Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/21/2014CN203607372U 湿蚀刻机台 Wet etching machine
05/21/2014CN203607371U 液体吸回系统 Liquid sucked back into the system
05/21/2014CN103814444A 高电压mosfet及其制造方法 A high voltage and a manufacturing method mosfet
05/21/2014CN103814439A 模块基板 Module substrate
05/21/2014CN103814437A 复合基板的制造方法及复合基板 The method of manufacturing a composite substrate and a composite substrate
05/21/2014CN103814436A 用于制造通过剥离来分离的复合结构的方法 The method of producing a composite structure separated by for peeling
05/21/2014CN103814435A 用于使层从复合结构分离的方法 The method used to layer separated from the composite structure
05/21/2014CN103814434A 晶片保持器和温度调节装置和制造晶片的方法 The method of the wafer holder and the temperature regulating means and producing wafers
05/21/2014CN103814433A 引线接合装置以及引线接合方法 Apparatus and method for wire bonding wire bonding
05/21/2014CN103814432A 增大蚀刻液蚀刻用量的铜/钼合金膜的蚀刻方法 Etching method to increase the amount of copper etching solution / molybdenum alloy film
05/21/2014CN103814431A 用于介电材料的沉积速率提高和生长动力学增强的多频溅射 The deposition rate for the dielectric material and improve the growth kinetics of the enhanced multi-frequency sputtering
05/21/2014CN103814430A 溅射设备和用于形成发光器件的透射导电层的方法 Transmissive conductive layer and a sputtering apparatus for forming a light emitting device
05/21/2014CN103814429A 具有正交底层虚拟填充的叠盖目标 The underlying virtual filled with orthogonal overlapping goals
05/21/2014CN103814428A 超疏水薄膜片材的制备方法 The method for preparing a superhydrophobic film sheet
05/21/2014CN103814427A 压印用固化性组合物、图案形成方法和图案 Embossing a pattern forming method and the curable composition, pattern
05/21/2014CN103814301A Ic测试用插座装置 Ic test socket device
05/21/2014CN103814160A 复合基板、其制造方法、13族元素氮化物构成的功能层的制造方法以及功能元件 Composite substrate, its manufacturing method, a method of manufacturing the functional layer 13 of the nitride elements and functional elements
05/21/2014CN103814100A 粘接剂组合物、膜状粘接剂、粘接片材、电路连接体、电路构件的连接方法、粘接剂组合物的使用、膜状粘接剂的使用以及粘接片材的使用 Using an adhesive composition, the film-like adhesive, adhesive sheet, a circuit-connected body, the circuit member connection method, the use of the adhesive composition, the use of film-like adhesive and bonding the sheet
05/21/2014CN103813896A 表面具有微细凹凸结构的透明薄膜、其制造方法及用于制造透明薄膜的基材薄膜 Surface of the transparent film having a fine concavo-convex structure, and a manufacturing method thereof for manufacturing a transparent film base film
05/21/2014CN103811992A 一种半导体激光器芯片及其制造方法 A semiconductor laser chip and its manufacturing method
05/21/2014CN103811669A 有机发光器件、有机发光二极管显示装置及制造方法 The organic light emitting device, an organic light emitting diode display device and its manufacturing method
05/21/2014CN103811588A 一种太阳能电池的双面扩散工艺 Duplex diffusion process A solar cell
05/21/2014CN103811562A 变容二极管、电器件及其制造方法 Varactor diode, and a manufacturing method of the electrical device
05/21/2014CN103811560A 钳位二极管及其版图结构和其制造方法 Clamping diodes and layout structure and its manufacturing method
05/21/2014CN103811558A 一种薄膜晶体管及其制作方法、阵列基板和显示装置 A thin film transistor and manufacturing method, the array substrate and display device
05/21/2014CN103811556A 硅衬底的三氧化二铝栅介质双栅石墨烯晶体管及制备方法 Aluminum oxide gate dielectric double-gate transistor and a graphene prepared silicon substrate
05/21/2014CN103811554A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811553A 带有通过电阻器电路互连的有源器件和隔离结构的半导体器件和驱动电路及其制作方法 The semiconductor device and driver circuit having an active device and the isolation structure are interconnected via a resistor and its manufacturing method of the circuit
05/21/2014CN103811552A 半导体装置及其形成方法 Semiconductor device and method of forming
05/21/2014CN103811551A 包括用于栅极电极的低k电介质帽层的半导体器件及相关方法 A semiconductor device including a low k dielectric cap layers and associated methods for the gate electrode,
05/21/2014CN103811550A 半导体器件的接触结构 Contact structure of a semiconductor device
05/21/2014CN103811549A 横向mosfet Lateral mosfet
05/21/2014CN103811548A 具有低密勒电容的金氧半场效应晶体管器件及其制作方法 Gold oxygen half-effect transistor device and manufacturing method has a low Miller capacitance
05/21/2014CN103811547A 降低ldmos器件峰值电场的版图结构及方法 Ldmos layout structure and method to reduce peak electric field of the device
05/21/2014CN103811545A 一种改善扩散区域形貌的功率器件及其制造方法 A method for improving the morphology of the diffusion region and a manufacturing method of a power device
05/21/2014CN103811544A 漂移区具有横向浓度梯度的ldmos管及其制造方法 The drift region having a tube and a method of manufacturing a lateral ldmos concentration gradient
05/21/2014CN103811543A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811540A 锗硅hbt晶体管及其版图结构和其制造方法 SiGe hbt transistor and layout structure and its manufacturing method
05/21/2014CN103811538A 具有器件收益和生产率改进的金属栅极结构 Device revenue and productivity has improved metal gate structure
05/21/2014CN103811537A 一种大尺寸晶圆及其制备方法 One kind of large-size wafers and its preparation method
05/21/2014CN103811535A 保护半导体鳍不受侵蚀的结构及其制造方法 Protection structure and method of manufacturing a semiconductor fin from erosion
05/21/2014CN103811515A 逻辑兼容的rram结构和工艺 Logic compatible rram structure and process
05/21/2014CN103811514A 逻辑兼容rram结构和工艺 Structure and process logic compatible rram
05/21/2014CN103811510A 图像传感器的像素单元及其形成方法 Pixel cell and method of forming an image sensor
05/21/2014CN103811504A 对CMOS图像传感器的HfO<sub>2</sub>/SiO<sub>2</sub>-Si界面的改进 For CMOS image sensors HfO <sub> 2 </ sub> / SiO <sub> 2 </ sub> -Si interface improvements
05/21/2014CN103811503A 阵列基板及制备方法、显示面板 Array substrate and the preparation method, the display panel
05/21/2014CN103811502A 阵列基板、阵列基板的制备方法、显示装置 Preparation array substrate, the array substrate, a display device
05/21/2014CN103811499A 薄膜晶体管阵列面板及其制造方法 The thin film transistor array panel and a manufacturing method
05/21/2014CN103811498A 一种低电场源极抹除非挥发性内存单元及其制造方法 A low electric field source wipe unless volatile memory cell and its manufacturing method
05/21/2014CN103811496A 用于具有提高编程效率的非易失性存储单元的方法和装置 The method and apparatus having improved efficiency of programming a nonvolatile memory cell for
05/21/2014CN103811495A 三维存储器装置及其制造方法 A memory device and a method of manufacturing a three-dimensional
05/21/2014CN103811493A 半导体器件及其形成方法 Semiconductor device and method of forming
05/21/2014CN103811491A 一种可调恒流源集成芯片及制造方法 An adjustable constant current source integrated chip and manufacturing method
05/21/2014CN103811490A 带有由二极管电路互连的有源器件和隔离结构的半导体器件和驱动电路及制造方法 And a driver circuit with a semiconductor device and manufacturing method of the active device and the isolation structure are interconnected by a diode circuit
05/21/2014CN103811489A 基于薄膜晶体管的微波毫米波集成电路、功率交换电路及其制作方法 Circuit and method of making the exchange of microwave and millimeter wave integrated circuits based on thin-film transistor, power
05/21/2014CN103811488A Esd防护结构及方法 Esd protection structure and method
05/21/2014CN103811486A 保护装置以及相关制作方法 Apparatus and associated method of making protection
05/21/2014CN103811481A 具有金红石结晶相二氧化钛介电膜的半导体器件 The semiconductor device having the rutile crystalline phase titanium dioxide dielectric film
05/21/2014CN103811480A 具有感应装置的载板封装结构及制作方法 Carrier package structure and method of preparing a sensor device
05/21/2014CN103811474A 半导体器件、半导体器件的制造方法及天线开关模块 The method of manufacturing a semiconductor device, the semiconductor device and the antenna switch module
05/21/2014CN103811473A 一种多层膜结构的多源调控的阻变存储器及其制备方法 Multi-source regulation of a multilayer film structure resistance change memory and its preparation method
05/21/2014CN103811472A 半导体封装件和制造半导体封装件的方法 The method of manufacturing a semiconductor package and a semiconductor package
05/21/2014CN103811469A 测试结构和测试方法 Test structures and test methods
05/21/2014CN103811468A 一种可寻址测试芯片及其测试方法 , An addressable test chip and test methods
05/21/2014CN103811465A 封装结构和其制作方法 Package structure and its manufacturing method
05/21/2014CN103811464A 铜互连结构及其制造方法 Copper interconnect structure and manufacturing method
05/21/2014CN103811463A 用于decap的埋入式tsv The submerged tsv for decap
05/21/2014CN103811461A 内连线结构和其制作方法 Interconnection structure and its manufacturing method
05/21/2014CN103811460A 包括具有集成电路后端电容器及集成电路后端薄膜电阻器的半导体结构的电子装置及其制造方法 Includes a method of manufacturing an electronic device and an integrated circuit capacitor and a rear end of the rear end of the thin film resistors integrated semiconductor structure
05/21/2014CN103811458A 切割具有硅穿通道的半导体晶圆的方法及其所形成的结构 The method of cutting a silicon semiconductor wafer through the channels formed by its structure
05/21/2014CN103811452A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/21/2014CN103811449A 焊球凸块结构及其形成方法 Solder bump structure and method of forming
05/21/2014CN103811448A 弯曲轮廓的堆叠封装件接头 The curved profile of the stacked package header
05/21/2014CN103811447A 焊料、接点结构及接点结构的制作方法 Production methods solder joint structure and contact structure
05/21/2014CN103811446A 一种半导体器件中的铜线键接结构及其制造方法 A semiconductor device bonded to the copper structure and manufacturing method
05/21/2014CN103811444A 电子装置、系统级封装模块及系统级封装模块的制造方法 The method of manufacturing an electronic device, the system-level and system-level encapsulation module package module
05/21/2014CN103811442A 基板的连接结构及其制法 Jiqizhifa board connecting structure
05/21/2014CN103811440A 半导体装置及其形成方法、半导体电路及其使用方法 Semiconductor device and method of forming a semiconductor circuit and method of use
05/21/2014CN103811430A 层叠封装结构及其形成方法 Laminated packaging structure and method of forming
05/21/2014CN103811428A 用于具有保护环的倒装芯片衬底的方法和装置 Methods and apparatus for flip-chip substrate having a protective ring
05/21/2014CN103811426A 用于固定半导体封装件的承载件与半导体封装件的制法 For fixing the carrier of the semiconductor package and the semiconductor package manufacturing method
05/21/2014CN103811423A 存储器件的形成方法 The method of forming a memory device
05/21/2014CN103811422A 一种cmos硅片裂片的处理装置及其处理方法 Processing apparatus and method for processing silicon wafers lobes cmos
05/21/2014CN103811421A 一种形成氧化层的方法 A method of forming an oxide layer,
05/21/2014CN103811420A 一种半导体器件的制备方法 Preparation method of a semiconductor device
05/21/2014CN103811419A 半导体片芯单颗化方法和装置 Single semiconductor die method and apparatus
05/21/2014CN103811418A 切削装置 Cutting device
05/21/2014CN103811417A 像素结构的制作方法 Production method of a pixel structure
05/21/2014CN103811416A 硅通孔侧壁的平坦化方法 Planarization method TSV sidewall
05/21/2014CN103811415A 具有改进的形貌控制的衬底通孔形成 With improved control of the morphology of the substrate through holes formed
05/21/2014CN103811414A 铜蚀刻集成方法 Copper etching integrated approach
05/21/2014CN103811413A 半导体基片的制造工艺方法 A process of manufacturing a semiconductor substrate,
05/21/2014CN103811412A 一种钨插塞与金属布线的制作方法 A method of manufacturing a tungsten plug in the plug and the metal wiring
05/21/2014CN103811411A 通孔的制作方法 The method of making the through hole
05/21/2014CN103811410A 找到通孔弱连接的方法 Find a way to connect through holes weak
05/21/2014CN103811409A 一种增强低介电材料对TiN硬掩模刻蚀选择性的方法 A low dielectric material TiN hard mask etch selectivity of the method to enhance
05/21/2014CN103811408A 一种深硅通孔刻蚀方法 A dark TSV etching method
05/21/2014CN103811407A 硅片的背面图形化的工艺方法 The back of the wafer patterning process for
05/21/2014CN103811406A 改善sonos器件自对准接触孔漏电的方法 Improve self-aligned contact hole leakage method sonos devices
05/21/2014CN103811405A 一种高压发光二级管的制备方法 Method for preparing high-voltage light-emitting diode
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