Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/20/2014US8728893 Method of fabricating a three-dimentional semiconductor memory device
05/20/2014US8728892 Adaptive fin design for FinFETs
05/20/2014US8728891 Method for producing contact openings in a semiconductor body and self-aligned contact structures on a semiconductor body
05/20/2014US8728890 Fabrication of MOS device with integrated Schottky diode in active region contact trench
05/20/2014US8728889 Contact structure and manufacturing method thereof
05/20/2014US8728888 Manufacturing method of semiconductor storage device
05/20/2014US8728887 Method for fabricating capacitor of semiconductor device
05/20/2014US8728886 Integrating formation of a replacement gate transistor and a non-volatile memory cell using a high-k dielectric
05/20/2014US8728884 Enhancement mode normally-off gallium nitride heterostructure field effect transistor
05/20/2014US8728883 Semiconductor device and method for manufacturing semiconductor device
05/20/2014US8728882 Manufacturing method for thin film transistor array panel
05/20/2014US8728881 Semiconductor device and method for manufacturing the same
05/20/2014US8728880 Graphene electronic device and method of fabricating the same
05/20/2014US8728879 Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
05/20/2014US8728878 MOS P-N junction diode device and method for manufacturing the same
05/20/2014US8728877 Method for manufacturing silicon carbide semiconductor device with a single crystal substrate
05/20/2014US8728876 Method of manufacturing semiconductor device
05/20/2014US8728875 Ballasted polycrystalline fuse
05/20/2014US8728874 Method and apparatus for low inductive design pattern
05/20/2014US8728873 Methods for filling a contact hole in a chip package arrangement and chip package arrangements
05/20/2014US8728871 Method for fabricating electronic device package
05/20/2014US8728869 Method for fabricating a semiconductor device and semiconductor package
05/20/2014US8728868 Semiconductor substrate and method for manufacturing semiconductor device
05/20/2014US8728867 Semiconductor device, manufacturing method of semiconductor device, and power source device
05/20/2014US8728866 Method for manufacturing semiconductor device
05/20/2014US8728865 Microelectronic packages and methods therefor
05/20/2014US8728864 Method of fabricating a memory card using SIP/SMT hybrid technology
05/20/2014US8728863 Methods of forming bonded semiconductor structures including interconnect layers having one or more of electrical, optical, and fluidic interconnects therein, and bonded semiconductor structures formed using such methods
05/20/2014US8728862 Thin film transistor, method of manufacturing the same and flat panel display device having the same
05/20/2014US8728861 Fabrication method for ZnO thin film transistors using etch-stop layer
05/20/2014US8728860 Method for manufacturing semiconductor device
05/20/2014US8728859 Small footprint phase change memory cell
05/20/2014US8728856 Method of manufacturing upwardly tapering heaters for phase change memories
05/20/2014US8728855 Method of processing a semiconductor assembly
05/20/2014US8728853 Solid-state image sensing device and method of manufacturing the same
05/20/2014US8728849 Laser cutting through two dissimilar materials separated by a metal foil
05/20/2014US8728847 Solid-state imaging device and method for manufacturing the same
05/20/2014US8728845 Method and apparatus for selectively removing anti-stiction coating
05/20/2014US8728844 Backside CMOS compatible bioFET with no plasma induced damage
05/20/2014US8728843 Nitride semiconductor light emitting element and method for manufacturing same
05/20/2014US8728841 Method of manufacturing ESD resistant nitride semiconductor light emitting device with enhanced light extraction efficiency
05/20/2014US8728839 Memory cells and methods of forming memory cells
05/20/2014US8728837 Enhancing uniformity of slab region thickness in optical components
05/20/2014US8728836 Method for preventing electrostatic breakdown, method for manufacturing array substrate and display substrate
05/20/2014US8728835 Light scattering by controlled porosity in optical ceramics for LEDs
05/20/2014US8728834 Semiconductor device and a method of manufacturing the same
05/20/2014US8728833 Light emitting device using a thermally activated coating and method of manufacturing
05/20/2014US8728832 Semiconductor device dielectric interface layer
05/20/2014US8728831 Reconstituted wafer warpage adjustment
05/20/2014US8728830 Manufacturing method of magneto-resistive element
05/20/2014US8728712 Polymerizable composition
05/20/2014US8728622 Single-crystal substrate, group-III nitride crystal obtained using the same, and process for producing group-III nitride crystal
05/20/2014US8728341 Polishing agent, concentrated one-pack type polishing agent, two-pack type polishing agent and method for polishing substrate
05/20/2014US8728337 Positive displacement pumping chamber
05/20/2014US8728334 Dynamic gas flow control of touchless reactor cells
05/20/2014US8728239 Methods and apparatus for a gas panel with constant gas flow
05/20/2014US8728236 Low dislocation density III-V nitride substrate including filled pits and process for making the same
05/20/2014US8727757 Molding die set and resin molding apparatus having the same
05/20/2014US8727499 Protecting a fluid ejection device resistor
05/20/2014US8727125 Substrate container with fluid-sealing flow passageway
05/20/2014US8726838 Combinatorial plasma enhanced deposition and etch techniques
05/20/2014US8726494 Holding jig for electronic parts
05/20/2014CA2738433C Printed circuit board for harsh environments
05/20/2014CA2606980C Methods for manufacturing rfid tags and structures formed therefrom
05/15/2014WO2014075088A1 Adiabatic planar waveguide coupler transformer
05/15/2014WO2014075055A1 Method and system for mixed mode wafer inspection
05/15/2014WO2014075024A1 Mechanical clamping assembly for a ring-shaped component within a vacuum chamber for substrate processing
05/15/2014WO2014074982A2 Methods of annealing a conductive transparent oxide film layer for use in a thin film photovoltaic device
05/15/2014WO2014074977A2 Heat sink blade pack for device test testing
05/15/2014WO2014074910A1 Unbiased wafer defect samples
05/15/2014WO2014074904A1 Phase grating for mask inspection system
05/15/2014WO2014074873A1 Reducing algorithmic inaccuracy in scatterometry overlay metrology
05/15/2014WO2014074868A1 Method and system for providing a target design displaying high sensitivity to scanner focus change
05/15/2014WO2014074861A1 System and method for detecting cracks in a wafer
05/15/2014WO2014074813A1 Apparatus and method for optical metrology with optimized system parameters
05/15/2014WO2014074777A1 Metal gate mos transistor with reduced gate-to-source and gate-to-drain overlap capacitance
05/15/2014WO2014074589A1 Apparatus for spatial atomic layer deposition with recirculation and methods of use
05/15/2014WO2014074521A1 Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith
05/15/2014WO2014074486A1 Group-iii nitride heterojunction bipolar transistors
05/15/2014WO2014074461A1 Dry etch process
05/15/2014WO2014074455A1 Pressure-less ozonated d i -water (di03) recirculation reclaim system and method
05/15/2014WO2014074416A1 Analytic continuations to the continuum limit in numerical simulations of wafer response
05/15/2014WO2014074413A1 Film thickness, refractive index, and extinction coefficient determination for film curve creation and defect sizing in real time
05/15/2014WO2014074403A1 Monolithic sensor package
05/15/2014WO2014074360A1 Amorphous metal thin-film non-linear resistor
05/15/2014WO2014074221A1 Autonomous tool parameter impact identification for semiconductor manufacturing
05/15/2014WO2014074192A1 Method and structure for forming a localized soi finfet
05/15/2014WO2014074180A1 Nanopillar field-effect and junction transistors
05/15/2014WO2014074096A1 Method for fabricating microelectronic devices with isolation trenches partially formed under active regions
05/15/2014WO2014073963A1 Method for bonding bare chip dies
05/15/2014WO2014073955A1 An apparatus for carrying and transporting a product
05/15/2014WO2014073892A1 Method for manufacturing silicon-containing thin film
05/15/2014WO2014073831A1 Substrate tray and substrate processing apparatus including same
05/15/2014WO2014073716A1 Tin-based solder ball and semiconductor package including same
05/15/2014WO2014073686A1 Ozone generator and ozone generation method
05/15/2014WO2014073676A1 Patterned-film production device and production method
05/15/2014WO2014073656A1 Semiconductor device and semiconductor device fabrication method
05/15/2014WO2014073591A1 Substrate for flexible device, flexible device and method for producing same, laminate and method for producing same, and resin composition
05/15/2014WO2014073585A1 Metal oxide film and method for forming metal oxide film
05/15/2014WO2014073555A1 Bonding wire