Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/15/2014DE102012110774A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
05/15/2014DE102012105685B4 Halbleiterbauelement mit Spannungskompensationsstruktur Semiconductor device with voltage compensation structure
05/15/2014DE102012022067A1 Substrathalter sowie eine vorrichtung und ein verfahren zum behandeln von substraten Substrate holder, and an apparatus and a method for treating substrates
05/15/2014DE102010055935B4 Verfahren zum Verbinden mehrerer ungehäuster Substrate A method for connecting a plurality of bare substrates
05/15/2014DE102010027238B4 Verwendung einer Sägevorrichtung und Verfahren zur Herstellung eines in Szintillatorelemente strukturierten Szintillators sowie Szintillator mit Szintillatorelementen Use of a sawing device and process for the preparation of a structured scintillator in the scintillator, and the scintillator with scintillator
05/15/2014DE102010009795B4 Verfahren und Vorrichtung zur Herstellung von metallischen Rückkontakten für waferbasierte Solarzellen Method and device for producing metallic back contact for wafer based solar cells
05/15/2014DE102009044605B4 Verfahren zum Herstellen eines Halbleiter-Package unter Verwendung eines Trägers mit einem Hügel A method of manufacturing a semiconductor package using a carrier with a hill
05/15/2014DE102009042319B9 Verfahren zur Herstellung eines Sensorknoten-Moduls A method for producing a sensor node module
05/15/2014DE102009006580B4 Verfahren zur Herstellung integrierter Schaltungen und Verfahren zum Vereinzeln eines Halbleiterwafers A process for the production of integrated circuits and methods for dicing a semiconductor wafer
05/15/2014DE102008056574B4 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
05/15/2014DE102008045338B4 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
05/15/2014DE102008035813B4 Durchlassstromeinstellung für Transistoren durch lokale Gateanpassung Forward current setting for transistors by gate local adaptation
05/15/2014DE102008001943B4 Halbleiterbauelement und zugehöriges Herstellungsverfahren A semiconductor device and manufacturing method thereof
05/15/2014DE102006062958B3 Verfahren zum Herstellen einer integrierten DRAM - Speicherschaltung A method of fabricating an integrated DRAM - memory circuit
05/15/2014DE102006050360B4 Verfahren zum Erzeugen eines elektrischen Kontakts auf SiC A method of producing an electrical contact to SiC
05/14/2014EP2731145A2 Semiconductor device and driver circuit with an active device and isolation structure interconnected through a diode circuit, and method of manufacture thereof
05/14/2014EP2731144A2 Semiconductor device and driver circuit with an active device and isolation structure interconnected through a resistor circuit, and method of manufacture thereof
05/14/2014EP2731143A2 Power semiconductor device
05/14/2014EP2731141A1 Method for manufacturing a field effect tansistor having a SiGe channel using ion implantation
05/14/2014EP2731133A2 Interconnection structure and fabrication thereof
05/14/2014EP2731132A2 Package structure and method of forming the same
05/14/2014EP2731130A1 Cavity package for an integrated circuit
05/14/2014EP2731129A1 Molded semiconductor sensor device and method of producing the same at a wafer-level
05/14/2014EP2731127A1 Tft array substrate, method of fabricating same, and display device
05/14/2014EP2731126A1 Method for bonding bare chip dies
05/14/2014EP2730676A1 Method for deposition of silicon nitride layers
05/14/2014EP2730028A1 Method and apparatus for self-annealing multi-die interconnect redundancy control
05/14/2014EP2729965A1 Method for producing structured sintering connection layers and semiconductor component comprising a structured sintering connection layer
05/14/2014EP2729963A1 Half-through vias for suppression of substrate modes
05/14/2014EP2729962A1 Holding device for holding a patterned wafer
05/14/2014EP2729961A1 Method for permanently bonding wafers by a connecting layer by means of solid-state diffusion or phase transformation
05/14/2014EP2729534A2 Metal-oxide films from small molecules for lithographic applications
05/14/2014CN203596357U 一种电池片的分选工装 A battery chip sorting clothes
05/14/2014CN203596342U 半导体扩散设备的石英舟升降装置 Quartz boat lifting device semiconductor diffusion equipment
05/14/2014CN203596341U 一种智能卡模块条带接带机 An intelligent card module strips connected with a machine
05/14/2014CN203596340U 一种智能卡模块的连续uv封装工装 Continuous uv a smart card module encapsulation tooling
05/14/2014CN203596339U 一种控制智能卡模块封装尺寸的uv封装设备 A control smart card module package size uv packaging equipment
05/14/2014CN203596338U 一种控制智能卡模块封装尺寸的uv封装设备 A control smart card module package size uv packaging equipment
05/14/2014CN203596337U 一种打火杆烧球的氮气保护装置 An ignition rod burning ball of nitrogen protective devices
05/14/2014CN203595821U 纠偏装置及等离子设备 Corrective devices and plasma equipment
05/14/2014CN203595477U 一种半导体致冷器晶片厚度检测装置 A semiconductor wafer thickness detector cooler
05/14/2014CN103797573A 基于氮化物的忆阻器 Nitride-based memristor
05/14/2014CN103797572A 高耐压半导体装置 High-voltage semiconductor device
05/14/2014CN103797571A 贯穿硅过孔的泄漏测量 Leakage measurement through silicon vias
05/14/2014CN103797570A 接触电性连接至位于晶圆的划片线上的测试访问接口的半导体芯片的方法、装置以及系统 Test access interface of the semiconductor chip electrically connected to the contact method of the wafer in the dicing line, the apparatus and system
05/14/2014CN103797569A 金属凸块的焊料沉积系统和方法 Solder deposition system and method for metal bump
05/14/2014CN103797568A 用于挠性电子装置的高吞吐量外延剥离 Electronic device for the flexible high-throughput epitaxial peeling
05/14/2014CN103797567A 具有保护膜形成层的切割膜片和芯片的制造方法 Having a method for producing a protective film forming layer, the diaphragm and the cutting chip
05/14/2014CN103797566A 形成贯穿衬底的导通体的方法 The method of forming a conductive substrate throughout the whole body
05/14/2014CN103797565A 在激光处理系统中的颗粒控制 In the laser processing system of the particle control
05/14/2014CN103797564A 使用微透镜阵列而产生线路的光学设计 Using a micro lens array and the optical design of the line generated
05/14/2014CN103797563A 具备原料浓度检测结构的原料气化供给装置 With the concentration of the raw material evaporation supply apparatus of a raw material detection structure
05/14/2014CN103797562A 使用相变油墨的柔性彩色滤光片基底及其制备方法 A color filter using a flexible substrate and a preparation method of a phase change ink
05/14/2014CN103797561A 用于喷墨头的喷射量校正方法、喷射量校正装置 Injection amount correction method for an ink jet head, the injection quantity correction means
05/14/2014CN103797155A 用于直线型大面积等离子体反应器中均匀处理的气体输送和分配 For gas transmission and distribution of the linear type large area uniform plasma processing reactor
05/14/2014CN103797152A 高纯度铜锰合金溅射靶 High-purity copper-manganese alloy sputtering target
05/14/2014CN103797078A 电路连接材料以及使用该电路连接材料的连接方法和连接结构体 Circuit connecting material and the use of the circuit connecting material connection method and connecting structure
05/14/2014CN103796413A 等离子反应器及制作半导体基片的方法 Plasma reactor and method for producing a semiconductor substrate
05/14/2014CN103795340A 一种聚光型便携光源的功率表测试高倍聚光电池片装置 One kind of portable concentrator test high-power light source, power meter concentrator solar cell device
05/14/2014CN103794739A 有机el装置的制造方法、有机el装置、电子设备 Means for producing an organic el organic el device, electronic equipment
05/14/2014CN103794676A 太阳能电池组件工位传输装置 Solar cell module station transmission apparatus
05/14/2014CN103794653A 带有很高的衬底-栅极击穿和嵌入式雪崩箝位二极管的横向超级结器件 The substrate with a high - and embedded gate avalanche breakdown diode clamp lateral super junction devices
05/14/2014CN103794652A 金属氧化物半导体薄膜晶体管及其制备方法 A metal oxide semiconductor thin film transistor and a method for preparing
05/14/2014CN103794651A 一种薄膜晶体管及其制备方法、阵列基板、显示装置 A thin film transistor and a preparation method, the array substrate, a display device
05/14/2014CN103794650A 集成esd保护的耗尽型功率mos器件及其制备方法 Esd protection integrated power mos depletion mode device and its preparation method
05/14/2014CN103794649A 半导体器件和用于制造半导体器件的方法 The semiconductor device and a method for manufacturing a semiconductor device
05/14/2014CN103794647A 一种双向igbt器件及其制作方法 A two-way igbt device and manufacturing method thereof
05/14/2014CN103794645A Igbt器件及其制作方法 Igbt device and manufacturing method thereof
05/14/2014CN103794644A 一种磷化铟基双异质结双极晶体管结构及制备方法 One kind of InP-based double-heterojunction bipolar transistor structure and preparation methods
05/14/2014CN103794643A 一种基于槽栅高压器件及其制作方法 A trench-gate high voltage device and its production method based on
05/14/2014CN103794640A 包括单元区域和边缘区域的超结半导体器件 Super junction semiconductor device includes a cell region and the edge region
05/14/2014CN103794638A 一种igbt器件及其制作方法 One kind igbt device and manufacturing method thereof
05/14/2014CN103794633A 一种阵列基板及其制作方法、显示装置 One kind of array substrate and method of manufacturing a display device
05/14/2014CN103794628A 有机发光显示装置及其制造方法 The organic light emitting display device and its manufacturing method
05/14/2014CN103794624A 有机发光器件及其制造方法 The organic light emitting device and its manufacturing method
05/14/2014CN103794623A 有机发光显示面板及其制造方法 The organic light emitting display panel and manufacturing method
05/14/2014CN103794610A 非挥发性内存单元及其制造方法 Non-volatile memory cell and its manufacturing method
05/14/2014CN103794609A 非挥发性内存单元及非挥发性内存矩阵 Non-volatile memory cell and non-volatile memory matrix
05/14/2014CN103794605A 具有限定有源区的线型沟道的半导体装置及其形成方法 The semiconductor device having an active region defined linear channel and forming method
05/14/2014CN103794598A 硅通孔测试版图、测试结构、制备方法及量测方法 TSV test layout, test structure, preparation and measurement methods
05/14/2014CN103794595A Pop封装结构及其封装方法 Pop package and packaging method
05/14/2014CN103794587A 一种高散热芯片嵌入式重布线封装结构及其制作方法 A high-heat-chip embedded rewiring package structure and production methods
05/14/2014CN103794586A 短的和低的回路丝线键合 Short circuit and a low bonding wires
05/14/2014CN103794585A 半导体功率转换器及其制造方法 The semiconductor power converter and manufacturing method
05/14/2014CN103794584A 用于半导体晶圆的混合接合机制 For mixing the bonding mechanism of a semiconductor wafer
05/14/2014CN103794583A 一种增强焊球与ubm粘附性的方法及封装结构 A method of enhancing the adhesion of the solder ball and ubm package structure
05/14/2014CN103794576A 一种封装结构及封装方法 A packaged structure and encapsulation method
05/14/2014CN103794575A 一种封装结构及封装方法 A packaged structure and encapsulation method
05/14/2014CN103794574A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/14/2014CN103794573A 电子封装模块及其制造方法 Electronic package module and a manufacturing method
05/14/2014CN103794572A 模塑封装及其制造方法 Package and method of manufacturing the molded
05/14/2014CN103794570A 芯片封装结构及封装用线路板制造方法 Chip package structure and encapsulation circuit board manufacturing method
05/14/2014CN103794569A 封装结构及其制法 Package structure Jiqizhifa
05/14/2014CN103794568A 集成电路底部填充方案 IC bottom padding scheme
05/14/2014CN103794566A 一种显示面板制作方法 A display panel manufacturing method
05/14/2014CN103794565A 逻辑晶体管和非易失性存储器的制造方法 Logic transistor and a method of manufacturing a non-volatile memory
05/14/2014CN103794564A 一种半导体结构及其制造方法 A semiconductor structure and its manufacturing method
05/14/2014CN103794563A 一种增强硅基成像器件ccd或者cmos器件红外响应的方法 A method of enhancing the imaging device ccd or cmos silicon infrared responsive devices
05/14/2014CN103794562A 半导体器件制造方法 The semiconductor device manufacturing method
05/14/2014CN103794561A 半导体器件的制造方法 The method of manufacturing a semiconductor device
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