Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/14/2014CN103794560A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
05/14/2014CN103794559A 一种半导体器件及其制备方法 A semiconductor device and its preparation method
05/14/2014CN103794558A 一种半导体器件及其制造方法 A semiconductor device and its manufacturing method
05/14/2014CN103794557A 半导体器件的制作方法 Method of manufacturing a semiconductor device
05/14/2014CN103794556A 阵列基板及其制作方法和液晶显示装置 Array substrate and manufacturing method thereof and liquid crystal display device
05/14/2014CN103794555A 制造阵列基板的方法 The method of manufacturing an array substrate
05/14/2014CN103794554A 改进的硅通孔结构制备方法 Improved methods for preparing silicon vias structure
05/14/2014CN103794553A 用于在衬底中制造电覆镀通孔的方法以及具有电覆镀通孔的衬底 The method of manufacturing an electrical substrate in the substrate for plating through holes, and having an electric plating through hole
05/14/2014CN103794552A 铜衬底上的碳纳米管生长 Carbon nanotubes grown on a copper substrate
05/14/2014CN103794551A 采用电子束工艺定义连接孔的方法 Define a connection using the process of electron beam apertures
05/14/2014CN103794550A 电互连结构的形成方法 The method for forming electrical interconnect structure
05/14/2014CN103794549A 半导体结构的形成方法 The method for forming a semiconductor structure
05/14/2014CN103794548A 局域互连结构的形成方法 The method for forming local interconnect structure
05/14/2014CN103794547A 一种制作半导体器件的方法 A method of fabricating a semiconductor device
05/14/2014CN103794546A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/14/2014CN103794545A 一种制作金属互连线的方法 A method of making a metal interconnect lines
05/14/2014CN103794544A 一种电镀铜的方法 One kind of copper plating method
05/14/2014CN103794543A 隔离结构及其形成方法 Isolation structure and method of forming
05/14/2014CN103794542A 半导体衬底的形成方法 The method for forming a semiconductor substrate
05/14/2014CN103794541A 用于晶圆级植球机的搭载平台 For wafer level bumping machine equipped with platform
05/14/2014CN103794540A 静电卡盘与基板处理装置 The electrostatic chuck and the substrate processing apparatus
05/14/2014CN103794539A 一种静电吸盘加工的工艺方法 A process for processing an electrostatic chuck
05/14/2014CN103794538A 静电卡盘以及等离子体加工设备 An electrostatic chuck and a plasma processing equipment
05/14/2014CN103794537A 一种半导体自动排片设备的抓料机械手 A semiconductor device automatic discharge sheet feeding robot grasping
05/14/2014CN103794536A 半导体设备运动传输模块的异常处理方法 Exception handling method of the semiconductor device sports transmission module
05/14/2014CN103794535A 晶体硅太阳能电池片链式传送的平行滚轮装置 Parallel roller device crystalline silicon solar cells chain transfer
05/14/2014CN103794534A 一种新的有效降低首片硅片铜小丘缺陷的方法 A new copper wafers effectively reduce the first hill flawed methodology
05/14/2014CN103794533A 转移单元及其控制方法、及利用其处理基板的装置与方法 A transfer unit and a control method thereof and the use of apparatus and method for processing a substrate
05/14/2014CN103794532A 找位夹具和位置调整方法 Grab fixtures and position adjustment method
05/14/2014CN103794531A 裸芯排出装置 Die discharge device
05/14/2014CN103794530A 带隔片的切割/芯片接合薄膜 Cutting with septum / die-bonding film
05/14/2014CN103794529A 一种定位台上确定晶片圆心偏移矢量 A positioning the center of the wafer stage to determine the offset vector
05/14/2014CN103794528A 半导体加工设备 Semiconductor processing equipment
05/14/2014CN103794527A 静电卡盘加热方法及系统 Electrostatic chuck heating method and system
05/14/2014CN103794526A 一种新型霍尔测试方法 A new test method Hall
05/14/2014CN103794525A 一种可运动机械臂上判定晶片存在的方法 The method of determining the presence of a wafer on a movable manipulator
05/14/2014CN103794524A 一种在驻极体上图形化驻极的方法 A graphical method electret electret on
05/14/2014CN103794523A 一种晶圆临时键合方法 One kind of temporary wafer bonding method
05/14/2014CN103794522A 晶圆-晶圆、芯片-晶圆和芯片-芯片键合方法 Wafers - wafers, chips - wafers and chips - chip bonding method
05/14/2014CN103794521A 塑封同轴向二极管铜电极引线过渡盘装填机 Plastic coaxial copper electrode leads to the diode transition plate Loaders
05/14/2014CN103794520A 一种键合设备辅助工具及其方法 A bonded device and method aids
05/14/2014CN103794519A 一种半导体器件及其制备方法 A semiconductor device and its preparation method
05/14/2014CN103794518A 半导体装置的制造方法、半导体装置 The method of manufacturing a semiconductor device, a semiconductor device
05/14/2014CN103794517A 圆形式晶粒置放方法 Round grain placement method form
05/14/2014CN103794516A 一种阶梯阻焊的封装产品制作方法 One kind of ladder solder packaging products production methods
05/14/2014CN103794515A 芯片封装基板和结构及其制作方法 Chip package substrate and the structure and production methods
05/14/2014CN103794514A 封装载板的制造方法 Manufacturing method of a package carrier board
05/14/2014CN103794513A 增强介质层PI和金属Cu层之间粘附性的方法 The method of enhancing adhesion between the dielectric layer and the metal Cu layer PI
05/14/2014CN103794512A 双Finfet晶体管及其制备方法 Dual Finfet transistor and its preparation method
05/14/2014CN103794511A 显示装置以及电子设备 A display device and an electronic device
05/14/2014CN103794510A 背沟道蚀刻氧化物薄膜晶体管工艺架构 Back channel etched oxide thin film transistor technology architecture
05/14/2014CN103794509A 借由提供阶化嵌入应变诱导半导体区于晶体管的效能增进 Provided by the order of the embedded strain inducing semiconductor region in transistor performance enhancing
05/14/2014CN103794508A 在半导体器件中使用氧化物层板来增加本体氧化物厚度 To increase the body of the oxide thickness in the laminate using an oxide semiconductor device
05/14/2014CN103794507A 后栅工艺中器件隔离方法 After the gate process device isolation method
05/14/2014CN103794506A 晶体管的形成方法 The method for forming a transistor
05/14/2014CN103794505A 晶体管的形成方法 The method for forming a transistor
05/14/2014CN103794504A 快闪存储器及其制作方法 Flash memory and manufacturing method thereof
05/14/2014CN103794503A Mos晶体管的制作方法 Mos transistor manufacturing method
05/14/2014CN103794502A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/14/2014CN103794501A 晶体管及其形成方法 Transistor and method of forming
05/14/2014CN103794500A 晶体管及其形成方法 Transistor and method of forming
05/14/2014CN103794499A 鳍式场效应管及其形成方法 Fin-type field effect transistor and method of forming
05/14/2014CN103794498A 一种半导体器件及其制备方法 A semiconductor device and its preparation method
05/14/2014CN103794497A 一种半导体器件及其制备方法 A semiconductor device and its preparation method
05/14/2014CN103794496A 在半导体硅衬底上附生作为源漏极基底材料的锗硅的方法 The method of the semiconductor epitaxial substrate is used as the silicon source and drain silicon germanium substrate material
05/14/2014CN103794495A 一种基于石墨烯场效应晶体管的制备方法 A process for producing a field effect transistor based on graphene
05/14/2014CN103794494A 制造机电晶体管的方法 The method of manufacturing electromechanical transistor
05/14/2014CN103794493A 半导体器件制造方法及器件结构，硬件描述语言设计结构 The semiconductor device manufacturing method and the device structure, the structure design of the hardware description language
05/14/2014CN103794492A 一种湿法去除多晶硅的方法 A method for removing polysilicon wet
05/14/2014CN103794491A 一种低介电常数层的制作方法 A method of manufacturing a low dielectric constant layer,
05/14/2014CN103794490A 自对准双图形的形成方法 The method for forming a self-aligned double-patterning of
05/14/2014CN103794489A 等离子蚀刻的方法 Plasma etching method
05/14/2014CN103794488A 一种衬底的刻蚀方法 A substrate etching method
05/14/2014CN103794487A 半导体器件制造方法 The semiconductor device manufacturing method
05/14/2014CN103794486A 一种制作金属栅极的方法 A method of making a metal gate
05/14/2014CN103794485A 多晶硅结构的形成方法 The method for forming a polysilicon structure
05/14/2014CN103794484A 后栅工艺中假栅极制造方法 Dummy gate after gate process manufacturing method
05/14/2014CN103794483A 具有金属栅极的半导体器件的制作方法 Having a method of manufacturing a metal gate semiconductor device
05/14/2014CN103794482A 金属栅极的形成方法 Forming a metal gate
05/14/2014CN103794481A 高k金属栅极结构及其制造方法 High-k metal gate structure and manufacturing method
05/14/2014CN103794480A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/14/2014CN103794479A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/14/2014CN103794478A n型扩散层形成用组合物、n型扩散层的制造方法以及太阳能电池元件的制造方法 n-type diffusion layer-forming composition, method of producing n-type diffusion layer, and a method for manufacturing a solar cell element
05/14/2014CN103794477A 碳化硅mosfet单元结构和用于形成碳化硅mosfet单元结构的方法 A silicon carbide structure and method for forming a mosfet unit cell structures of silicon carbide mosfet
05/14/2014CN103794476A 自对准三重图形的形成方法 The method for forming a self-aligned triple graphics
05/14/2014CN103794475A 自对准三重图形化方法 Self-aligned triple patterning method
05/14/2014CN103794474A 硅衬底上生长纳米线的衬底处理方法 The substrate processing method of the silicon nanowires grown on the substrate
05/14/2014CN103794473A 一种室温下吸除硅晶片或硅器件中过渡金属杂质的方法 Suction method other than silicon wafers or silicon devices transition metal impurities at a room temperature
05/14/2014CN103794472A 一种半导体材料过滤位错的方法 A semiconductor material dislocation filtering methods
05/14/2014CN103794471A 一种化合物半导体衬底的制备方法 Preparation method of compound semiconductor substrate
05/14/2014CN103794470A 硅片正面保护方法 Wafer front protection methods
05/14/2014CN103794469A 一种氮化镓薄膜层的制备方法及衬底 A gallium nitride substrate and a method for preparing a thin film layer
05/14/2014CN103794468A 一种晶边刻蚀方法 A crystalline side etching method
05/14/2014CN103794467A 一种薄硅片的重新利用方法 Re-use method for thin wafers
05/14/2014CN103794466A 保持接口单元内部洁净度装置 Maintain internal cleanliness device interface unit
05/14/2014CN103794461A 一种等离子体处理装置 A plasma processing apparatus
05/14/2014CN103794457A 一种等离子体处理设备及其中的温度隔离装置 A plasma processing apparatus and the temperature of the isolator device
05/14/2014CN103794456A 刻蚀机台的结构及刻蚀方法 Structure and etching method of etching machine
05/14/2014CN103794445A 用于等离子体处理腔室的静电夹盘组件及制造方法 The plasma processing chamber assembly, and the electrostatic chuck manufacturing method for
05/14/2014CN103794024A 半导体工艺的报警处理方法 Alarm processing method for semiconductor process
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