Patents for C30B 33 - After-treatment of single crystals or homogeneous polycrystalline material with defined structure (6,009)
07/2001
07/24/2001US6264906 Method for heat treatment of silicon substrate, substrate treated by the method, and epitaxial wafer utilizing the substrate
07/19/2001US20010008750 Method and apparatus for stabilizing high pressure oxidation of a semiconductor device
07/19/2001US20010008656 Bulk single crystal gallium nitride and method of making same
07/19/2001US20010008114 Process for growth of defect free silicon crystals of arbitrarily large diameters
07/18/2001CN1304459A Process for preparing defect free silicon crystal which allows for variability in process conditions
07/12/2001WO2001050161A1 CALCIUM FLUORIDE (CaF2) STRESS PLATE AND METHOD OF MAKING THE SAME
07/12/2001DE10105654A1 Identifying rod-shaped semiconducting material on outer surface involves applying rod-specific characteristic to peripheral surface of rod or saw support surface over entire length of rod
07/10/2001US6258754 Large, strongly linked superconducting monoliths and process for making the same
07/10/2001US6258666 Method of producing semiconductor thin film and method of producing solar cell using same
07/10/2001US6257224 Process for working a preform made of an oxide single crystal, and a process for producing functional devices
07/05/2001WO2001048810A1 Inspecting device for crystal defect of silicon wafer and method for detecting crystal defect of the same
07/05/2001US20010006039 A silicon wafer substrate is hydrogen-annealed to remove impurities and defects, then, an impurity buried layer is formed in an upper surface of silicon wafer substrate, which increases the number of contaminant attractor in upper surface
07/03/2001US6255231 Method for forming a gate oxide layer
07/03/2001US6254672 Low defect density self-interstitial dominated silicon
06/2001
06/28/2001WO2001046493A1 Polycrystalline diamond microstructures
06/27/2001EP1110237A2 Device and method for the high-frequency etching of a substrate using a plasma etching installation and device and method for igniting a plasma and for pulsing the plasma output or adjusting the same upwards
06/27/2001CN1300662A In-line cleaning method after polishing
06/26/2001US6251835 Surface planarization of high temperature superconductors
06/21/2001WO2000015882A9 Method for switching the properties of perovskite materials
06/14/2001WO2001042540A1 Fabrication of periodic surface structures with nanometer-scale spacings
06/14/2001US20010003268 Cooling controlled to allow for the diffusion of intrinsic point defects, such that agglomerated defects do not form in this axially symmetric region
06/13/2001EP1105920A1 Pattern formation method using light-induced suppression of etching
06/13/2001EP1105757A1 Composite photonic crystals
06/13/2001DE19958077A1 Process for polishing both sides of semiconductor wafers comprises simultaneously polishing and treating the front side and the rear side of the wafers, transferring to an aqueous bath, and cleaning and drying
06/12/2001US6246149 Using piezoelectric substrate (strontium, tantalum, gallium, and silicon mixed oxide) with high electromechanical coupling coefficient widens passband width, and low surface acoustic wave velocity makes the device smaller
06/12/2001US6246030 Heat processing method and apparatus
06/07/2001DE19954349A1 Semiconductor wafer production comprises abrasive friction cutting of semiconductor rods, in which cylindrical semiconductor rod is cut with elliptical basal plane
06/06/2001CN1298039A Zinc oxide whisker coated with metal layer
05/2001
05/29/2001US6239044 Apparatus for forming silicon oxide film and method of forming silicon oxide film
05/29/2001US6238482 Method of producing a wafer with an epitaxial quality layer and device with epitaxial quality layer
05/23/2001DE10053025A1 Verfahren und Vorrichtung für die gesteuerte Oxidation von Materialien Method and apparatus for the controlled oxidation of materials
05/23/2001DE10048397A1 Process for restoring a quartz crucible comprises internally repairing the crucible using chemical etching, mechanically grinding or heat treatment at high temperature on the inner surface
05/22/2001US6235543 Method of evaluating a semiconductor wafer
05/17/2001WO2001035450A1 Compound semiconductor wafer
05/17/2001DE19952015A1 Verfahren zum thermischen Behandeln von Objekten A method for the thermal treatment of objects
05/17/2001DE10053834A1 Production of an aluminum nitride thin layer used in thin film technology comprises subjecting the thin layer to a microwave plasma after is has been deposited
05/10/2001WO2001033260A1 Preconditioned crystals of lithium niobate and lithium tantalate and methods of preparing the same
05/10/2001DE19952705A1 Production of a semiconductor wafer with an epitaxial layer comprises placing a wafer on a susceptor and mechanically removing from the susceptor after the epitaxial layer has been deposited
05/09/2001EP1097107A1 A method of altering the colour of a material
05/03/2001WO2001031698A2 Method for thermally treating semiconductor substrates
05/03/2001WO2001031696A1 Composition for chemical purification of surfaces off adsorbed metal ions and atoms
05/03/2001WO2001031659A2 THIN FILM Hg-BASED SUPERCONDUCTORS, THERMOELECTRIC MATERIALS AND METHODS OF FABRICATION THEREOF
05/03/2001CA2389454A1 Thin film hg-based superconductors, thermoelectric materials and methods of fabrication thereof
05/02/2001EP1060509A4 Crystal ion-slicing of single-crystal films
05/02/2001CN1065291C Vacuum heat treatment process of mercury-cadimium-telluriurm molecular beam epitaxial material
05/02/2001CN1065290C Hole conduction mercury cadimium-tellurium epitaxial material heat treatment process and device
05/01/2001US6225190 Process for the separation of at least two elements of a structure in contact with one another by ion implantation
05/01/2001US6224934 Measuring ultraviolet rays
05/01/2001US6224666 Forging cylindrical alkali halide ingots into rectangular plates
04/2001
04/26/2001WO2001029593A1 Ion exchange waveguides and methods of fabrication
04/26/2001WO2000059016A3 Method for producing thin, uniform oxide layers on silicon surfaces
04/26/2001DE10012840A1 Production of semiconductor wafers comprises simultaneously polishing front and rear sides of each wafer between polishing plates covered with cloth, evaluating and then re-polishing
04/26/2001CA2324689A1 Method and apparatus for the controlled oxidation of materials
04/24/2001US6222194 Fast neutron irradiation of sapphire
04/19/2001WO2001026886A1 Electromagnetic radiation absorbant crystals of lithium niobate and lithium tantalate and methods of preparing the same
04/19/2001WO2000034999A9 An epitaxial silicon wafer with intrinsic gettering and a method for the preparation thereof
04/17/2001US6218680 Semi-insulating silicon carbide without vanadium domination
04/17/2001US6217842 Single crystal SIC and method of producing the same
04/12/2001DE10048374A1 Process for the large surface direct bonding of wafers e.g. gallium arsenide wafers comprises carrying out final cleaning of wafers using molecular or atomic hydrogen and bringing cleaned surfaces of wafers in contact with each other
04/11/2001EP1090166A1 Process for growth of defect free silicon crystals of arbitrarily large diameters
04/11/2001CN1291349A Crystal ion-slicing of single crystal films
04/10/2001US6214108 Method of manufacturing silicon carbide single crystal and silicon carbide single crystal manufactured by the same
04/10/2001US6214107 Method for manufacturing a SiC device
04/04/2001EP1089329A1 Production methods of compound semiconductor single crystal and compound semiconductor element
04/04/2001EP1088914A1 Method of growing single crystal GaN, method of making single crystal GaN substrate and single crystal GaN substrate
04/04/2001EP1088911A1 Continuous crystal plate growth process and apparatus
04/04/2001CN1289865A Growth process for monocrystal of gadolinium nitride, substrates of gadolinium mitride monocrystal and manufacture thereof
04/03/2001US6211999 Lithium tantalate single-crystal and photo-functional device
03/2001
03/29/2001WO2001021865A1 Method for producing czochralski silicon free of agglomerated self-interstitial defects
03/29/2001WO2001021864A1 Process for detecting agglomerated intrinsic point defects by metal decoration
03/29/2001WO2001021862A1 Coated diamond, method for preparing the same and composite material comprising the same
03/29/2001WO2001021861A1 Czochralski process for growing single crystal silicon by controlling the cooling rate
03/27/2001US6207282 Substrate surface treatment method
03/21/2001EP1085562A2 Apparatus and method for surface finishing a silicon film
03/20/2001US6204139 Method for switching the properties of perovskite materials used in thin film resistors
03/20/2001US6203772 Heat treatment, crystallization, complexing; semiconductors
03/20/2001US6203728 To decrease an absorption coefficient for a light in a blue light range; optics
03/15/2001WO2001018852A1 Passivation of material using ultra-fast pulsed laser
03/06/2001US6196901 Method of double-side lapping a wafer and an apparatus therefor
03/01/2001WO2000079579A3 Device and method for the high-frequency etching of a substrate using a plasma etching installation and device and method for igniting a plasma and for pulsing the plasma output or adjusting the same upwards
02/2001
02/28/2001CN1285422A Method for removing heavy metal impurity from monocrystal silicon
02/20/2001US6191009 Method for producing silicon single crystal wafer and silicon single crystal wafer
02/20/2001US6190631 Low defect density, ideal oxygen precipitating silicon
02/15/2001WO2001011115A1 Method for producing segmented crystals
02/15/2001DE19953152C1 Process for wet-chemical treatment of semiconductor wafer after mechanical treatment in lapping machine comprises subjecting to ultrasound in an alkaline cleaning solution before etching and rinsing steps
02/15/2001DE19936651A1 Verfahren und Herstellung eines segmentierten Kristalls Process and producing a segmented crystal
02/13/2001US6187092 Method and apparatus for controlling the thickness of a gate oxide in a semiconductor manufacturing process
02/13/2001CA2230262C Silicon carbide gemstones
02/07/2001CN1061705C Precision control oxygen precipitation in silicone
02/06/2001US6184498 Apparatus for thermally processing semiconductor wafer
01/2001
01/30/2001US6180270 Heating gallium nitride bearing substrate layer according to predetermined time-temperature profile
01/30/2001US6179910 Pulling
01/30/2001US6179909 Work crystal orientation adjusting method and apparatus
01/25/2001WO2001005726A2 METHOD FOR IMPROVING THE SURFACE SMOOTHNESS, THE CRYSTAL STRUCTURE AND THE MICROWAVE SURFACE RESISTANCE OF YBa2Cu3O7-δ HIGH-TEMPERATURE SUPERCONDUCTOR FILMS GROWN ON CeO2-BUFFERED r-CUT SAPPHIRE SUBSTRATES
01/24/2001EP1071116A1 Method and apparatus for removing material from the periphery of a substrate, using a remote plasma source
01/23/2001US6177358 Photo-stimulated etching of CaF2
01/23/2001CA2171375C Manufacturing method of a silicon wafer having a controlled bmd concentration in the bulk and a good dz layer
01/18/2001DE10023001A1 Process for mechanically processing monocrystals used in the production of semiconductor wafers comprises rotating the monocrystal about its crystallographic longitudinal axis and treating with ultrasound
01/11/2001WO2001002628A1 Doped diamond
01/11/2001DE10031603A1 Production of a semiconductor wafer comprises etching the wafer using an etching medium along a flow direction laminar to an edge of the wafer
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