Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/28/2014CN102187440B 电容器、电介质结构和形成电介质结构的方法 A capacitor, the dielectric structure and method of forming a dielectric structure
05/28/2014CN102169849B 芯片保持用胶带、工件保持方法和半导体装置制造方法 Chip holding holding method and a semiconductor device manufacturing method with tape, the workpiece
05/28/2014CN102169821B 用于生产半导体晶片的方法 A method for producing a semiconductor wafer
05/28/2014CN102163570B 基板处理装置及真空进片装置 Substrate processing apparatus and a vacuum device into pieces
05/28/2014CN102163542B 薄膜电子元件的单片化方法及由其制造的电子元件搭载粘着性薄片 Singulation method of thin film electronic components and electronic components manufactured by mounting adhesive sheet
05/28/2014CN102157456B 三维系统级封装方法 Three-dimensional system-level packaging method
05/28/2014CN102141709B 具有面板内栅极结构的液晶显示设备 Gate structure having a liquid crystal panel in the display device
05/28/2014CN102132402B 薄箔半导体封装 Thin foil semiconductor package
05/28/2014CN102124547B 立式热处理装置及热处理方法 Vertical heat treatment apparatus and heat treatment method
05/28/2014CN102033370B 液晶显示基板及其制造方法 The liquid crystal display substrate and a method of manufacturing
05/28/2014CN101978503B 半导体基板、半导体基板的制造方法及半导体装置 A semiconductor substrate, a semiconductor substrate and a method of manufacturing a semiconductor device
05/28/2014CN101936409B 供气单元和供气装置 Supply unit and supply unit
05/28/2014CN101930960B 集成电路芯片封装和形成方法 And a method of forming an integrated circuit chip package
05/28/2014CN101884104B 感光性粘接剂 The photosensitive adhesive
05/28/2014CN101883659B 用于从半导体结构获得单个芯片的方法 Method to obtain a single chip from the semiconductor structure for the
05/28/2014CN101857377B 电子装置用玻璃衬底以及电子装置的制造方法 The method of manufacturing an electronic device using a glass substrate, and the electronic device
05/28/2014CN101794819B 薄膜晶体管、其制备方法和包括它的平板显示装置 A thin film transistor, its preparation method and its flat panel display device comprising
05/28/2014CN101714505B 应用硬化剂对应变材料层的松弛 Relaxation of the strained material hardener application layer
05/28/2014CN101573779B 混合光学和电子束光刻制造层的共对准的沟槽结构及方法 Co-alignment of the trench structure and method of hybrid optical and electron beam lithography manufacturing layer
05/28/2014CN101325211B 磁传感器及其制造方法 Magnetic sensor and manufacturing method
05/28/2014CN101165855B 基板平台和等离子处理装置 Substrate stage and a plasma processing apparatus
05/28/2014CN101000462B 光固化性树脂组合物及形成图案的方法 The photocurable resin composition and a method for forming a pattern
05/27/2014US8739075 Method of making pattern data, and medium for storing the program for making the pattern data
05/27/2014US8738167 3D integrated circuit device fabrication with precisely controllable substrate removal
05/27/2014US8736735 Solid-state imaging device, method of manufacturing the same, and electronic apparatus
05/27/2014US8736728 Image sensor with controllable vertically integrated photodetectors
05/27/2014US8736645 Printhead fabrication methods and printheads
05/27/2014US8736296 Stacked semiconductor apparatus with configurable vertical I/O
05/27/2014US8736160 Light-emitting apparatus and method for manufacturing same
05/27/2014US8736076 Multi-chip stacking of integrated circuit devices using partial device overlap
05/27/2014US8736069 Multi-level vertical plug formation with stop layers of increasing thicknesses
05/27/2014US8736068 Hybrid bonding techniques for multi-layer semiconductor stacks
05/27/2014US8736056 Device for reducing contact resistance of a metal
05/27/2014US8736054 Multilayer metallization with stress-reducing interlayer
05/27/2014US8736038 Lead frame having increased stability due to reinforced die pads and packaging method using such lead frame
05/27/2014US8736023 Field effect transistor device and fabrication
05/27/2014US8736019 Semiconductor devices with sealed, unlined trenches and methods of forming same
05/27/2014US8736018 Semiconductor devices and methods of manufacturing semiconductor devices
05/27/2014US8736017 Semiconductor device and method for fabricating the same
05/27/2014US8736014 High mechanical strength additives for porous ultra low-k material
05/27/2014US8736007 Method for forming structure for reducing noise in CMOS image sensors
05/27/2014US8736002 Sensor mounted in flip-chip technology at a substrate edge
05/27/2014US8736001 Finger sensor including encapsulating layer over sensing area and related methods
05/27/2014US8735996 Scavenging metal stack for a high-K gate dielectric
05/27/2014US8735991 High gate density devices and methods
05/27/2014US8735990 Radiation hardened FinFET
05/27/2014US8735984 FinFET with novel body contact for multiple Vt applications
05/27/2014US8735983 Integrated circuit transistors with multipart gate conductors
05/27/2014US8735980 Configuration and fabrication of semiconductor structure using empty and filled wells
05/27/2014US8735972 SRAM cell having recessed storage node connections and method of fabricating same
05/27/2014US8735971 Method for producing semiconductor device and semiconductor device
05/27/2014US8735968 Integrated MOSFET devices with Schottky diodes and associated methods of manufacturing
05/27/2014US8735967 Semiconductor memory device and method of manufacturing the same
05/27/2014US8735962 Semiconductor device and method of manufacturing the same
05/27/2014US8735958 Multi-layer polysilicon suppression of implant species penetration
05/27/2014US8735954 Semiconductor device and method for producing the same
05/27/2014US8735937 Fully isolated LIGBT and methods for forming the same
05/27/2014US8735923 Semiconductor light emitting device and manufacturing method thereof
05/27/2014US8735921 Light emitting device, light emitting device package, and lighting system
05/27/2014US8735908 Semiconductor device, electro-optic device, power conversion device, and electronic apparatus
05/27/2014US8735907 Ohmic electrode for use in a semiconductor diamond device
05/27/2014US8735904 Semiconductor device
05/27/2014US8735902 Memories with memory arrays extending in opposite directions from a semiconductor and their formation
05/27/2014US8735896 Light-emitting device
05/27/2014US8735891 Display substrate and method of manufacturing the same
05/27/2014US8735889 Semiconductor device and manufacturing method thereof
05/27/2014US8735863 Integrated nonvolatile resistive memory elements
05/27/2014US8735858 Ionic devices with interacting species
05/27/2014US8735840 Solid-body X-ray image detector with circular detector surface area
05/27/2014US8735772 Method and apparatus for improved laser scribing of opto-electric devices
05/27/2014US8735716 Solar cell and method for fabricating the same
05/27/2014US8735305 Methods of forming fluorinated hafnium oxide gate dielectrics by atomic layer deposition
05/27/2014US8735304 Film forming method, film forming apparatus, and storage medium
05/27/2014US8735303 Methods of forming PEET devices with different structures and performance characteristics
05/27/2014US8735302 High productivity combinatorial oxide terracing and PVD/ALD metal deposition combined with lithography for gate work function extraction
05/27/2014US8735301 Method for manufacturing semiconductor integrated circuit
05/27/2014US8735300 Method of forming contact hole
05/27/2014US8735299 Semiconductor device manufacturing method and computer-readable storage medium
05/27/2014US8735298 Method for spatial and temporal control of temperature on a substrate
05/27/2014US8735297 Reverse optical proximity correction method
05/27/2014US8735296 Method of simultaneously forming multiple structures having different critical dimensions using sidewall transfer
05/27/2014US8735295 Method of manufacturing dual damascene structure
05/27/2014US8735294 Method for fabricating a vertical LDMOS device
05/27/2014US8735293 Chemical mechanical polishing composition and methods relating thereto
05/27/2014US8735292 Semiconductor processing methods
05/27/2014US8735291 Method for etching high-k dielectric using pulsed bias power
05/27/2014US8735290 Amorphous group III-V semiconductor material and preparation thereof
05/27/2014US8735289 Method of contacting a doping region in a semiconductor substrate
05/27/2014US8735288 Semiconductor device and information processing system including the same
05/27/2014US8735287 Semiconductor packaging process using through silicon vias
05/27/2014US8735286 Deposition-free sealing for micro- and nano-fabrication
05/27/2014US8735285 Method for providing electrical connections to spaced conductive lines
05/27/2014US8735284 Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates
05/27/2014US8735283 Method for forming small dimension openings in the organic masking layer of tri-layer lithography
05/27/2014US8735282 Semiconductor device and manufacturing method therefor
05/27/2014US8735281 Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same
05/27/2014US8735280 Method of semiconductor integrated circuit fabrication
05/27/2014US8735279 Air-dielectric for subtractive etch line and via metallization
05/27/2014US8735278 Copper etch scheme for copper interconnect structure
05/27/2014US8735277 Methods for producing an ultrathin semiconductor circuit
1 ... 233 234 235 236 237 238 239 240 241 242 243 244 245 246 247 248 249 250 251 252 253 ... 6590