 Depopulation of a ball grid array to allow via placement
03/29/2007US20070072341 Die package and method for making the same
03/29/2007US20070072340 Electronic Device with Inductor and Integrated Componentry
03/29/2007US20070072339 Process for fabricating chip package structure
03/29/2007US20070072338 Method for separating package of WLP
03/29/2007US20070072334 Semiconductor fabrication process employing spacer defined vias
03/29/2007US20070072333 Reduced barrier photodiode / gate device structure for high efficiency charge transfer and reduced lag and method of formation
03/29/2007US20070072332 Semiconductor radiation detectors and method for fabrication thereof
03/29/2007US20070072331 Method for manufacturing a micro-electro-mechanical device
03/29/2007US20070072330 Wafer bonding compatible with bulk micro-machining
03/29/2007US20070072329 Method and apparatus for manufacturing a display apparatus
03/29/2007US20070072328 Method and system for hermetically sealing packages for optics
03/29/2007US20070072327 Method of Forming an Integrated MEMS Resonator
03/29/2007US20070072326 Photodiode for multiple wavelength operation
03/29/2007US20070072325 Self-aligned photodiode for CMOS image sensor and method of making
03/29/2007US20070072324 Substrate for growing a III-V light emitting device
03/29/2007US20070072323 Method of manufacturing display panel for flexible display device
03/29/2007US20070072322 Methods for patterning films, fabricating organic electroluminescence display and fabricating thin film transistor array substrate
03/29/2007US20070072321 Device package and methods for the fabrication and testing thereof
03/29/2007US20070072320 Process for producing an epitalixal layer of galium nitride
03/29/2007US20070072319 Integrated circuit capacitor structure
03/29/2007US20070072318 Method For Predicting The Formation Of Silicon Nanocrystals In Embedded Oxide Matrices
03/29/2007US20070072317 Method for Predicting Contributions of Silicon Interstitials to N-Type Dopant Transient Enhanced Diffusion During a PN Junction Formation
03/29/2007US20070072316 Wiring pattern determination method and computer program product thereof
03/29/2007US20070072315 Method and system for reliability similarity of semiconductor devices
03/29/2007US20070072314 Method of preparing an integrated circuit die for imaging
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