Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/29/2014US20140147800 Quartz boat method and apparatus for thin film thermal treatment
05/29/2014US20140147798 System for the heat treatment of substrates, and method for detecting measurement data in said system
05/29/2014US20140147235 Transport system
05/29/2014US20140147234 High speed substrate aligner apparatus
05/29/2014US20140145587 Display device, method of manufacturing the display device and carrier substrate for manufacturing display device
05/29/2014US20140145391 Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions
05/29/2014US20140145369 Apparatuses and methods for fabricating semiconductor packages
05/29/2014US20140145365 Silk-based piezoelectric materials
05/29/2014US20140145353 Tamper-resistant coating for an integrated circuit
05/29/2014US20140145345 Method of forming a semiconductor structure, and a semiconductor structure
05/29/2014US20140145342 Metal density distribution for double pattern lithography
05/29/2014US20140145340 Flip Chip Interconnection Structure
05/29/2014US20140145337 Memory Device Interconnects and Method of Manufacture
05/29/2014US20140145336 Semiconductor device including two groove-shaped patterns
05/29/2014US20140145335 Semiconductor device including two groove-shaped patterns
05/29/2014US20140145333 Device Comprising a Ductile Layer and Method of Making the Same
05/29/2014US20140145332 Methods of forming graphene liners and/or cap layers on copper-based conductive structures
05/29/2014US20140145326 Substrate with integrated passive devices and method of manufacturing the same
05/29/2014US20140145325 Electronic devices with embedded die interconnect structures, and methods of manufacture thereof
05/29/2014US20140145324 Method and system for controlling chip warpage during bonding
05/29/2014US20140145322 Electronic component package and method of manufacturing the same
05/29/2014US20140145319 Semicondutor Packages and Methods of Fabrication Thereof
05/29/2014US20140145315 Semiconductor device and method of fabricating the same
05/29/2014US20140145313 Method of making a semiconductor device using a bottom antireflective coating (barc) layer
05/29/2014US20140145311 Methods of forming features in semiconductor device structures
05/29/2014US20140145310 Thin film device, method of manufacturing the same, and method of manufacturing display
05/29/2014US20140145300 Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections
05/29/2014US20140145298 Electrode manufacturing method, fuse device and manufacturing method therefor
05/29/2014US20140145295 Double density semiconductor fins and method of fabrication
05/29/2014US20140145294 Wafer separation
05/29/2014US20140145293 Integrated circuit having improved radiation immunity
05/29/2014US20140145292 Semiconductor Device With Junction Termination Extension Structure On Mesa And Method Of Fabricating The Same
05/29/2014US20140145280 Semiconductor device and production method therefor
05/29/2014US20140145263 Finfet Semiconductor Device Having Increased Gate Height Control
05/29/2014US20140145259 Semiconductor device and method for fabricating the same
05/29/2014US20140145251 Method for forming an insulating trench in a semiconductor substrate and structure, especially cmos image sensor, obtained by said method
05/29/2014US20140145248 Dummy fin formation by gas cluster ion beam
05/29/2014US20140145242 Fin-Last FinFET and Methods of Forming Same
05/29/2014US20140145240 Device architecture and method for precision enhancement of vertical semiconductor devices
05/29/2014US20140145238 Semiconductor devices and fabrication methods
05/29/2014US20140145236 Functionalization of a Substrate
05/29/2014US20140145215 AC LED device and method for fabricating the same
05/29/2014US20140145212 Silicon carbide semiconductor device and method of manufacturing the same
05/29/2014US20140145211 Protective interface in silicon carbide semiconductor devices
05/29/2014US20140145202 Nitride semiconductor crystal
05/29/2014US20140145201 Method and system for gallium nitride vertical jfet with separated gate and source
05/29/2014US20140145194 Semiconductor Device Components and Methods
05/29/2014US20140145193 Lead frame and power module
05/29/2014US20140145192 Mask and method for manufacturing the same, and semicondutor device
05/29/2014US20140145191 Voltage contrast inspection of deep trench isolation
05/29/2014US20140145185 Sputtering target
05/29/2014US20140145184 Thin film transistor substrate and method for producing same
05/29/2014US20140145183 Oxide semiconductor film, film formation method thereof, and semiconductor device
05/29/2014US20140145147 Nitride semiconductor structure and method of fabricating same
05/29/2014US20140144781 Method and apparatus for dynamic current distribution control during electroplating
05/29/2014US20140144585 Hybrid laser and plasma etch wafer dicing using substrate carrier
05/29/2014US20140144474 System for making and cleaning semiconductor device
05/29/2014US20140144465 Substrate cleaning system, substrate cleaning method and memory medium
05/29/2014US20140144464 Substrate cleaning method and substrate cleaning system
05/29/2014US20140144463 Controlling cleaning of a layer on a substrate using nozzles
05/29/2014US20140144462 Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures
05/29/2014US20140144381 Method for washing semiconductor manufacturing apparatus component, apparatus for washing semiconductor manufacturing apparatus component, and vapor phase growth apparatus
05/29/2014US20140144375 Equipment for manufacturing semiconductor
05/28/2014EP2736080A1 Rectifying device, transistor, and rectifying method
05/28/2014EP2736079A2 Method for manufacturing a normally blocked heterojunction transistor
05/28/2014EP2736074A1 Array substrate and manufacturing method thereof, liquid crystal panel, and display device
05/28/2014EP2736072A1 Super junction semiconductor device
05/28/2014EP2736070A1 Vessel for the one-sided processing a substrate
05/28/2014EP2736069A2 Method for producing p-type ZnO based compound semiconductor layer, method for producing ZnO based compound semiconductor element, p-type ZnO based compound semiconductor single crystal layer, ZnO based compound semiconductor element, and n-type ZnO based compound semiconductor laminate structure
05/28/2014EP2736068A2 Substrate recycling method and recycled substrate
05/28/2014EP2736067A1 Method for manufacturing semiconductor device
05/28/2014EP2736066A2 Method for manufacturing a superhydrophobic film sheet
05/28/2014EP2736065A1 Composite wafer and manufacturing method therefor
05/28/2014EP2735906A2 Mask, and optical filter manufacturing apparatus comprising same
05/28/2014EP2735904A1 Thin film formation composition for lithography which contains titanium and silicon
05/28/2014EP2735630A1 Sic epitaxial wafer and method for producing same, and device for producing sic epitaxial wafer
05/28/2014EP2735629A1 Method of manufacturing low temperature polysilicon film, thin film transistor and manufacturing method thereof
05/28/2014EP2735625A1 A device for manufacturing a film used for a solar cell
05/28/2014EP2735028A1 Seed layer for a p + silicon germanium material for a non-volatile memory device and method
05/28/2014EP2735022A2 Interconnect pillars with directed compliance geometry
05/28/2014EP2735020A2 Multi-chamber cvd processing system
05/28/2014DE102013224134A1 Halbleiterbauelement Semiconductor device
05/28/2014DE102013219267A1 System und Verfahren für eine intergrierte Schaltung, die Transistorsegmente aufweist Comprises a system and method for an intergrated circuit, the transistor segments
05/28/2014DE102013113061A1 Halbleiterbausteine und Verfahren für deren Herstellung Semiconductor devices and methods for their preparation
05/28/2014DE102013112683A1 Verfahren zum ausbilden einer halbleiterstruktur und halbleiterstruktur A method of forming a semiconductor structure and semiconductor structure
05/28/2014DE102013112666A1 Method for detaching semiconductor chip from foil, involves assigning process step to last frame assigned time/derived time period while showing that no edge region in image of chip is darker than predetermined brightness value
05/28/2014DE102013019401A1 Transistor auf Gruppe III-Nitrid-Basis mit einem Gate-Dielektrikum mit einem Stoff auf Fluorid- oder Chlorid-Basis Transistor Group III nitride-based products with a gate dielectric containing a substance to fluoride or chloride-based
05/28/2014DE102013006624B3 Hochfrequenzleiter mit verbesserter Leitfähigkeit und Verfahren seiner Herstellung RF conductor with improved conductivity and its method of manufacture
05/28/2014DE102012221824B4 Verfahren zur Herstellung einer Multi-Gate-Transistoreinheit, Multi-Gate-Transistoreinheit und Schaltungsvorrichtung damit A method for producing a multi-gate transistor unit, multi-gate transistor device and circuit device so that
05/28/2014DE102012221669A1 Verfahren zum Herstellen kohlenstoffhaltiger Hydridosilane A method for producing carbonaceous hydridosilanes
05/28/2014DE102012216580A1 Method for generating endowment channel in semiconductor layer of photovoltaic solar cell, involves inserting dopant into semiconductor layer by local warming action for producing endowment region
05/28/2014DE102012216408A1 Verfahren zum zumindest bereichsweisen Einebnen einer Textur einer Halbleiterstruktur A method for at least region-wise planarizing a texture of a semiconductor structure
05/28/2014DE102012111358A1 Verfahren zum Vereinzeln eines Verbundes in Halbleiterchips und Halbleiterchip A method for separating a composite in semiconductor chips and semiconductor chip
05/28/2014DE102012110916A1 Verfahren und Vorrichtung zum Transport flacher Substrate Method and device for transporting flat substrates
05/28/2014DE102012109161A1 Organisches, optoelektronisches Bauelement, Verfahren zum Herstellen eines organischen, optoelektronischen Bauelementes und Verfahren zum stoffschlüssigen, elektrischen Kontaktieren An organic optoelectronic component, method for manufacturing an organic optoelectronic device and method for the cohesive, electrical contact
05/28/2014DE102012016435A1 Method for electrical testing of wafer, involves readjusting relative positions of test contacts and counter contacts of electrical tester to each other depending on result of renewed relative position determination
05/28/2014DE102011013228B4 Verfahren zur Herstellung eines Halbleiterbauelements für 3D-Integration A process for producing a semiconductor device for 3D integration
05/28/2014DE102011004341B4 Säge-Vorrichtung Saw device
05/28/2014DE102010019597B4 Verfahren zum Herstellen einer Elektrodenstruktur sowie Elektrodenstruktur für eine neuronale Schnittstelle A method for producing an electrode structure and electrode structure for a neural interface
05/28/2014DE102009030325B4 Halbleiterchipbaugruppe Semiconductor chip assembly