Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/28/2014CN103824807A 制造柔性显示装置的方法 The method of manufacturing a flexible display device
05/28/2014CN103824806A 一种大马士革铜互连工艺 One kind of damascene copper interconnect process
05/28/2014CN103824805A 背面隔离器件及其制备方法 The back of the isolation device and its preparation method
05/28/2014CN103824804A 半导体沟槽结构的形成方法 The method for forming a semiconductor channel structure
05/28/2014CN103824803A 场氧化层的形成方法 The method for forming a field oxide layer
05/28/2014CN103824802A 半导体结构的形成方法 The method for forming a semiconductor structure
05/28/2014CN103824801A Led外延片反应腔 Led wafer reaction chamber
05/28/2014CN103824800A 基板载置台和基板处理装置 The substrate mounting table and the substrate processing apparatus
05/28/2014CN103824799A 对准结构及晶圆 And wafer alignment structure
05/28/2014CN103824798A 自动化样品定向 Automated sample orientation
05/28/2014CN103824797A 硅片传输装置和方法 Wafer transfer apparatus and method
05/28/2014CN103824796A 用于led外延制程的石墨承载盘及其配套衬底 Graphite bearing plate and supporting substrate for epitaxial process led the
05/28/2014CN103824795A 一种石墨舟预处理替代片及石墨舟预处理方法 Graphite and graphite sheet boat boat pretreatment alternative pretreatment method
05/28/2014CN103824794A 用于控制smif和机台的控制装置、运输装置 Control means for controlling smif and machines, transport equipment
05/28/2014CN103824793A 一种电极整型装置 An electrode integer unit
05/28/2014CN103824792A 一种储藏柜及控制方法 One kind of cabinets and control method
05/28/2014CN103824791A 基板搬运机器人和基板搬运方法 Substrate handling robot and the substrate transfer method
05/28/2014CN103824790A 离子束刻蚀深度的监测方法 Ion beam etching depth monitoring methods
05/28/2014CN103824789A 一种晶圆电性测试方法 One kind of wafer electrical test methods
05/28/2014CN103824788A 沟槽底部颗粒的检测方法 Trench bottom particle detection method
05/28/2014CN103824787A 基于粘接剂的晶圆键合方法 Wafer bonding method based adhesive
05/28/2014CN103824786A 一种粗金丝键合方法 An unrefined gold bonding method
05/28/2014CN103824785A 封装结构的形成方法 The method of forming a package structure
05/28/2014CN103824784A 用连接片实现连接的半导体封装的方法 The method implemented by the connection piece connected to the semiconductor package
05/28/2014CN103824783A 包封晶片级芯片规模(wlcsp)基座封装 Encapsulated wafer level chip scale (wlcsp) base package
05/28/2014CN103824782A Qfn 框架制作方法 Qfn frame production methods
05/28/2014CN103824781A 一种热膨胀系数适配微波毫米波模块集成结构制作方法 A thermal expansion coefficient adaptation module integrated microwave and millimeter wave structure and manufacturing process
05/28/2014CN103824780A 一种低温多晶硅tft器件及其制造方法 Low-temperature polysilicon tft device and manufacturing method
05/28/2014CN103824779A 一种薄膜晶体管及其制作方法、tft阵列基板、显示装置 A thin film transistor and manufacturing method, tft array substrate, a display device
05/28/2014CN103824778A 碳纳米管薄膜的垂直叠层形成的晶体管 Forming a thin film of carbon nanotubes vertically stacked transistors
05/28/2014CN103824777A 使用经掺杂的凸起源极和漏极区的源极和漏极掺杂 Using the source electrode and the drain electrode through the doped source and drain regions of the projections doping
05/28/2014CN103824776A Dmos器件及其制造方法 Dmos device and its manufacturing method
05/28/2014CN103824775A FinFET及其制造方法 And a method of manufacturing FinFET
05/28/2014CN103824774A 沟渠式mos整流器及其制造方法 Trench-type rectifier and its manufacturing method mos
05/28/2014CN103824773A 不均质的功率半导体器件 Power semiconductor devices are not homogeneous
05/28/2014CN103824772A 一种改善后端光刻套准标记形貌的方法 A method of improving the backend lithography registration marks morphology
05/28/2014CN103824771A 栅氧化层的形成方法 The method for forming a gate oxide layer
05/28/2014CN103824770A 降低硅凹陷的光阻去除工艺 Reduce silicon recess resist removal process
05/28/2014CN103824769A 一种有效控制功率器件终端场氧化层角度的方法 An effective control of the power angle of the field oxide device terminal method
05/28/2014CN103824768A 半导体装置的制造方法及半导体装置的制造装置 Producing a semiconductor device manufacturing method and apparatus of a semiconductor device
05/28/2014CN103824767A 一种深硅通孔的刻蚀方法 A deep silicon etching vias
05/28/2014CN103824766A 一种硅衬底和将半导体器件与该硅衬底剥离的方法 A silicone substrate and the semiconductor device and the method of peeling the silicon substrate
05/28/2014CN103824765A 栅极侧墙图形化的方法 The gate sidewall spacer patterning method
05/28/2014CN103824764A 一种沟槽型mos器件中沟槽栅的制备方法 Preparation method of a trench-type trench gate device mos
05/28/2014CN103824763A 改善自对准接触孔的硅化钨双栅极边缘粗糙度的方法 Improving the self-aligned contact hole of the tungsten silicide gate edge roughness of the dual
05/28/2014CN103824762A 激光退火装置 A laser annealing apparatus
05/28/2014CN103824761A 一种可提高扩散均匀性的涂源扩散方法及扩散设备 Capable of improving the uniformity of the coating diffusion method and the diffusion apparatus of the source diffusion
05/28/2014CN103824760A 一种碳化硅功率器件结终端的制造方法 A method of manufacturing a silicon carbide power device junction termination
05/28/2014CN103824759A 一种制备多层超细硅线条的方法 A method of preparing a multi-layer ultra-fine silicon lines
05/28/2014CN103824758A 一种减小硅通孔周围区域应力的方法 A method of reducing the stress surrounding area silicon vias method
05/28/2014CN103824757A 基板干燥的装置与方法 Apparatus and method for drying a substrate
05/28/2014CN103824756A 去除封装结构的方法 The method of removing the package structure
05/28/2014CN103824755A 高q电感及制备方法 High q inductance and preparation methods
05/28/2014CN103824754A 一种石英晶振智能贴合机 One kind of quartz crystals intelligent laminating machine
05/28/2014CN103824746A 用于沟槽与介层洞轮廓修饰的方法与设备 For trench and via profile modification method and apparatus
05/28/2014CN103824745A 一种反应腔室 One reaction chamber
05/28/2014CN103824614A 具有金属-有机层的多层复合体 A metal - organic layer is a multilayer composite body
05/28/2014CN103823917A 半导体封装的设计系统与方法、制造装置、和半导体封装 The semiconductor package design system and method, manufacturing apparatus, and a semiconductor package
05/28/2014CN103823407A 一种划片机的划切控制方法、装置及划片机 Dicing dicing machine control method, apparatus and Dicing
05/28/2014CN103822813A 半导体器件测试样品的制作方法 The semiconductor device manufacturing method of the test sample
05/28/2014CN103822812A 半导体器件测试样品的制作方法 The semiconductor device manufacturing method of the test sample
05/28/2014CN103822735A 一种压力传感器用晶片结构及该晶片结构的加工方法 A pressure sensor wafer structure and working methods of the wafer structure
05/28/2014CN103820849A 一种减压生产12寸单晶硅外延片的工艺 One kind of pressure 12-inch monocrystalline silicon wafer production process
05/28/2014CN103820803A 一种二极管半成品酸洗转换设备 Semi-finished products to a diode pickling conversion equipment
05/28/2014CN103820784A 刻蚀剂组合物、金属图案的形成方法和阵列基板的制法 Method etchant composition, method of forming a metal pattern and an array substrate
05/28/2014CN103820768A 4H-SiC衬底上同质快速外延生长4H-SiC外延层的方法 Homogeneous on a 4H-SiC substrate rapid epitaxial growth of 4H-SiC epitaxial layer method
05/28/2014CN102714075B 导电性单元、导电性单元形成用感光材料以及电极 A conductive element, the conductive element and the electrode for forming a photosensitive material
05/28/2014CN102686767B 分割溅镀靶及其制造方法 Sputtering target and its manufacturing method for dividing the
05/28/2014CN102683503B 一种输送长度可调的铺板机 A conveyor length adjustable decking machine
05/28/2014CN102683501B 一种输送长度可调的堆栈机 A conveyor length adjustable stack machine
05/28/2014CN102655123B 一种提高静态随机存储器读出冗余度的方法 A reading redundancy methods to improve the static random access memory
05/28/2014CN102593027B 固晶压板 Solid crystal plate
05/28/2014CN102591138B 应用于硅穿孔晶圆级封装中的双光阻墙及其制备方法 Double photoresist is applied to the silicon wall perforation wafer level packaging in its preparation method
05/28/2014CN102569196B 一种简化多阈值电压的制程光罩层数的方法 A simplified process mask layers multi-threshold voltage method
05/28/2014CN102569186B 阵列基板及其形成方法 Array substrate and method of forming
05/28/2014CN102569032B 多层金属化薄膜叠加制作电感元件的方法 Superimposing the multilayer metal film made of the method of the inductance element
05/28/2014CN102543713B 一种氧化硅栅极补偿隔离区刻蚀的方法 A silicon oxide gate etching method of compensation Quarantine
05/28/2014CN102543705B 用于高、低压器件的多晶硅栅电极集成工艺 For high and low voltage devices polysilicon gate electrode integrated process
05/28/2014CN102522350B 故障生产机台检测的方法和装置 Production machine fault detection method and apparatus
05/28/2014CN102492986B 一种选区异质外延衬底结构及其制备和外延层生长方法 Heteroepitaxial substrate and the epitaxial layer structure and preparation method of growing a constituency
05/28/2014CN102479738B 沟槽隔离结构及其形成方法 Trench isolation structure and method of forming
05/28/2014CN102468333B 一种石墨烯器件及其制造方法 One kind of a method of manufacturing a graphene device
05/28/2014CN102468235B 鳍片场效应晶体管(finfet)器件及其制造方法 Fin-FET (finfet) device and manufacturing method
05/28/2014CN102455599B 抗蚀图案改善材料、形成抗蚀图案的方法以及制造半导体器件的方法 Methods to improve the resist pattern material, resist pattern forming method for manufacturing a semiconductor device, and
05/28/2014CN102446970B 一种防止酸槽清洗空洞形成的半导体器件及其制备方法 A semiconductor device and a method for preparing the acid wash tank to prevent the formation of voids
05/28/2014CN102446961B 包含功率器件的半导体装置及其制备方法 The method for preparing a semiconductor device comprising a power device and the
05/28/2014CN102446719B 提高浮体动态随机存储单元写入速度的方法 Improve the floating body memory cell write speed dynamic random method
05/28/2014CN102437089B 一种铜后道互连工艺 A copper interconnect process after the Road
05/28/2014CN102437034B 一种形成金属阻挡层的方法 A method of forming a metal barrier layer
05/28/2014CN102421686B 自由滚珠轴承、支承台、搬运设备、转台 Freedom of ball bearings, bearing units, handling equipment, turntable
05/28/2014CN102412169B 一种具有温度自动控制功能的晶片加工机台 A kind of automatic temperature control function wafer processing machines
05/28/2014CN102388444B 具有无限驱动介质的搬送系统及搬送方法 Infinite medium conveyance drive system and a transfer method
05/28/2014CN102375277B 液晶显示装置及其制造方法 The liquid crystal display device and manufacturing method
05/28/2014CN102324396B 基板清洗装置 Substrate cleaning apparatus
05/28/2014CN102280425B 具备键合引线的半导体器件及其制造方法 The method of manufacturing a semiconductor device and bonding wires
05/28/2014CN102272888B 柱形结构的阻剂结构元件和可移除间隔物间距加倍构图方法 The resist structure and the structure of the cylindrical member can be removed spacer patterning method pitch doubling
05/28/2014CN102257437B 预对准装置以及预对准方法 Pre-alignment apparatus and method for pre-alignment
05/28/2014CN102203911B 通过启动和光流加热薄板的层的方法和设备 By a method and apparatus for startup and the optical flow of the heating sheet layer
05/28/2014CN102194828B 一种新型源漏结构的抗辐照soi器件及制备方法 Soi anti-radiation devices and a method for preparing novel source-drain structure
05/28/2014CN102194686B 等离子体蚀刻方法 The plasma etching method