Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/21/2014CN103811404A 隔离结构及其形成方法 Isolation structure and method of forming
05/21/2014CN103811403A 浅沟槽隔离结构的形成方法 The method for forming a shallow trench isolation structure
05/21/2014CN103811402A 一种超高压bcd工艺的隔离结构制作工艺方法 Bcd process EHV making process for the isolation structure
05/21/2014CN103811401A 晶圆托架及包含该晶圆托架的工艺腔室 Wafer tray and the tray containing the wafer process chamber
05/21/2014CN103811400A 晶圆支撑基座 Wafer support pedestal
05/21/2014CN103811399A 一种半导体晶圆的支撑装置 A semiconductor wafer support device
05/21/2014CN103811398A 可调整拾取头和用于制造器件的方法 Adjustable pickup device and a method for manufacturing
05/21/2014CN103811397A 一种基板翻转对中装置 A substrate flip on the device
05/21/2014CN103811396A 圆片封装工艺用治具 Wafer packaging technology with a jig
05/21/2014CN103811395A 柔性显示装置的制造方法 The method of manufacturing a flexible display device
05/21/2014CN103811394A 载具晶圆及其制造方法以及封装方法 A carrier wafer and a manufacturing method and a method of packaging
05/21/2014CN103811393A 用于承载晶片的静电卡盘以及等离子体加工设备 For carrying the wafer and the electrostatic chuck plasma processing equipment
05/21/2014CN103811392A 晶圆叉件安装方法 Wafer fork mounting method
05/21/2014CN103811391A 晶圆位置调节装置 Wafer position regulating means
05/21/2014CN103811390A 晶粒定位装置、晶粒定位系统与晶粒定位方法 Positioning means grains, the grains and grain positioning system positioning method
05/21/2014CN103811389A 一种方型晶片对中结构 One kind of square wafer alignment structure
05/21/2014CN103811388A 两工位晶圆预对准装置 Two stations wafer pre-alignment apparatus
05/21/2014CN103811387A 晶圆预对准方法及装置 Method and apparatus for wafer pre-alignment
05/21/2014CN103811386A 基底传送设备和基底加工设备 A substrate transfer apparatus and a substrate processing equipment
05/21/2014CN103811385A 一种用于运送晶圆的机械手机构 An apparatus for transporting a wafer robot mechanism
05/21/2014CN103811384A 片盒倾斜及归位装置 Cassette tilt and homing device
05/21/2014CN103811383A 晶圆干燥装置及其干燥方法 Wafer drying apparatus and drying method
05/21/2014CN103811382A 用于烧结型半导体器件芯片台面腐蚀的装置 Sintered mesa etching semiconductor device chip device for
05/21/2014CN103811381A 晶片剥离装置及晶片剥离方法 Peeling device wafer and chip peeling method
05/21/2014CN103811380A 批处理式基板处理装置 Batch-type substrate processing apparatus
05/21/2014CN103811379A 工具优化调节系统和相关方法 Tools to optimize conditioning system and related methods
05/21/2014CN103811378A 一种半导体制造设备的自动移动装置 Automatic mobile device of a semiconductor manufacturing apparatus
05/21/2014CN103811377A 一种液体涂敷切边装置 A liquid coating trimming device
05/21/2014CN103811376A 一种液体喷洒装置 A liquid spray device
05/21/2014CN103811375A 分批处理硅片的装卸载装置和设备及方法 Batch loading and unloading apparatus and equipment and method for processing wafers
05/21/2014CN103811374A 一种晶圆浸泡装置 One kind of device wafer immersion
05/21/2014CN103811373A 一种单片湿法处理模块的工艺杯 A process for the monolithic cup wet processing module
05/21/2014CN103811372A 晶体管的测试结构以及测试方法 Testing and test methods transistor structure
05/21/2014CN103811371A 堆栈式半导体封装构件的测试设备及其测试方法 Test equipment and test methods stack type semiconductor package member
05/21/2014CN103811370A 取得均匀光源的装置与方法 Apparatus and method for obtaining a uniform light source
05/21/2014CN103811369A 铜连接孔刻蚀不足缺陷在线检测方法 Lack of connection holes etched copper line defect detection method
05/21/2014CN103811368A 芯片封装测试方法及其系统 Chip packaging and testing method and system
05/21/2014CN103811367A 产品缺陷检测方法 Defect detection method
05/21/2014CN103811366A 形成超声匹配层的方法及超声换能器 The method of forming ultrasound and ultrasound transducer matching layer
05/21/2014CN103811365A 芯片级封装方法 Chip-level packaging method
05/21/2014CN103811364A 一种实现基于bcb的磷化铟微波电路多层互联方法 An implementation based on indium phosphide bcb microwave circuit multilayer interconnect method
05/21/2014CN103811363A 半导体封装件的制法 The semiconductor package manufacturing method
05/21/2014CN103811362A 层叠封装结构及其制作方法 Stacked package structure and production methods
05/21/2014CN103811361A 一种智能卡芯片封装装置及封装方法 An intelligent card chip packaging equipment and packaging methods
05/21/2014CN103811360A 半导体封装件的制法 The semiconductor package manufacturing method
05/21/2014CN103811359A 半导体封装件的制法 The semiconductor package manufacturing method
05/21/2014CN103811358A 半导体封装件的制法 The semiconductor package manufacturing method
05/21/2014CN103811357A 超薄形圆片级封装制造方法 Slim-shaped wafer level packaging manufacturing method
05/21/2014CN103811356A 将cpu/gpu/逻辑芯片嵌入堆叠式封装结构的衬底的方法 The cpu / gpu / logic chip embedded in the substrate stacked package structure approach
05/21/2014CN103811355A 用于叠层封装器件的模制底部填充物 Molding the bottom of the stacked package of the device for the filler
05/21/2014CN103811354A 一种提高异质外延层晶体质量的方法 Method for improving the crystal quality of the heteroepitaxial layer method
05/21/2014CN103811353A 一种结型场效应晶体管及其制备方法 A junction field effect transistor and its preparation method
05/21/2014CN103811352A 具有GeSn源漏的MOSFET及其形成方法 Source and drain of the MOSFET has GeSn and method of forming
05/21/2014CN103811351A 形成外延部件的方法 The method of forming an epitaxial member
05/21/2014CN103811350A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811349A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
05/21/2014CN103811348A Mos器件及其形成方法 Mos device and method for forming
05/21/2014CN103811347A 晶体管的形成方法 The method for forming a transistor
05/21/2014CN103811346A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811345A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811344A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811343A FinFET及其制造方法 And a method of manufacturing FinFET
05/21/2014CN103811342A 鳍结构及其制造方法 Fin structure and manufacturing method
05/21/2014CN103811341A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811340A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811339A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811338A 一种半导体器件及其制备方法 A semiconductor device and its preparation method
05/21/2014CN103811337A 半导体装置的制造方法 The method of manufacturing a semiconductor device
05/21/2014CN103811336A 低功率应用的igbt功率器件及其制造方法 Igbt power device and method for manufacturing low-power applications
05/21/2014CN103811335A 氧化硅薄膜制备方法、氧化膜厚度控制装置及氧化炉 Preparation of a silicon oxide film, the oxide film thickness of the control device and the oxidation furnace
05/21/2014CN103811334A 四分之一节距图案的形成方法 The method for forming a pattern of a quarter pitch
05/21/2014CN103811333A 线路的制造方法 The method of manufacturing lines
05/21/2014CN103811332A 一种干法刻蚀设备的下部电极基台和干法刻蚀设备 A lower electrode dry etching equipment base stations and dry etching equipment
05/21/2014CN103811331A 一种具有倾斜侧壁刻蚀孔的刻蚀方法 An inclined bore sidewall etching method for etching has
05/21/2014CN103811330A 切削装置的卡盘工作台 Chuck table cutting device
05/21/2014CN103811329A 一种新的减薄工艺 A new thinning process
05/21/2014CN103811328A 防止多层外延生长时背面形成多晶颗粒的方法及背封结构 Method of preventing the formation of polycrystalline particles back of multilayer epitaxial growth and dorsal closure structure
05/21/2014CN103811327A 薄膜晶体管的制作方法 Production method of thin film transistor
05/21/2014CN103811326A 用于中间隙半导体设备的金属栅极结构及其制造方法 Metal gate structure and a manufacturing method of a semiconductor apparatus for clearance
05/21/2014CN103811325A 鳍式场效应管的形成方法 The method for forming a fin field effect transistor
05/21/2014CN103811324A 鳍式场效应管的形成方法 The method for forming a fin field effect transistor
05/21/2014CN103811323A 鳍部的制作方法、鳍式场效应晶体管及其制作方法 Production methods fin, the fin-type field effect transistor and manufacturing method thereof
05/21/2014CN103811322A 半导体结构及其形成方法 And a method for forming a semiconductor structure
05/21/2014CN103811321A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811320A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811319A 一种形成高k金属栅极的方法 A method of forming a high-k metal gate
05/21/2014CN103811318A 一种半导体器件及其制备方法 A semiconductor device and its preparation method
05/21/2014CN103811317A 一种改善mos管的栅极漏电的方法 A gate mos tube leakage way to improve
05/21/2014CN103811316A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811315A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811314A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/21/2014CN103811313A 降低外延中的图案负载效应 Reduce epitaxy pattern loading effects
05/21/2014CN103811312A 形成图案的方法 The method of forming a pattern
05/21/2014CN103811311A 用以改善线宽稳定性的SiON表面处理方法 SiON surface treatment method for improving the stability of the width
05/21/2014CN103811310A 电阻结构及其形成方法 Resistance structure and method of forming
05/21/2014CN103811309A 半导体结构及其形成方法 And a method for forming a semiconductor structure
05/21/2014CN103811308A 电感的形成方法 The method of forming an inductor
05/21/2014CN103811307A 半导体器件及其形成方法 Semiconductor device and method of forming
05/21/2014CN103811306A 闪存的形成方法 The method of forming the flash memory
05/21/2014CN103811305A 一种硅基半绝缘砷化镓衬底的制备方法 Method for preparing silicon semi-insulating GaAs substrate
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