Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/22/2014US20140141596 Wafer processing method
05/22/2014US20140141595 Gallium-nitride-on-diamond wafers and devices, and methods of manufacture
05/22/2014US20140141594 Method for Manufacturing a Semiconductor Device
05/22/2014US20140141593 Semiconductor device and method for forming the same
05/22/2014US20140141592 Method for Stress Reduced Manufacturing Semiconductor Devices
05/22/2014US20140141591 Method to Improve Charge Trap Flash Memory Core Cell Performance and Reliability
05/22/2014US20140141587 Transistor with improved sigma-shaped embedded stressor and method of formation
05/22/2014US20140141586 Guard Rings on Fin Structures
05/22/2014US20140141585 Trench gate type semiconductor device and method of producing the same
05/22/2014US20140141582 Cmos device and method of forming the same
05/22/2014US20140141581 Method of manufacturing graphene nanomesh and method of manufacturing semiconductor device
05/22/2014US20140141579 Method of manufacturing low temperature polysilicon film, thin film transistor and manufacturing method thereof
05/22/2014US20140141578 Local tailoring of fingers in multi-finger fin field effect transistors
05/22/2014US20140141576 Manufacturing Method for Switch and Array Substrate
05/22/2014US20140141575 Integrated circuit with a thin body field effect transistor and capacitor
05/22/2014US20140141571 Integrated circuit manufacturing for low-profile and flexible devices
05/22/2014US20140141570 Resin film forming sheet for chip, and method for manufacturing semiconductor chip
05/22/2014US20140141569 Semiconductor devices having through-via and methods of fabricating the same
05/22/2014US20140141568 Flip chip package for dram with two underfill materials
05/22/2014US20140141567 Flip-chip Semiconductor Chip Packing Method
05/22/2014US20140141549 Method for Producing an Electronic Component and Electronic Component
05/22/2014US20140141546 Method of fabricating optoelectronic integrated circuit substrate
05/22/2014US20140141544 Packaged microelectronic components
05/22/2014US20140141543 Semiconductor device having optical fuse and electrical fuse
05/22/2014US20140141542 Methods for depositing films on sensitive substrates
05/22/2014US20140141541 Loading port, system for etching and cleaning wafers and method of use
05/22/2014US20140141540 Resin coating device, and resin coating method
05/22/2014US20140141539 Apparatus and method of recognizing an object, and apparatus and method of mounting a semiconductor chip
05/22/2014US20140141537 Production of high precipitate density wafers by activation of inactive oxygen precipitate nuclei
05/22/2014US20140141536 Method and System for Providing a Target Design Displaying High Sensitivity to Scanner Focus Change
05/22/2014US20140141535 Method for aligning substrate and mask and method for preparing semiconductor device
05/22/2014US20140141534 dielectric doping using high productivity combinatorial methods
05/22/2014US20140140800 Robot arm, robot and robot operating method
05/22/2014US20140140792 Ultra-high vacuum (uhv) wafer processing
05/22/2014US20140140131 Three dimensional gate structures with horizontal extensions
05/22/2014US20140139776 Semiconductor Device and Method for Manufacturing the Same
05/22/2014US20140139762 Semiconductor device and method of fabricating the same
05/22/2014US20140138857 Encapsulant equipped with supporting substrate, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
05/22/2014US20140138856 Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus
05/22/2014US20140138855 Protection of a wafer-level chip scale package (wlcsp)
05/22/2014US20140138850 Semiconductor power module, production method of semiconductor power module and circuit board
05/22/2014US20140138848 Semiconductor device and manufacturing method thereof
05/22/2014US20140138847 Method for electrically connecting wafers using butting contact structure and semiconductor device fabricated through the same
05/22/2014US20140138846 Conductive ink for filling vias
05/22/2014US20140138845 Logic die and other components embedded in build-up layers
05/22/2014US20140138844 Patterned backside metal ground plane for improved metal adhesion
05/22/2014US20140138843 Method for Fabricating an Electronic Component
05/22/2014US20140138842 Continuous via for power grid
05/22/2014US20140138841 Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
05/22/2014US20140138838 Method of Semiconducotr integrated Circuit Fabrication
05/22/2014US20140138837 Sandwiched diffusion barrier and metal liner for an interconnect structure
05/22/2014US20140138835 Copper interconnect structure and method for manufacturing the same
05/22/2014US20140138833 Semiconductor Device Assembly Including a Chip Carrier, Semiconductor Wafer and Method of Manufacturing a Semiconductor Device
05/22/2014US20140138832 Copper seed layer for an interconnect structure having a doping concentration level gradient
05/22/2014US20140138830 Metal interconnection structure
05/22/2014US20140138829 Interconnection structure and method for fabricating the same
05/22/2014US20140138825 Molded insulator in package assembly
05/22/2014US20140138824 Offset integrated circuit packaging interconnects
05/22/2014US20140138818 Organic thin film passivation of metal interconnections
05/22/2014US20140138816 Method for Forming Package-on-Package Structure
05/22/2014US20140138814 Method for Producing an Integrated Circuit Pointed Element, and Corresponding Integrated Circuit
05/22/2014US20140138813 Method for Manufacturing an Electronic Component
05/22/2014US20140138811 A semiconductor device including a heat-spreading lid
05/22/2014US20140138809 Package structure and manufacturing method thereof
05/22/2014US20140138808 Leadframe area array packaging technology
05/22/2014US20140138806 Power overlay structure with leadframe connections
05/22/2014US20140138803 Chip arrangements and methods for manufacturing a chip arrangement
05/22/2014US20140138802 Method and Device for Manufacturing a Barrier Layer on a Flexible Substrate
05/22/2014US20140138801 Semiconductor patterning
05/22/2014US20140138800 Small pitch patterns and fabrication method
05/22/2014US20140138797 Dense finfet sram
05/22/2014US20140138792 Hybrid transformer structure on semiconductor devices
05/22/2014US20140138791 Semiconductor package and fabrication method thereof
05/22/2014US20140138790 Inter-Layer Insulator for Electronic Devices and Apparatus for Forming Same
05/22/2014US20140138767 Oxide terminated trench mosfet with three or four masks
05/22/2014US20140138758 Method of manufacturing semiconductor device and semiconductor device
05/22/2014US20140138749 Integrated circuit (ic) structure
05/22/2014US20140138746 Pseudomorphic high electron mobility transistor comprising doped low temperature buffer layer
05/22/2014US20140138740 Electrostatic Discharge Protection Structure And Fabrication Method Thereof
05/22/2014US20140138720 Semiconductor element and display device using the same
05/22/2014US20140138708 Semiconductor device and method of manufacturing the same
05/22/2014US20140138703 Optoelectronic Semiconductor Body and Method for Producing an Optoelectronic Semiconductor Body
05/22/2014US20140138702 Substrate recycling method and recycled substrate
05/22/2014US20140138700 Nitride-based semiconductor device and method for manufacturing the same
05/22/2014US20140138699 Nitride semiconductor device, nitride semiconductor wafer, and method for forming nitride semiconductor layer
05/22/2014US20140138696 Polycrystalline silicon thick films for photovoltaic devices or the like, and methods of making same
05/22/2014US20140138695 Low temperature polycrystalline silicon thin film and method of producing the same, array substrate and display apparatus
05/22/2014US20140138686 Protection of an integrated circuit against attacks
05/22/2014US20140138685 Array Substrate, Method for Fabricating and Testing Array Substrate, and Display Device
05/22/2014US20140138679 Planar nonpolar group-iii nitride films grown on miscut substrates
05/22/2014US20140138672 Controlled manufacturing method of metal oxide semiconductor and metal oxide semiconductor structure having controlled growth crystallographic plane
05/22/2014US20140138611 IN NANOWIRE, DEVICE USING THE SAME AND METHOD OF MANUFACTURING In NANOWIRE
05/22/2014US20140138362 Novel thermal processing apparatus
05/22/2014US20140137961 Modular chemical delivery system
05/22/2014US20140137902 Substrate processing apparatus
05/22/2014US20140137893 Substrate processing apparatus, substrate processing method and storage medium
05/22/2014US20140137892 Method and system of process chemical temperature control using an injection nozzle
05/22/2014US20140137800 Device for producing compound semiconductor and wafer retainer
05/22/2014DE19924568B4 Ladungspumpe Charge pump
05/22/2014DE112012003619T5 Flüssigkeitsauftragsvorrichtung und Flüssigkeitsauftragsverfahren Liquid applicator and liquid application process
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