Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/22/2014WO2014078488A1 Apparatus and methods for plasma enhanced chemical vapor deposition of polymer coatings
05/22/2014WO2014078393A1 Capacitively coupled plasma equipment with uniform plasma density
05/22/2014WO2014078320A1 Method and apparatus for processing a workpiece and an article formed thereby
05/22/2014WO2014078151A1 Recording measurements by sensors for a carrier head
05/22/2014WO2014078134A2 Method and system for a semiconductor device package with a die-to-die first bond
05/22/2014WO2014078131A1 Method for semiconductor device with die-to-packaging substrate
05/22/2014WO2014078130A1 Semiconductor device package with a die to interposer wafer first bond
05/22/2014WO2014078097A1 Methanofullerenes
05/22/2014WO2014078070A1 (ai, in, b, ga) n based laser diodes with polished facets
05/22/2014WO2014078045A1 Semiconductor device having diffusion barrier to reduce back channel leakage
05/22/2014WO2014078033A1 Modular chemical delivery system
05/22/2014WO2014078011A1 Compositions and processes for fabrication of rear passivated solar cells
05/22/2014WO2014077980A1 Three-dimensional flash memory system
05/22/2014WO2014077972A1 Semiconductor constructions and methods of forming semiconductor constructions
05/22/2014WO2014077945A1 Co-integration of elemental semiconductor devices and compound semiconductor devices
05/22/2014WO2014077936A2 Compensation for a charge in a silicon substrate
05/22/2014WO2014077903A1 Tunneling field effect transistors (tfets) for cmos architectures and approaches to fabricating n-type and p-type tfets
05/22/2014WO2014077869A1 Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same
05/22/2014WO2014077862A1 Gan-based schottky diode having partially recessed anode
05/22/2014WO2014077860A1 GaN-BASED SCHOTTKY DIODE HAVING DUAL METAL, PARTIALLY RECESSED ELECTRODE
05/22/2014WO2014077624A1 Method for aligning nano-size materials in one direction using nano-meter polishing, electric device using same and method for manufacturing said electric device
05/22/2014WO2014077480A1 Method of determining surface orientation of single crystal wafer
05/22/2014WO2014077405A1 Illumination optical system and illumination method, and exposure method and device
05/22/2014WO2014077404A1 Illuminating optics, illumination method, and exposure method and device
05/22/2014WO2014077379A1 Substrate processing device and substrate transfer method
05/22/2014WO2014077370A1 Method for cleaning semiconductor substrate and method for producing semiconductor substrate
05/22/2014WO2014077320A1 Etching fluid for semiconductor substrate, etching method using same, and method for manufacturing semiconductor element
05/22/2014WO2014077304A1 Method for removing silanol compound, chemical filter, and exposure device
05/22/2014WO2014077303A1 Image processor, method for generating pattern using self-organizing lithographic techniques and computer program
05/22/2014WO2014077282A1 Au BASED SOLDER DIE ATTACHMENT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
05/22/2014WO2014077270A1 Etching method for semiconductor substrate and production method for semiconductor element
05/22/2014WO2014077249A1 Etching method for semiconductor substrate and production method for semiconductor element
05/22/2014WO2014077232A1 Wire bonding device and wire bonding method
05/22/2014WO2014077210A1 Semiconductor device and method for manufacturing same
05/22/2014WO2014077209A1 Semiconductor device and method for manufacturing same
05/22/2014WO2014077207A1 Semiconductor device
05/22/2014WO2014077201A1 Method for manufacturing semiconductor device and display device
05/22/2014WO2014077199A1 Method for etching semiconductor substrate and method for manufacturing semiconductor element
05/22/2014WO2014077171A1 White photosensitive resin composition, white cured film, white pattern, and method for producing white pattern
05/22/2014WO2014077154A1 Semiconductor device
05/22/2014WO2014077107A1 Polishing composition
05/22/2014WO2014077089A1 Metal alkoxide compound, thin film-forming starting material, method for producing thin film, and alcohol compound
05/22/2014WO2014077044A1 Flip-chip bonding method and solid-state image pickup device manufacturing method characterized in including flip-chip bonding method
05/22/2014WO2014077039A1 Method for manufacturing silicon carbide semiconductor device
05/22/2014WO2014077026A1 Wire bonding device and method for manufacturing semiconductor device
05/22/2014WO2014076997A1 Wire bonding apparatus and method for producing semiconductor device
05/22/2014WO2014076980A1 Device, system, method and program for producing fragment model
05/22/2014WO2014076964A1 Storing container, storing container manufacturing method, semiconductor manufacturing method, and semiconductor manufacturing apparatus
05/22/2014WO2014076955A1 Device for polishing both surfaces of semiconductor wafer and production method for semiconductor wafer
05/22/2014WO2014076945A1 Production method for semiconductor epitaxial wafer, semiconductor epitaxial wafer, and production method for solid-state imaging element
05/22/2014WO2014076933A1 Production method for semiconductor epitaxial wafer, semiconductor epitaxial wafer, and production method for solid-state imaging element
05/22/2014WO2014076922A1 Nanoimprint method, and manufacturing method for patterned substrate
05/22/2014WO2014076921A1 Production method for semiconductor epitaxial wafer, semiconductor epitaxial wafer, and production method for solid-state imaging element
05/22/2014WO2014076916A1 Sputtering target, oxide semiconductor thin film, and method for producing these
05/22/2014WO2014076880A1 Double-sided polishing method
05/22/2014WO2014076831A1 Semiconductor inspection device, and inspection method using charged particle beam
05/22/2014WO2014076613A1 Method for patterning of graphene and graphene like materials
05/22/2014WO2014076431A2 Semiconductor device and its method of fabrication
05/22/2014WO2014076406A1 Graphene interposer and method of manufacturing such an interposer
05/22/2014WO2014076090A1 Method and device for transporting flat substrates
05/22/2014WO2014075729A1 Method and system for maintaining an edge exclusion shield
05/22/2014WO2014075633A1 Chip structure for pressure sensor and method for fabricating same
05/22/2014WO2014075632A1 Trench mosfet and method for forming the same
05/22/2014WO2014075524A1 Liquid spray recovery device with wafer location detector
05/22/2014WO2014075373A1 Silicon nanowire chip for simultaneously detecting mirnas and protein markers, detecting method and application thereof
05/22/2014WO2014075360A1 Finfet and method for manufacture thereof
05/22/2014WO2014075333A1 Method for manufacturing switch tube and method for manufacturing array substrate
05/22/2014WO2014051511A3 Electroless metal through silicon via
05/22/2014WO2014046903A3 Optimization of conveyor belts used for workpiece processing
05/22/2014WO2014036265A3 Transport of liquids and solute materials in nanochannels
05/22/2014US20140142740 Apparatus and method for positioning an electronic component and/or a carrier relative to a discharging device
05/22/2014US20140141626 Method for depositing a chlorine-free conformal sin film
05/22/2014US20140141625 Method for Forming Insulation Film Using Non-Halide Precursor Having Four or More Silicons
05/22/2014US20140141624 Method of manufacturing tunnel barrier layer or gate insulator film and apparatus for manufacturing tunnel barrier layer or gate insulator film
05/22/2014US20140141623 Method Of and Apparatus For Inline Deposition of Materials On A Non-Planar Surface
05/22/2014US20140141622 Process for etching metals
05/22/2014US20140141621 Dry-etch selectivity
05/22/2014US20140141620 Method for manufacturing semiconductor device and semiconductor device
05/22/2014US20140141619 Capacitively coupled plasma equipment with uniform plasma density
05/22/2014US20140141618 Processing for overcoming extreme topography
05/22/2014US20140141617 Semiconductor device manufacturing method
05/22/2014US20140141616 Etching composition and method of manufacturing semiconductor device using the same
05/22/2014US20140141615 Method of forming patterned film on a bottom and a top-surface of a deep trench
05/22/2014US20140141614 Remote Plasma System and Method
05/22/2014US20140141613 Process for polishing a semiconductor wafer, comprising the simultaneous polishing of a front side and of a reverse side of a substrate wafer
05/22/2014US20140141612 Polishing composition, polishing method using same, and method for producing semiconductor device
05/22/2014US20140141611 Surface Treatment in the Formation of Interconnect Structure
05/22/2014US20140141610 Non-volatile memory devices including vertical nand strings and methods of forming the same
05/22/2014US20140141609 Process for Electroless Deposition of Gold and Gold Alloys on Silicon
05/22/2014US20140141608 Semiconductor component and methods for producing a semiconductor component
05/22/2014US20140141607 Continuous via for power grid
05/22/2014US20140141606 Semiconductor manufacturing method and semiconductor structure thereof
05/22/2014US20140141604 Systems and methods for preparing films using sequential ion implantation, and films formed using same
05/22/2014US20140141603 Vertical-conduction integrated electronic device and method for manufacturing thereof
05/22/2014US20140141602 Method for Manufacturing a Semiconductor Device
05/22/2014US20140141601 Methods of growing heteroepitaxial single crystal or large grained semiconductor films and devices thereon
05/22/2014US20140141600 Methods of preparing graphene and device including graphene
05/22/2014US20140141599 Method of fabricating semiconductor device
05/22/2014US20140141598 Method to improve reliability of replacement gate device
05/22/2014US20140141597 Chips with high fracture toughness through a metal ring
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