Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
02/1998
02/17/1998US5718814 Separating plant for metals from a metal-containing electrolyte
02/11/1998CN1172865A Process for producing metal-coated films in web form
02/10/1998US5716510 Method of making a continuous casting mold
02/10/1998US5716502 Electrolytic cell, useful for eletroplating of metals, such as copper
02/04/1998EP0822272A1 Resonating electroplating anode
02/04/1998EP0821745A1 Method of electroplating a substrate, and products made thereby
02/03/1998US5714049 Sheet or strip post treated with buffered alkaline solution to form zinc oxide layer
01/1998
01/31/1998CA2210961A1 Resonating electrolytic plating anode
01/28/1998EP0821075A1 Platinum modified aluminide diffusion coating and method
01/28/1998EP0725727A4 Method of making machine-engraved seamless tube
01/27/1998US5712049 Sliding element and process for producing the same
01/27/1998US5712047 Copper foil for printed wiring board
01/27/1998US5712046 Titanium ring for an electrodeposition drum and a method for its manufacture
01/22/1998WO1998002912A1 Interface apparatus for a semiconductor workpiece processing tool
01/22/1998WO1998002911A1 Modular semiconductor workpiece processing tool
01/22/1998WO1998002263A1 Element of a continuous metal casting ingot mould with a copper or copper alloy cooled wall comprising on its external surface a metal coating, and method of coating
01/22/1998CA2258927A1 Element of a continuous metal casting ingot mould with a copper or copper alloy cooled wall comprising on its external surface a metal coating, and method of coating
01/21/1998CN1171167A Composite intermediate connecting element of microelectronic device and its production method
01/21/1998CN1170783A Process and device for electrolytic treatment of continuous running materials
01/07/1998EP0443009B1 Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
12/1997
12/31/1997WO1997049843A1 Method and installation for the electrolytic coating with a metal layer of the surface of a cylinder for the continuous casting of thin metal strips
12/31/1997CN1169166A Laminated material for sliding components and method and means for its prodn.
12/30/1997US5702583 Using photoresist
12/29/1997EP0814182A1 Process for producing strip-shaped metal coated foil
12/23/1997US5700362 Method of treating copper foil for printed circuits
12/17/1997CN2270737Y Internal hole plating iron device
12/17/1997CA2207701A1 Process for producing metal-coated films in web form
12/16/1997US5698081 Coating particles in a centrifugal bed
12/11/1997WO1997046737A1 Laminated material for sliding members, and process for the production thereof
12/10/1997EP0811706A1 Conformable nickel coating and process for coating an article with a conformable nickel coating
12/09/1997US5695621 Hollow anode, resonator aligned along interior surface of anode; corrosion resistance, durability
12/04/1997DE19622166A1 Layer material used for sliding element
12/03/1997EP0810658A2 Semiconductor device comprising a via-hole
11/1997
11/26/1997CN1166187A Electrolytic treating device for plate-like workpieces, in particular printed circuit boards
11/25/1997US5691071 Bonding strength, tires
11/20/1997WO1997043555A1 Thin-walled bearings
11/20/1997DE19632132C1 Electrochemical treatment of rod-shaped components
11/12/1997EP0795200A4 Mounting electronic components to a circuit board
11/11/1997US5685970 Method and apparatus for sequentially metalized polymeric films and products made thereby
11/06/1997WO1997041279A1 Electrochemical fluidized bed coating of powders
11/06/1997CA2252528A1 Electrochemical fluidized bed coating of powders
11/05/1997EP0760023B1 Device for processing flat workpieces, in particular printed circuit boards
11/05/1997EP0701636B1 Method and apparatus for the electrolytic production of copper wire
10/1997
10/30/1997DE19713647A1 Apparatus for galvanic precipitation of one-sided or two-sided metal or alloy coatings onto a metal strip
10/28/1997US5681443 Electrodeposition of electroconductive matal on to a nonmetallic, dielctric polymeric substrate, the time is reduced by reducing the gap between active anode surfaces and moving substrate thereby reducing thermal power loss too
10/21/1997US5679234 Process of forming miniature pattern well controlled in thickness on semiconductor wafer through selective electroplating
10/21/1997US5679233 Method and apparatus for anodizing
10/21/1997US5679230 Copper foil for printed circuit boards
10/15/1997EP0801153A1 Process and device for the electrolytic treatment of continuously moving articles
10/08/1997EP0799911A1 Electroplating process and composition
10/01/1997EP0797693A1 Laminated material for sliding components and method and means for its production
10/01/1997CN1161065A High fatigue ductility electrodeposited copper foil
09/1997
09/25/1997WO1997035334A1 A method of selectively metallising an inner, electrically insulating surface of an open body, and a scan velocity modulator manufactured using such a method
09/24/1997CN1035957C Process and apparatus for manufacture of metal foil
09/23/1997US5670034 Reciprocating anode electrolytic plating apparatus and method
09/18/1997WO1997034029A1 Compound electrode for electrolysis
09/18/1997WO1997034028A1 Method of nickel-plating large components
09/17/1997EP0795200A1 Mounting electronic components to a circuit board
09/16/1997US5667662 Conductive polymer, nonionic polymeric surfactant stabilizer with anionic end group
09/16/1997US5667661 Wire plating
09/10/1997WO1997037063A1 Method of straightening warp of steel strip in electroplating line
09/10/1997CN1035833C Wire electric-plating equipment
09/09/1997CA2058109C Method for forming a sieve material having low internal stress and sieve material so obtained
09/04/1997WO1997032058A1 Tin plating method and bath having wide optimum current density range
09/04/1997WO1997025454A3 Electrolytic plating of steel substrate
09/04/1997CA2247440A1 Tin plating method and bath having wide optimum current density range
09/03/1997EP0792463A1 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
09/03/1997EP0792391A1 Electrolytic treatment device for plate-like workpieces, in particular printed circuit boards
08/1997
08/28/1997WO1997031138A1 Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method
08/26/1997US5660707 Process for improving the formability and weldability properties of zinc coated sheet steel
08/20/1997CN1157341A Electrolytic processing apparatus
08/13/1997EP0788728A1 Process for coating electrically non-conducting surfaces with connected metal structures
08/13/1997CN1157030A Micro-valve and process for manufacturing micro-valve
08/12/1997US5655295 Lead-provided porous metal sheet and method for manufacturing the sheet
08/06/1997CN1156190A Copper foil for printed wiring board, its producing method and electrolytic device
07/1997
07/31/1997WO1997027348A1 Apparatus and method for electroplating a metal onto a substrate
07/31/1997WO1997011209A3 Process and device for treating holes or recesses in workpieces with liquid treatment agents
07/23/1997CN1155230A Electroplating method
07/17/1997WO1997025454A2 Electrolytic plating of steel substrate
07/16/1997EP0722516B1 Device for the selective treatment of the surface of workpieces by flooding the workpieces with a treatment liquid
07/15/1997US5648178 Reactor system steel portion
07/10/1997DE19638609A1 Producing a porous galvanically formed shell
07/08/1997US5645707 Bonding method for chip-type electronic parts
07/08/1997US5645641 Device for pretreating and/or coating the running surfaces of cylinders
07/01/1997US5642700 Sliding contact-making structures in internal combustion engine and method for producing same
06/1997
06/26/1997WO1997022418A1 Radiation-cured edge-masking process for high speed electrogalvanizing
06/26/1997DE19653210A1 Electroplated nitrogen-containing iron layer
06/24/1997US5641454 Composite material having anti-wear property and process for producing the same
06/19/1997WO1997022152A1 PREPARATION OF CuxInyGazSen (x=0-2, y=0-2, z=0-2, n=0-3) PRECURSOR FILMS BY ELECTRODEPOSITION FOR FABRICATING HIGH EFFICIENCY SOLAR CELLS
06/19/1997WO1997016866A3 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices
06/18/1997EP0778924A1 Micro-valve and process for manufacturing a micro-valve
06/17/1997US5639360 For plating or deplating of metal strips; enclosure includes ion permeable membrane
06/12/1997WO1997020971A1 Continuously electroplated foam of improved weight distribution
06/12/1997WO1997020969A1 Coating particles in a centrifugal bed
06/12/1997CA2239483A1 Coating particles in a centrifugal bed
06/11/1997EP0778361A2 A copper foil for a printed circuit board, a process and an apparatus for producing the same
06/11/1997CN1151609A Method for planarizing non planar layer
06/10/1997US5637404 Reflective aluminum strip
06/04/1997EP0777058A1 Sliding material and methods of producing same
06/04/1997EP0776385A2 High fatigue ductility electrodeposited copper foil