Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/13/2014US8722464 Method and system for template assisted wafer bonding
05/13/2014US8722463 Chip package and fabrication method thereof
05/13/2014US8722462 Semiconductor package
05/13/2014US8722461 Leadframe based multi terminal IC package
05/13/2014US8722460 Method and apparatus for fabricating integrated circuit device using self-organizing function
05/13/2014US8722459 Methods of forming 3-D circuits with integrated passive devices
05/13/2014US8722458 Optical systems fabricated by printing-based assembly
05/13/2014US8722457 System and apparatus for wafer level integration of components
05/13/2014US8722456 Method for preparing p-type ZnO-based material
05/13/2014US8722455 Phase change memory structure having low-K dielectric heat-insulating material and fabrication method thereof
05/13/2014US8722453 Photovoltaic device and method for manufacturing the same
05/13/2014US8722451 Solid state energy photovoltaic device
05/13/2014US8722449 Manufacturing method of semiconductor device
05/13/2014US8722448 Method for fabricating photo detector
05/13/2014US8722447 Selenization of precursor layer containing CulnS2 nanoparticles
05/13/2014US8722446 Acoustic sensor and method of manufacturing the same
05/13/2014US8722445 Planar cavity MEMS and related structures, methods of manufacture and design structures
05/13/2014US8722444 Microelectromechanical system having movable element integrated into substrate-based package
05/13/2014US8722443 Inductor structures for integrated circuit devices
05/13/2014US8722442 Nitrogen-doped transparent graphene film and manufacturing method thereof
05/13/2014US8722441 Manufacturing process for solid state lighting device on a conductive substrate
05/13/2014US8722438 Method of manufacturing a display substrate
05/13/2014US8722437 Method of component assembly on a substrate
05/13/2014US8722436 Method and apparatus for accurate die-to-wafer bonding
05/13/2014US8722435 Light emitting device package and method of manufacturing the same
05/13/2014US8722433 Method for fabricating light emitting diode (LED) dice with wavelength conversion layers
05/13/2014US8722432 Methods and system for on-chip decoder for array test
05/13/2014US8722431 FinFET device fabrication using thermal implantation
05/13/2014US8722430 Production method for oxidized carbon thin film, and element having oxidized carbon thin film and production method therefor
05/13/2014US8722320 Lithography method and device
05/13/2014US8722184 Wafer-adhering adhesive tape
05/13/2014US8721909 Polishing composition and polishing method
05/13/2014US8721905 Method for forming minute pattern and method for forming minute pattern mask
05/13/2014US8721864 Process and apparatus for producing a metal covered polyimide composite
05/13/2014US8721846 Method of forming film, film forming apparatus and storage medium
05/13/2014US8721836 Plasma processing with preionized and predissociated tuning gases and associated systems and methods
05/13/2014US8721835 Gas injection device with uniform gas velocity
05/13/2014US8721834 Apparatus for treating substrate
05/13/2014US8721833 Variable capacitance chamber component incorporating ferroelectric materials and methods of manufacturing and using thereof
05/13/2014US8721790 Film deposition apparatus
05/13/2014US8720873 Substrate holding device
05/13/2014US8719993 Semiconductor equipment
05/13/2014CA2481637C Device package and methods for the fabrication and testing thereof
05/08/2014WO2014071364A1 Discrete device mounted on substrate
05/08/2014WO2014071175A1 Integration of single-level and multi-level flash cells having different tunnel oxide thicknesses
05/08/2014WO2014071090A1 Compositions of low-k dielectric sols containing nonmetallic catalysts
05/08/2014WO2014070926A1 A conductive interconnect including an inorganic collar
05/08/2014WO2014070838A1 Fluorocarbon molecules for high aspect ratio oxide etch
05/08/2014WO2014070764A1 Electrostatic chuck with photo-patternable soft protrusion contact surface
05/08/2014WO2014070748A1 Automated interface apparatus and method for use in semiconductor wafer handling systems
05/08/2014WO2014070736A1 Illumination energy management in surface inspection
05/08/2014WO2014070705A1 Ni-rich schottky contact
05/08/2014WO2014070694A1 Underfill composition and semiconductor device and manufacturing method thereof
05/08/2014WO2014070682A1 Double self-aligned phase change memory device structure
05/08/2014WO2014070619A1 Method of patterning a low-k dielectric film
05/08/2014WO2014070600A1 Methods for selective and conformal epitaxy of highly doped si-containing materials for three dimensional structures
05/08/2014WO2014070586A1 Circuit board with integrated passive devices
05/08/2014WO2014070534A2 Integrated bondline spacers for wafer level packaged circuit devices
05/08/2014WO2014070484A1 Semiconductor device manufacturing line
05/08/2014WO2014070267A2 Carbon nanotube devices with unzipped low-resistance contacts
05/08/2014WO2014070163A1 Memory cell that prevents charge loss
05/08/2014WO2014070091A2 Through substrate vias and device
05/08/2014WO2014070017A1 Method for forming an electrically conductive via in a substrate
05/08/2014WO2014069962A1 Method and device for measuring surface roughness of deposited thin film
05/08/2014WO2014069942A1 Purge chamber, and substrate-processing apparatus including same
05/08/2014WO2014069859A1 Epitaxial wafer and method for manufacturing same
05/08/2014WO2014069810A1 Thin plate storage container
05/08/2014WO2014069807A1 Method for supplying inert gas to stb in semiconductor wafer manufacturing system and semiconductor wafer manufacturing system using same
05/08/2014WO2014069804A1 Ceiling storage device capable of wafer purging
05/08/2014WO2014069711A1 Method for manufacturing microcircuit
05/08/2014WO2014069662A1 Wiring structure
05/08/2014WO2014069559A1 Plasma treatment method and plasma treatment device
05/08/2014WO2014069552A1 Method for producing adhesion film for imprinting and pattern forming method
05/08/2014WO2014069517A1 Etching liquid, etching method using same, and method for manufacturing semiconductor element
05/08/2014WO2014069457A1 Polishing composition
05/08/2014WO2014069415A1 Pattern formation method, actinic-ray- or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device
05/08/2014WO2014069353A1 Semiconductor device
05/08/2014WO2014069329A1 Ester-group-containing composition for forming silicon-containing resist underlayer film
05/08/2014WO2014069328A1 Tungsten sintered body sputtering target and tungsten film formed using said target
05/08/2014WO2014069316A1 Electroluminescent substrate, method for producing same, electroluminescent display panel, and electroluminescent display device
05/08/2014WO2014069313A1 Curable composition for imprinting, pattern forming method, and pattern
05/08/2014WO2014069309A1 Plasma source for plasma cvd device and method for manufacturing article using plasma source
05/08/2014WO2014069304A1 Semiconductor device manufacturing method and semiconductor device
05/08/2014WO2014069291A1 Device and method for detecting position of semiconductor substrate
05/08/2014WO2014069283A1 Discharge electrode
05/08/2014WO2014069282A1 Foil trap and light-source device having foil trap
05/08/2014WO2014069260A1 Active-matrix substrate and liquid-crystal display device
05/08/2014WO2014069254A1 Substrate manufacturing apparatus
05/08/2014WO2014069245A1 Organic treatment solution for patterning of chemically amplified resist film, container for organic treatment solution for patterning of chemically amplified resist film, and pattern formation method, electronic device manufacturing method, and electronic device using same
05/08/2014WO2014069235A1 Ultraviolet light emitting diode and method for producing same
05/08/2014WO2014069213A1 Semiconductor device, and manufacturing method for same
05/08/2014WO2014069203A1 Method for manufacturing ozone-gas-dissolved water and cleaning method for electronic materials
05/08/2014WO2014069202A1 Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device
05/08/2014WO2014069187A1 Wafer rotation apparatus and method for rotating wafer
05/08/2014WO2014069184A1 Extrusion device
05/08/2014WO2014069156A1 Method for evaluating silicon wafer and etchant for same
05/08/2014WO2014069139A1 Polishing composition
05/08/2014WO2014069132A1 Solder ball, agglomeration limiting device, and agglomeration limiting method
05/08/2014WO2014069131A1 Variant removal device and variant removal method
05/08/2014WO2014069094A1 Method for manufacturing semiconductor device, ion beam etching device, and control device