Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/14/2014CN103792971A 一种用于半导体热处理设备的温度控制等效方法 A heat treatment temperature control equipment for semiconductor equivalent method
05/14/2014CN103792791A 集装式弧型热酸分排盘体框架结构 Cartridge hot acid points behind the arc plate frame structure
05/14/2014CN103792747A 一种阵列基板及其制作方法、修复方法及显示装置 One kind of array substrate and production methods, repair methods and display device
05/14/2014CN103792744A 存储电容、像素单元及存储电容的制造方法 A storage capacitor, a pixel unit and a method of manufacturing a storage capacitor
05/14/2014CN103792741A 一种阵列基板及其制备方法、显示装置 One kind of array substrate and its preparation method, a display device
05/14/2014CN103791053A 将横向运动转换成为上下运动的装置 The lateral movement of the device up and down movement is converted into
05/14/2014CN103789771A 等离子体处理方法 The plasma processing method
05/14/2014CN103789764A 半导体元件的制造方法、半导体元件 The method of manufacturing a semiconductor device, a semiconductor element
05/14/2014CN103788736A 绝缘层用组合物及在硅晶圆的硅通孔上制备绝缘层的方法 The method of the insulating layer and preparation of a composition for an insulating layer on the silicon wafer silicon vias
05/14/2014CN103788653A 用于形成图像的下层膜组合物 Underlayer film forming composition for forming an image
05/14/2014CN103787325A 一种新型石墨烯材料及其器件的制备方法 Preparation of a new graphene materials and devices
05/14/2014CN103785624A 模块集成电路分选机 Module IC sorter
05/14/2014CN103013523B 一种蚀刻剂及其制备和应用 One etchant and preparation and application
05/14/2014CN102925088B 一种太阳能晶硅切片临时粘接胶及其制备方法 A solar crystalline silicon slice temporary adhesive glue and preparation method
05/14/2014CN102781124B 一种用于集成电路晶圆烘焙的热板单元 Hot plate unit for an integrated circuit wafer baking
05/14/2014CN102723310B 一种阵列基板的制作方法、阵列基板和液晶显示装置 A method of manufacturing an array substrate, the array substrate and the liquid crystal display device
05/14/2014CN102623396B 连接孔的形成方法 Connection method for forming a hole
05/14/2014CN102593175B 栅总线加强的沟槽mos器件及其制造方法 Mos device gate bus trench, and a manufacturing method for strengthened
05/14/2014CN102569565B 发光二极管晶片的点测方法 Point-emitting diode wafer measurement method
05/14/2014CN102569364B 一种高迁移率衬底结构及其制备方法 A high-mobility substrate structure and preparation method
05/14/2014CN102553854B 升降抖动装置 Lifting jitter device
05/14/2014CN102544005B 降低寄生晶体管导通的功率组件及其制作方法 Reduce the parasitic transistor is turned on the power module and manufacturing method thereof
05/14/2014CN102543844B 一种制造半导体器件结构的方法和半导体器件结构 A method of manufacturing a semiconductor device structure and a semiconductor device structure
05/14/2014CN102543701B 制作金属硅化物的方法 The method of making the metal silicide
05/14/2014CN102513302B 喷淋清洗槽 Spray cleaning tank
05/14/2014CN102509719B 可挠式显示器的制作方法以及可挠式显示器 Flexible-type production method, and the flexible display type display
05/14/2014CN102452040B 降低固定研磨粒化学机械研磨设备的记忆效应的方法 Reduce fixed abrasive grain chemical mechanical polishing device memory effect method
05/14/2014CN102446974B Finfet及其制造方法 Finfet its manufacturing method
05/14/2014CN102422416B 具备具有二极管区和igbt区的半导体基板的半导体装置 A semiconductor device having a diode region and the semiconductor substrate region igbt
05/14/2014CN102420206B 先镀后刻四面无引脚封装结构及其制造方法 Carved four leadless package structure and method of manufacturing after the first plating
05/14/2014CN102414798B 原料供应单元、薄膜沉积装置及沉积薄膜的方法 Raw material supply unit, the thin film deposition apparatus and film deposition method
05/14/2014CN102403254B 单片清洗设备中的硅片夹持装置 Monolithic silicon wafer cleaning apparatus of the clamping means
05/14/2014CN102403230B 一种半导体器件结构的制作方法 Method of manufacturing a semiconductor device structure
05/14/2014CN102402090B 一种阵列基板及液晶显示装置、阵列基板的制造方法 Device manufacturing method, the array substrate and the array substrate of a liquid crystal display
05/14/2014CN102386138B 通孔刻蚀方法、集成电路制造方法和集成电路 The through-hole etching method, a method of manufacturing integrated circuits and integrated circuits
05/14/2014CN102386077B 一种制作半导体器件的方法 A method of fabricating a semiconductor device
05/14/2014CN102356459B 真空处理装置 The vacuum processing apparatus
05/14/2014CN102341888B 形成图案的方法 The method of forming a pattern
05/14/2014CN102338943B 阵列基板、液晶面板和液晶显示器以及制造和检测方法 Array substrate, a liquid crystal panel and liquid crystal displays as well as manufacturing and testing methods
05/14/2014CN102334186B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/14/2014CN102326267B 氮化物系半导体发光元件及其制造方法 The nitride-based semiconductor light-emitting device and its manufacturing method
05/14/2014CN102319680B 一种smd led贴片分光机的芯片定位装置 One kind of sorting machines smd led SMD chip positioning device
05/14/2014CN102315182B 半导体芯片及其制造方法 The method of manufacturing a semiconductor chip and
05/14/2014CN102301447B 用于提高包括半导体材料的结构的质量的方法 For improving the quality of a structure comprising a semiconductor material of a method
05/14/2014CN102299112B 制作沟槽和浅沟槽隔离结构的方法 The method of making the grooves and shallow trench isolation structure
05/14/2014CN102299100B 接触孔的制作方法 The method of making a contact hole
05/14/2014CN102299061B 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/14/2014CN102272907B 形成倒装芯片互连的原位熔化和回流处理及其系统 Flip chip interconnect is formed in situ melting and reflow processing and systems
05/14/2014CN102270651B 装置和图像传感器 And an image sensor means
05/14/2014CN102254899B 具有对准标记的半导体结构及其形成方法 The semiconductor structure and method of forming an alignment mark
05/14/2014CN102232241B 离子植入控制的激发气体注入 Ion implantation excite the gas injection control
05/14/2014CN102204181B 路径选择装置、路径选择方法、以及程序 Path selection device, path selection method, and program
05/14/2014CN102201362B 一种制备任意厚度的带有绝缘埋层的衬底的方法 A method of insulating substrate with a buried layer of arbitrary thickness prepared
05/14/2014CN102194876B 半导体元件及其制作方法 Semiconductor device and manufacturing method thereof
05/14/2014CN102160179B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/14/2014CN102148216B 用于互连工艺的半导体结构及其制造方法 Semiconductor structure and method of manufacturing processes for interconnection
05/14/2014CN102130033B 工件支撑结构及其使用设备 Workpiece support structure and use of equipment
05/14/2014CN102124555B 半导体装置 Semiconductor device
05/14/2014CN102097410B 具有增进焊接强度的镀层的导线结构 Welded wire structure having a strength enhancing coating
05/14/2014CN102095155B 发光单元及使用该发光单元的照明装置 The light emitting unit and a lighting apparatus using the light-emitting unit
05/14/2014CN102085522B 用于清洗喷涂含硅的底部抗反射涂层的管路的方法 Used for cleaning silicon-containing bottom antireflective coating spray piping method
05/14/2014CN102077332B 具有整体式铜电极的夹层式压电设备 Sandwich-type piezoelectric devices with integral copper electrode
05/14/2014CN102037547B 形成含纳米丛集介电层的方法及包括上述介电层的装置 The method for forming a dielectric layer containing nanoclusters and includes means for the dielectric layer
05/14/2014CN102034802B 标准芯片尺寸封装的结构和方法 Structures and methods standard chip size package
05/14/2014CN101960572B 具有空腔界定栅极的装置及其制造方法 With a device and method for manufacturing the gate electrode defining a cavity
05/14/2014CN101750825B 用于显示设备的阵列基板及其制造方法 The array substrate and manufacturing method for a display device
05/14/2014CN101740605B 有源矩阵有机发光二极管像素结构及其制造方法 The active matrix organic light emitting diode pixel structure and its manufacturing method
05/14/2014CN101714546B 显示装置及其制造方法 Display device and method of manufacturing
05/14/2014CN101661228B 基板处理方法 The substrate processing method
05/14/2014CN101577309B 应用于电阻式随机存取存储器的电脉冲电压操作方法 An electrical pulse voltage operation method is applied to a resistive random access memory
05/14/2014CN101569101B Cmos电路和半导体器件 Cmos circuits and semiconductor devices
05/14/2014CN101558484B 具有圆形结构的工件储料器 Has a circular structure of the workpiece stocker
05/14/2014CN101442074B 沟槽金属氧化物场效应晶体管及其制造方法 A trench metal-oxide field effect transistor and manufacturing method thereof
05/14/2014CN101420816B 容性耦合等离子体反应器 Capacitively coupled plasma reactor
05/14/2014CN101154569B 等离子体处理方法 The plasma processing method
05/14/2014CN101114628B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/13/2014US8726411 Charged probe and electric fields measurement method thereof
05/13/2014US8724288 Electrostatic chuck and vacuum processing apparatus
05/13/2014US8724084 Lithographic apparatus and device manufacturing method
05/13/2014US8724083 Lithographic apparatus and device manufacturing method
05/13/2014US8724076 Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method
05/13/2014US8723761 Pixel circuit, display device, and method of driving pixel circuit
05/13/2014US8723534 Methods and apparatus for detection of gaseous corrosive contaminants
05/13/2014US8723503 Vertical type sensor
05/13/2014US8723336 Semiconductor light emitting device and method for manufacturing same
05/13/2014US8723330 Protective layer for protecting TSV tips during thermo-compressive bonding
05/13/2014US8723325 Structure and method of forming a pad structure having enhanced reliability
05/13/2014US8723324 Integrated circuit packaging system with pad connection and method of manufacture thereof
05/13/2014US8723322 Method of metal sputtering for integrated circuit metal routing
05/13/2014US8723319 BGA package structure and method for fabricating the same
05/13/2014US8723317 Trench metal oxide semiconductor field effect transistor with embedded schottky rectifier using reduced masks process
05/13/2014US8723314 Semiconductor workpiece with backside metallization and methods of dicing the same
05/13/2014US8723305 Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
05/13/2014US8723302 Integrated circuit package system with input/output expansion
05/13/2014US8723301 Semiconductor package and system
05/13/2014US8723300 Multi-chip module power clip
05/13/2014US8723296 Stress compensation for large area gallium nitride or other nitride-based structures on semiconductor substrates
05/13/2014US8723294 Resistance element and inverting buffer circuit
05/13/2014US8723285 Photoelectric conversion device manufacturing method thereof, and camera
05/13/2014US8723284 Back side illuminated CMOS image sensor with global shutter storage gates stacked on top of pinned photodiodes
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