Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/08/2014WO2014069091A1 Photosensitive resin composition, cured film, protective film, insulating film, and electronic device
05/08/2014WO2014069079A1 Substrate processing device
05/08/2014WO2014069074A1 Conductive paste and die bonding method
05/08/2014WO2014069042A1 Polishing pad and method for producing same
05/08/2014WO2014069032A1 Field-effect semiconductor device and method for manufacturing same
05/08/2014WO2014069029A1 Communication device, communication equipment and communication system
05/08/2014WO2014068981A1 Substrate processing device and control device for substrate processing device
05/08/2014WO2014068974A1 Plasma processing method
05/08/2014WO2014068937A1 Semiconductor module
05/08/2014WO2014068936A1 Semiconductor module
05/08/2014WO2014068935A1 Semiconductor module
05/08/2014WO2014068916A1 Thin film transistor
05/08/2014WO2014068838A1 Epitaxial wafer and method for manufacturing same
05/08/2014WO2014068829A1 Thin film transistor array
05/08/2014WO2014068813A1 Semiconductor device
05/08/2014WO2014068801A1 Photoresist stripping solution composition
05/08/2014WO2014068763A1 System for measuring inner diameter of expand ring of die supply apparatus, and system for avoiding thrust operation interference
05/08/2014WO2014068690A1 Substrate holding device
05/08/2014WO2014068640A1 Component supply apparatus
05/08/2014WO2014068639A1 Component supply apparatus
05/08/2014WO2014068638A1 Component supply apparatus
05/08/2014WO2014068593A1 High-frequency integrated device with an enhanced inductance and a process thereof
05/08/2014WO2014068377A1 Method for modifying an initial stress state of an active layer to a final stress state
05/08/2014WO2014067692A1 Dual gate finfet devices
05/08/2014WO2014067667A1 Thermally debondable tape
05/08/2014WO2014067463A1 Thin film transistor and manufacturing method, array substrate, display device and barrier layer thereof
05/08/2014WO2014067288A1 Wafer-level through silicon via (tsv) manufacturing method
05/08/2014WO2014067200A1 Semiconductor structure and manufacturing method thereof
05/08/2014WO2014067185A1 Structure for silicon nanowire chip for biological detection and manufacturing method therefor
05/08/2014WO2014067177A1 Cassette conveying device and method
05/08/2014WO2014067171A1 Forklift and warehouse system
05/08/2014WO2014067089A1 A power semiconductor device and manufacturing method thereof
05/08/2014WO2014066997A1 A reverse optical proximity correction method
05/08/2014WO2014042488A3 Substrate processing apparatus
05/08/2014WO2013165323A3 Method and encapsulant for flip-chip assembly
05/08/2014WO2013082092A8 Brush with cantilevered nodules
05/08/2014WO2013066455A3 Flattened substrate surface for substrate bonding
05/08/2014WO2013010029A3 Surface-modified nanoparticle ink for photovoltaic applications
05/08/2014WO2013003784A3 Process for a sealed mems device with a portion exposed to the environment
05/08/2014WO2012173980A3 Passive compensation for temperature-dependent wafer gap changes in plasma processing systems
05/08/2014WO2012166747A3 Multi-layer coating with cubic boron nitride particles
05/08/2014WO2012158391A3 Narrow width loadport mechanism for cleanroom material transfer systems
05/08/2014US20140129849 Semiconductor device including encryption section, semiconductor device including external interface, and content reproduction method
05/08/2014US20140127914 Charged particle beam writing apparatus and charged particle beam writing method
05/08/2014US20140127913 Titanium-containing precursors for vapor deposition
05/08/2014US20140127912 Plasma process etch-to-deposition ratio modulation via ground surface design
05/08/2014US20140127911 Palladium plated aluminum component of a plasma processing chamber and method of manufacture thereof
05/08/2014US20140127910 Pattern formation method and block copolymer
05/08/2014US20140127909 Methods Of Forming A Pattern On A Substrate
05/08/2014US20140127908 Substrate treatment method and substrate treatment apparatus
05/08/2014US20140127907 Methods of forming semiconductor structures and related sulfur dioxide etch chemistries
05/08/2014US20140127906 Sputter and surface modification etch processing for metal patterning in integrated circuits
05/08/2014US20140127905 Method of forming pattern in substrate
05/08/2014US20140127904 Enhanced capture pads for through semiconductor vias
05/08/2014US20140127903 Semiconductor device and method for manufacturing the same
05/08/2014US20140127902 Method of providing stable and adhesive interface between fluorine based low k material and metal barrier layer
05/08/2014US20140127901 Low-k damage free integration scheme for copper interconnects
05/08/2014US20140127900 Method of forming cu interconnects
05/08/2014US20140127899 Microstructure modification in copper interconnect structures
05/08/2014US20140127898 Method of making a semiconductor device including barrier layers for copper interconnect
05/08/2014US20140127897 Dual damascene process
05/08/2014US20140127896 Method of forming a graphene cap for copper interconnect structures
05/08/2014US20140127895 Semiconductor Device Comprising a Fuse Structure and a Method for Manufacturing such Semiconductor Device
05/08/2014US20140127894 Manufacturing method of non-volatile memory
05/08/2014US20140127893 Method for fabricating a semiconductor device
05/08/2014US20140127892 Semiconductor device having metal gate and manufacturing method thereof
05/08/2014US20140127891 Method for manufacturing pixel structure
05/08/2014US20140127890 Method and apparatus for fabricating free-standing group iii nitride crystals
05/08/2014US20140127889 System and method for depositing a material on a substrate
05/08/2014US20140127888 Semiconductor nanostructures, semiconductor devices, and methods of making same
05/08/2014US20140127887 Chemical Vapor Deposition System
05/08/2014US20140127886 Reducing Pattern Loading Effect in Epitaxy
05/08/2014US20140127885 Semiconductor die singulation method
05/08/2014US20140127884 Wafer processing method
05/08/2014US20140127883 Wafer processing method
05/08/2014US20140127882 Wafer processing method
05/08/2014US20140127881 Support disk fixing apparatus, manufacturing method for a semiconductor device using this apparatus, and semiconductor manufacturing apparatus
05/08/2014US20140127880 Semiconductor die singulation method and apparatus
05/08/2014US20140127879 Semiconductor Device and Method of Manufacture
05/08/2014US20140127878 Fabrication of localized soi on localized thick box using selective epitaxy on bulk semiconductor substrates for photonics device integration
05/08/2014US20140127877 Fabrication of localized soi on localized thick box lateral epitaxial realignment of deposited non-crystalline film on bulk semiconductor substrates for photonics device integration
05/08/2014US20140127871 METHOD FOR PRODUCING A FIELD EFFECT TRANSISTOR WITH A SiGe CHANNEL BY ION IMPLANTATION
05/08/2014US20140127869 Lateral bipolar junction transistor
05/08/2014US20140127866 Package Structures Including a Capacitor and Methods of Forming the Same
05/08/2014US20140127865 Molded interposer package and method for fabricating the same
05/08/2014US20140127864 Method of fabricating a semiconductor package
05/08/2014US20140127862 Method of assembling semiconductor device including insulating substrate and heat sink
05/08/2014US20140127859 Method for fabricating a semiconductor and semiconductor package
05/08/2014US20140127858 Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
05/08/2014US20140127857 Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods
05/08/2014US20140127855 Method for the oriented crystallization of materials
05/08/2014US20140127851 Method for producing semiconductor layer, method for producing photoelectric conversion device, and semiconductor starting material
05/08/2014US20140127848 Nitride semiconductor light-emittting device and process for producing the same
05/08/2014US20140127839 Method for separating and transferring ic chips
05/08/2014US20140127838 Method of testing a semiconductor package
05/08/2014US20140127837 Thin film deposition apparatus and method of depositing thin film using the same
05/08/2014US20140127836 Systems and methods of local focus error compensation for semiconductor processes
05/08/2014US20140127835 Method of detecting the circular uniformity of the semiconductor circular contact holes
05/08/2014US20140127834 Methods for liquid transer coating of three-dimensional substrates
05/08/2014US20140127833 Deposition amount measuring apparatus, depositing apparatus including the same, and method for manufacturing light emitting display
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