Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/28/2014DE102008046101B4 Bildsensor und Verfahren zu dessen Herstellung Image sensor and method for its production
05/28/2014CN203617323U 一种产品叠加时用的工作平台 When a product is superimposed with a working platform
05/28/2014CN203617316U 用于太阳能电池串的自动传输装置 Automatic transmission apparatus for a solar cell string
05/28/2014CN203617299U 一种双扩散金属氧化物半导体 A two-diffused metal oxide semiconductor
05/28/2014CN203617264U 一种改进型芯片夹持装置 An improved chip clamping device
05/28/2014CN203617263U 一种半导体应变计硅片焊接定位吸盘 A semiconductor strain gauge welded wafer positioning sucker
05/28/2014CN203617262U 一种真空吸笔头 A vacuum suction tip
05/28/2014CN203617261U 一种装料小车 One kind of car charging
05/28/2014CN203617260U 一种传输装置 A transmission device
05/28/2014CN203617259U 一种太阳能玻璃及组件自动存储设备 A solar glass and components, automatic storage devices
05/28/2014CN203617258U 晶圆转载治具 Wafer reprint Fixture
05/28/2014CN203617257U 卡片铣槽封装设备 Card slot milling packaging equipment
05/28/2014CN203617256U 一种tco刻线测试机 One kind tco engraved line tester
05/28/2014CN203617255U 半自动晶圆植球设备 Semi-automatic wafer bumping equipment
05/28/2014CN203617247U 一种芯片等离子体表面处理装置 A chip plasma surface treatment device
05/28/2014CN203612611U 一种cob自动分选系统自动送料装置 One kind cob automatic sorting system automatic feeding device
05/28/2014CN103828064A 太阳能电池用晶片、太阳能电池用晶片的生产方法、太阳能电池的生产方法和太阳能电池模块的生产方法 The method of producing a solar cell wafer, the wafer of the solar cell production process of solar cell production method and the solar cell module
05/28/2014CN103828061A 使用氩气稀释来沉积含硅层的方法 Argon dilution method to deposit silicon-containing layer
05/28/2014CN103828060A 半导体器件 Semiconductor devices
05/28/2014CN103828059A N沟道和p沟道finfet单元架构 N-channel and p-channel finfet cell architecture
05/28/2014CN103828058A 包括垂直半导体元件的半导体器件 A vertical semiconductor device including a semiconductor element
05/28/2014CN103828057A 用于晶体管栅极的帽盖介电结构 A cover cap for the transistor gate dielectric structure
05/28/2014CN103828056A 碳化硅半导体装置及其制造方法 The silicon carbide semiconductor device and manufacturing method
05/28/2014CN103828055A GaAsP纳米结构的Ga辅助的生长、不含金的GaAsP纳米结构及包含该纳米结构的光伏电池 Ga-assisted growth of nanostructures GaAsP, GaAsP excluding gold nanostructures and the nanostructure comprises a photovoltaic cell
05/28/2014CN103828049A 包含具有不同的少数载流子寿命的沟道区域的设备及方法 Contains the device and method having different minority carrier lifetime of the channel region
05/28/2014CN103828048A 单独和并行地选择eprom的电路 Separate and parallel circuits to choose eprom
05/28/2014CN103828047A 用于非易失性存储器装置的p+硅锗材料的种子层及方法 A non-volatile memory device p + silicon germanium seed layer material and method
05/28/2014CN103828046A 用于3d集成电路层叠的层间通信 3d stacked integrated circuit used for inter-layer communications
05/28/2014CN103828037A 具有块间绝缘体的n沟道和p沟道finfet单元架构 N-channel and p-channel finfet cell architecture with inter-block insulator
05/28/2014CN103828036A 在3d集成处理中转移材料层的方法以及相关结构和装置 The method of transfer material layer 3d the integration process and the related structures and devices
05/28/2014CN103828035A 基板支撑轴衬 The substrate support bushing
05/28/2014CN103828034A 用于洁净室材料传输系统的狭窄宽度加载端口机构 Narrow width of the loading port means for cleanroom material transport system
05/28/2014CN103828033A 晶片载具 Wafer carrier
05/28/2014CN103828032A 用于处理衬底表面的装置以及方法 Means for processing a substrate surface and a method for
05/28/2014CN103828031A 用于监测复用加热器阵列的温度并控制该阵列的系统和方法 For monitoring the temperature of the heater array, the multiplexing and control system and method of the array
05/28/2014CN103828030A 半导体元件、hemt元件、以及半导体元件的制造方法 The method of manufacturing a semiconductor device, hemt element, and a semiconductor element
05/28/2014CN103828029A 堆积物去除方法 The method for removing deposits
05/28/2014CN103828028A 等离子体蚀刻方法 The plasma etching method
05/28/2014CN103828027A 制造碳化硅衬底的方法和碳化硅衬底 The method of producing a silicon carbide substrate and the silicon carbide substrate
05/28/2014CN103828026A 具有选择性形成的金属罩的集成电路结构 Selectively forming an integrated circuit structure having a metal cover
05/28/2014CN103828025A 铜互连结构中的微结构修改 Modifying the microstructure of the copper interconnect structure
05/28/2014CN103828024A 用于外延工艺的半导体制造设备 Epitaxial process for semiconductor manufacturing equipment
05/28/2014CN103828023A 具有降低的边缘曲率特征的集成电路器件的制造方法 The method of manufacturing an edge having a curvature characterized by a decrease in integrated circuit device
05/28/2014CN103828022A 模具坯、母模具、复制模具和模具坯的制造方法 Die blanks, the mother dies, molds and manufacturing methods to copy billet mold
05/28/2014CN103828021A 制造复合晶片的方法 The method of manufacturing a composite wafer,
05/28/2014CN103828020A 单片集成半导体结构 Monolithically integrated semiconductor structure
05/28/2014CN103828019A 在硅或类似的基材上制造氮化镓的厚的外延层的方法以及使用所述方法获得的层 Layer, and a method of using the method of manufacturing a GaN epitaxial layer on a silicon substrate or the like to obtain a thickness of
05/28/2014CN103828018A 金属氧化物薄膜的低温制造技术及衍生自纳米材料的金属复合物薄膜 Manufacturing technology and low temperature metal composite films derived from nanomaterials metal oxide thin film
05/28/2014CN103827752A 形成含有硅的euv抗蚀剂下层膜的组合物 Euv resist underlayer film is formed of silicon-containing composition
05/28/2014CN103827751A 图案形成方法、电子束敏感或极紫外线敏感组合物、抗蚀剂膜、使用其制造电子器件的方法和电子器件 A pattern forming method, an electron beam or extreme ultraviolet sensitive sensitive composition, a resist film, a method of manufacturing an electronic device and an electronic device
05/28/2014CN103827750A 图案形成方法、电子束敏感或极紫外线辐射敏感树脂组合物、抗蚀剂膜、使用其的电子器件的制造方法和电子器件 A pattern forming method, an electron beam or extreme ultraviolet radiation-sensitive resin composition-sensitive resist film, and a method of manufacturing an electronic device using an electronic device which
05/28/2014CN103827353A 由承载膜和包括由至少一种金属粉末制成的可烧结的层和焊接层的层组件组成的复合层 By the carrier film and comprises a layer component layer and the solder layer can be a sintered metal powder prepared from at least one composite layer consisting of
05/28/2014CN103827349A 溅射靶及其制造方法 Sputtering target and its manufacturing method
05/28/2014CN103827348A 钽溅射靶及其制造方法 Tantalum sputtering target and its manufacturing method
05/28/2014CN103827163A 具有芴结构的树脂及光刻用下层膜形成材料 A resin having a fluorene structure and underlayer film forming material lithography
05/28/2014CN103827159A 二芳基胺酚醛清漆树脂 Diaryl amine novolac resin
05/28/2014CN103827005A 用于改变堆叠的间距的装置 Pitch changing means for stacking
05/28/2014CN103826829A 具有用于加压部的固定工具的流体压印装置 Fluid marking device having a fixed portion of the tool for pressurizing
05/28/2014CN103826384A 高性能垂直互连 High-performance vertical interconnects
05/28/2014CN103824965A 有机发光二极管显示面板及其制造方法 The organic light emitting diode display panel and manufacturing method
05/28/2014CN103824964A 有机发光显示装置及其制造方法 The organic light emitting display device and its manufacturing method
05/28/2014CN103824895A 一种双玻太阳电池组件封装成品率提高方法 One kind of double glass solar module encapsulation method for improving yield
05/28/2014CN103824887A 金属氧化物半导体薄膜晶体管及其制作方法 Metal oxide semiconductor thin film transistor and manufacturing method thereof
05/28/2014CN103824884A 一种超级结mosfet、该超级结mosfet的形成方法 A super junction mosfet, the method of forming the super junction mosfet
05/28/2014CN103824883A 一种具有终端耐压结构的沟槽mosfet的及其制造方法 A method of manufacturing a trench having a terminal voltage mosfet structures
05/28/2014CN103824882A 双扩散金属氧化物半导体元件及其制造方法 Metal oxide semiconductor device and manufacturing method of double diffusion
05/28/2014CN103824879A 一种功率器件结终端结构与制造方法 A power device junction termination structure and manufacturing method
05/28/2014CN103824878A 一种碳化硅功率器件结终端结构及其制造方法 A silicon carbide power device junction termination structure and manufacturing method
05/28/2014CN103824877A Qd-led像素显示器件、制作方法及显示面板 Qd-led pixel display, and the display panel manufacturing method
05/28/2014CN103824871A 有机发光显示系统及其制造方法 The organic light emitting display and method of manufacturing the system
05/28/2014CN103824867A 电连接晶圆的方法和用该方法制造的半导体设备 Electrically connected to the wafer and a method of using a semiconductor device manufactured by the method
05/28/2014CN103824866A 一种阵列基板及其制备方法、液晶显示面板 One kind of array substrate and its preparation method, LCD panel
05/28/2014CN103824865A 一种阵列基板及其制备方法和显示装置 An arrayed substrate preparation method and display device
05/28/2014CN103824864A 一种阵列基板及其制备方法、显示装置 One kind of array substrate and its preparation method, a display device
05/28/2014CN103824860A 制造存储器单元法、制造存储器单元装置法和存储器单元 Method of manufacturing a memory cell, the memory cell device manufacturing method and a memory unit
05/28/2014CN103824859A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/28/2014CN103824857A 包含绝缘体上半导体区和主体区的半导体结构及形成方法 The semiconductor structure comprises a semiconductor region and the body region and the method of forming the insulator
05/28/2014CN103824856A 一种基于背栅晶体管的抗辐照技术及实现方法 An anti-radiation based on the back-gate transistor technology and implementation
05/28/2014CN103824842A 集成电路、半导体管芯布置以及用于制造集成电路的方法 An integrated circuit, a semiconductor die and a method of manufacturing an integrated circuit arrangement for
05/28/2014CN103824837A 半导体器件结构及其制作方法 The semiconductor device structure and manufacturing method thereof
05/28/2014CN103824835A 用于半导体集成器件的表面装配封装、相关组件和制造工艺 Package for surface mounting of the semiconductor integrated device, the associated components and manufacturing processes
05/28/2014CN103824834A 一种具有改进型封装结构的半导体器件及其制造方法 A semiconductor device and a manufacturing method of a package structure having improved
05/28/2014CN103824831A 一种封装基板及其制备方法 A package board and its preparation method
05/28/2014CN103824830A 芯片布置和用于制造芯片布置的方法 Chip arrangement and method for manufacturing the chip layout
05/28/2014CN103824829A 非焊接掩膜限定的铜焊盘和嵌入式铜焊盘 Non-solder mask defined pads and embedded copper copper pads
05/28/2014CN103824828A 封装载板及其制造方法 Package substrate and a manufacturing method
05/28/2014CN103824827A 封装模块、封装终端及其制造方法 Encapsulation module, and a manufacturing method of the package terminals
05/28/2014CN103824824A 一种集成散热结构及其制造方法 An integrated heat sink structure and manufacturing method
05/28/2014CN103824821A 一种塑料密闭封装的开关电源模块及其制备方法 Switching power supply module and method for preparing plastic hermetic package
05/28/2014CN103824820A 引线框区域阵列封装技术 Leadframe area array packaging technology
05/28/2014CN103824819A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/28/2014CN103824818A 射频微机电器件板级互连封装结构及其封装方法 RF MEMS devices board-level interconnect package and packaging method
05/28/2014CN103824815A 制造半导体器件的方法及半导体器件 The method of manufacturing a semiconductor device and semiconductor device
05/28/2014CN103824814A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
05/28/2014CN103824813A 一种单片集成的微荧光分析系统及其制作方法 A monolithic integrated micro-fluorescence analysis system and its production methods
05/28/2014CN103824812A 用于平面衬底的双外延cmos集成 Double epitaxial planar substrates for integrated cmos
05/28/2014CN103824811A 用于cmos集成电路的替代金属栅极工艺 Used to replace metal gate process cmos integrated circuits
05/28/2014CN103824810A 薄膜晶体管阵列基板及其制造方法 The thin film transistor array substrate and a method of manufacturing
05/28/2014CN103824809A 像素结构及其制造方法 Pixel structure and its manufacturing method
05/28/2014CN103824808A 蚀刻剂组合物、形成lcd布线的方法、阵列基板及其制法 The method of the etchant composition, formed lcd wiring, the array substrate and its preparation method
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