Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/21/2014CN103811304A GeSn层及其形成方法 GeSn layer and method for forming
05/21/2014CN103811303A 一种台阶封装基板台阶处垫平制作方法 One kind of stairs at the step pad level package substrate production methods
05/21/2014CN103811302A 基板处理方法以及基板处理装置 A substrate processing method and substrate processing apparatus
05/21/2014CN103811301A 晶圆的加工方法及通过该晶圆的加工方法得到的晶圆 A wafer processing method and obtained by a wafer processing method of the wafer
05/21/2014CN103811300A 真空装置、其压力控制方法和蚀刻方法 The vacuum apparatus, the pressure control method and an etching method
05/21/2014CN103811299A 电容结构及其制造过程 Capacitor structure and the manufacturing process
05/21/2014CN103811298A 测试对准使用芯片的制作方法 Production method of testing the alignment using chips
05/21/2014CN103811297A 一种化学液供给装置 A chemical liquid supply apparatus
05/21/2014CN103811296A 关键尺寸控制系统 Critical dimension control system
05/21/2014CN103811295A 一种针对背镀芯片的清洗工艺 A back-plated chip cleaning process for
05/21/2014CN103811294A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/21/2014CN103811293A 晶圆背面金属化的方法 Backside metallization method
05/21/2014CN103811292A 硅片加工处理系统及处理方法 Wafer processing systems and treatment methods
05/21/2014CN103811291A 一种阵列基板制作方法、膜层刻蚀防损伤监控方法及设备 An arrayed substrate fabrication method, the anti-etching film damage monitoring method and apparatus
05/21/2014CN103811290A 一种液体喷洒回收装置 A liquid spray recovery
05/21/2014CN103811263A 等离子体约束装置及具有其的等离子体处理装置 Plasma confinement apparatus and a plasma processing apparatus having the same
05/21/2014CN103811260A 一种等离子反应器及其处理方法 A plasma reactor and processing methods
05/21/2014CN103811258A 等离子体反应腔 Plasma reaction chamber
05/21/2014CN103811255A 离子注入装置及离子注入方法 Means of ion implantation and ion implantation method
05/21/2014CN103810968A 用于改进amoled驱动的设备和方法 Improved apparatus and method for driving amoled
05/21/2014CN103809525A 一种自动粘片机三维运动焊头的控制系统和控制方法 An automatic three-dimensional motion stick welding head machine control systems and control methods
05/21/2014CN103809370A 使用定向自组装的光刻工艺 Using a photolithography process directed self-assembly
05/21/2014CN103809340A 边缘场切换模式液晶显示装置的阵列基板及其制造方法 Method of manufacturing an array substrate and the edge of the field switching mode LCD
05/21/2014CN103808255A 裸片位置判定系统 Die position determination system
05/21/2014CN103806104A 一种高Al组分AlGaN薄膜的制备方法 Method for preparing high Al content AlGaN films
05/21/2014CN103806095A 行星式旋转托盘装置 Planetary rotary tray unit
05/21/2014CN103806093A 基于icp的化合物半导体的外延生长装置及方法 Epitaxial growth on a compound semiconductor device and method of icp
05/21/2014CN103806030A 一种阶段性电镀工艺电镀铜方法 A stage copper plating process plating method
05/21/2014CN103806000A 刻蚀剂组合物、阵列基板以及制造阵列基板的方法 The etching agent composition and a method of manufacturing an array substrate, the array substrate
05/21/2014CN103805997A 湿式蚀刻方法与基板承载装置 Wet etching method and the substrate carrying device
05/21/2014CN103805968A 等离子体处理装置和等离子体产生装置 The plasma processing apparatus and a plasma generating means
05/21/2014CN103805077A 连接构造体的制造方法及连接方法 The method of manufacturing a connection structure and connection method
05/21/2014CN103801821A 透光设备及具有所述透光设备的退火设备 Device having a light-transmitting device, and annealing of the light-transmitting device
05/21/2014CN103801536A 一种晶片清洗装置 A wafer cleaning apparatus
05/21/2014CN103801466A 一种低冲击力均布流量的湿法处理工艺喷嘴 A low impact force uniform flow nozzle wet treatment process
05/21/2014CN102751241B 一种阵列基板过孔的制作方法及阵列基板制作工艺 A method of manufacturing an array substrate, an array of vias in the substrate production process and
05/21/2014CN102650661B 一种半导体薄膜的测量系统 A semiconductor thin film measurement system
05/21/2014CN102623380B 片状元件夹持装置及其方法 Sheet-like member holding device and method
05/21/2014CN102612501B 溅射靶及使用它的薄膜晶体管 A sputtering target and a thin film transistor using it
05/21/2014CN102610641B 高压ldmos器件及其制造方法 Device and method for manufacturing the high pressure ldmos
05/21/2014CN102593055B 高压器件集成电路的制造方法 High-voltage integrated circuit device manufacturing method
05/21/2014CN102574745B 碳化硅接合体以及碳化硅构件的接合方法 Silicon carbide and silicon carbide body connection method of joining members
05/21/2014CN102569101B 无外引脚封装结构及其制作方法 No external pin package structure and production methods
05/21/2014CN102569055B 一种碳化硅单晶晶片表面及平整度的调整方法 An adjustment method monocrystalline wafer surface and flatness of silicon carbide
05/21/2014CN102544080B 锗硅异质结双极晶体管及制造方法 SiGe heterojunction bipolar transistor and method of manufacture
05/21/2014CN102496631B 背电极结构的ZnO基全透明非挥发存储器及制备方法 ZnO-based transparent back electrode structure and preparation methods of non-volatile memory
05/21/2014CN102483590B 用于形成铜基配线的光刻胶剥离剂组合物 For forming a copper-based wiring photoresist stripper composition
05/21/2014CN102479812B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN102479675B 单晶片加工方法及单晶片 Single wafer processing method and single chip
05/21/2014CN102468179B 半导体组件及其制作方法 Semiconductor component and its manufacturing method
05/21/2014CN102456540B 应用于外延工艺中的光刻套刻标记的制备方法 Applied to the preparation of the epitaxial process lithography overlay mark
05/21/2014CN102449740B 激光退火方法及激光退火装置 Laser annealing method and laser annealing device
05/21/2014CN102414787B 激光反射掩模以及其制造方法 Laser reflection mask and a manufacturing method thereof
05/21/2014CN102412286B 一种高速锗硅hbt器件结构及其制造方法 A high speed SiGe hbt device structure and its manufacturing method
05/21/2014CN102403191B 一种反应腔漏气检测方法及真空反应器控制方法 A reaction to the vacuum chamber leak detection method and reactor control method
05/21/2014CN102394245B 金属氧化物半导体场效应晶体管及其制作方法 Metal oxide semiconductor field effect transistor and manufacturing method thereof
05/21/2014CN102386127B 制作半导体器件结构的方法 The method of fabricating a semiconductor device structure
05/21/2014CN102376776B BiCMOS工艺中的寄生PIN二极管及制造方法 BiCMOS processes in the method for producing a parasitic diode and a PIN
05/21/2014CN102376602B 用于测量底部抗反射涂层材料的挥发特性的方法 Methods for measuring the bottom antireflective coating material evaporation characteristics of
05/21/2014CN102299097B 一种金属连线刻蚀方法 Etching of a metal wire
05/21/2014CN102272902B 通过等离子体氧化处理的轮廓和cd均匀性控制 By outline plasma oxidation treatment and cd uniformity control
05/21/2014CN102257610B 石墨烯存储单元及其制造方法 Graphene memory cell and its manufacturing method
05/21/2014CN102254917B 薄膜晶体管阵列基板及其制法 The thin film transistor array substrate preparation method
05/21/2014CN102254796B 形成交替排列的p型和n型半导体薄层的方法 Alternating p-type and n-type semiconductor arranged in a method of forming a thin layer
05/21/2014CN102217048B 用于扩大温度高温测定的方法与设备 For extended temperature pyrometry methods and apparatus
05/21/2014CN102163005B 投影曝光装置、器件制造方法以及光学部件 The projection exposure apparatus, device manufacturing method and an optical member
05/21/2014CN102159662B 用于低k电介质的阻挡物浆料 Barrier slurry for low k dielectrics
05/21/2014CN102150247B 稳定的无定形金属氧化物半导体 A stable amorphous metal oxide semiconductor
05/21/2014CN102122623B 一种换流阀晶闸管压装机构 One kind of converter valve thyristor press-fit mechanism
05/21/2014CN102064132B 半导体结构的制造方法 The method of manufacturing a semiconductor structure
05/21/2014CN102044526B 一种电迁移监控结构 An electrical migration monitoring structure
05/21/2014CN102043353B 用于在晶圆上喷涂显影液的方法 Spraying the developing solution on the wafer, a method for
05/21/2014CN102026807B 被加工件的表面保护方法和临时固定方法 The method is the workpiece surface protection and temporary fixation
05/21/2014CN101999163B 低漏电流和/或低导通电压的肖特基二极管 Low leakage current and / or low turn-on voltage of the Schottky diode
05/21/2014CN101989547B 电阻式存储体结晶二极管制造方法 Resistive memory crystal diode manufacturing method
05/21/2014CN101899645B 一种离子注入方法 An ion implantation method
05/21/2014CN101899281B 稀土抛光粉及其制造方法 Rare earth polishing powder and its manufacturing method
05/21/2014CN101899264B 一种稀土抛光粉及其制造方法 Rare earth polishing powder and its manufacturing method
05/21/2014CN101796522B 用于预测侧面位置信息的方法和系统 Method and system for the side surface position information prediction
05/21/2014CN101677072B 封装电子装置的方法 The method of encapsulating electronic devices
05/20/2014US8732646 PLD architecture for flexible placement of IP function blocks
05/20/2014US8731706 Vacuum processing apparatus
05/20/2014US8731701 Substrate treatment method and substrate treatment system
05/20/2014US8731344 Method for manufacturing semiconductor optical modulator and semiconductor optical modulator
05/20/2014US8730720 Nonvolatile memory cell operating by increasing order in polycrystalline semiconductor material
05/20/2014US8730644 Bipolar electrostatic chuck
05/20/2014US8730473 Multiple edge enabled patterning
05/20/2014US8730452 Source and mask optimization by changing intensity and shape of the illumination source and magnitude and phase of mask diffraction orders
05/20/2014US8730450 Immersion photolithography system and method using microchannel nozzles
05/20/2014US8730362 Image sensor with controllable vertically integrated photodetectors
05/20/2014US8730360 Color imaging apparatus having color imaging element, method of controlling operation of same and image sensing system
05/20/2014US8729713 Via structure and method thereof
05/20/2014US8729712 Pad design for circuit under pad in semiconductor devices
05/20/2014US8729708 Semiconductor device structures and memory devices including a uniform pattern of conductive material
05/20/2014US8729704 Multilayer dielectric memory device
05/20/2014US8729702 Copper seed layer for an interconnect structure having a doping concentration level gradient
05/20/2014US8729697 Sensor arrangement, a measurement circuit, chip-packages and a method for forming a sensor arrangement
05/20/2014US8729695 Wafer level package and a method of forming a wafer level package
05/20/2014US8729693 Integrated circuit packaging system with a leaded package and method of manufacture thereof
05/20/2014US8729691 Distributed semiconductor device methods, apparatus, and systems
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