| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 03/13/2002 | CN1339620A Gold electroplatic method for flowers |
| 03/12/2002 | US6355366 Exposing cleaned and activated workpiece to galvanic chromium plating bath to form a plating of hard chromium, filling and smoothing beaded or columnar structured surface by applying lubricant based on molybdenum disulfide, exposing |
| 03/12/2002 | US6355363 For holding open lumina |
| 03/12/2002 | US6355154 Article plated with boron carbide in a nickel-phosphorus matrix, and process and bath for its preparation |
| 03/12/2002 | US6355153 Chip interconnect and packaging deposition methods and structures |
| 03/07/2002 | WO2002018677A1 Method for coating a number of similar base bodies and use of said method |
| 03/07/2002 | WO2001059185A3 Pre-plate treating system |
| 03/07/2002 | US20020027082 Method of improving contact reliability for electroplating |
| 03/07/2002 | US20020027081 For forming copper interconnects by plating a semiconductor substrate with copper to fill copper in fine recesses for interconnects formed in the surface of substrate |
| 03/07/2002 | DE10040935A1 Verfahren zur metallischen Beschichtung der Oberfläche von Hochtemperatur-Supraleitern A method for metal coating the surface of high temperature superconductors |
| 03/06/2002 | EP1185153A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185152A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185151A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185150A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1184904A2 Substrate for manufacturing a semiconductor device with three element alloy |
| 03/06/2002 | EP1184165A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil |
| 03/06/2002 | CN1338879A Movable terminal, coaxial connector and communication device |
| 03/05/2002 | US6352600 Forming bullets from two dissimilar metals and/or alloys that have been bonded together and heat-treating such bullets |
| 03/05/2002 | US6352467 Integrated electrodeposition and chemical mechanical polishing tool |
| 03/01/2002 | CA2317233A1 Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing |
| 02/28/2002 | WO2002017396A1 Substrate for manufacturing a semiconductor device with three element alloy |
| 02/28/2002 | WO2002016674A1 Method for metal coating the surface of high temperature superconductors |
| 02/28/2002 | WO2002016673A1 Electrochemical treating method such as electroplating and electrochemical reaction device therefor |
| 02/28/2002 | WO2001068312A3 Brazing sheet product and method of manufacturing an assembly using the brazing sheet product |
| 02/28/2002 | US20020025449 An electroactive film on a substrate and method of making |
| 02/28/2002 | US20020023845 Platable engineered polyolefin alloys |
| 02/27/2002 | EP1181993A1 A method for manufacturing a multiple walled tube |
| 02/27/2002 | CN2478709Y Copper foil producing combine |
| 02/26/2002 | US6350688 Annealing deposited metal layer on semiconductor substrate in vacuum; planarization; reducing via resistance via interconnects; |
| 02/26/2002 | US6350366 Uniform coatings on substrates and to provide substantially defect free filling of small features |
| 02/26/2002 | US6350364 Method for improvement of planarity of electroplated copper |
| 02/21/2002 | WO2002015245A2 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 02/21/2002 | WO2002014583A2 Electroplated aluminum parts and process of production |
| 02/21/2002 | WO2001050821A3 Conditioning of through holes and glass |
| 02/21/2002 | US20020022363 Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| 02/21/2002 | US20020020629 Lead frame and method of manufacturing the lead frame |
| 02/21/2002 | US20020020628 A mask is in spaced relation proximite to but does not contact the top surface of a workpiece, while moving relative to it |
| 02/21/2002 | US20020020623 Electrochemical cell system output control method and apparatus |
| 02/21/2002 | US20020020621 Semiconductor workpiece proximity plating apparatus |
| 02/21/2002 | DE10121774A1 Material for ball-grid arrays comprises a plating layer formed from two metals which are mixed together on a metal material as the base material and a covering layer formed from the metal on the plating layer |
| 02/21/2002 | CA2417980A1 Electroplated aluminum parts and process of production |
| 02/20/2002 | EP1088121B1 Method for metal coating of substrates |
| 02/20/2002 | CN1337064A Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| 02/20/2002 | CN1079448C Stainless steel wire and producing method therefor |
| 02/19/2002 | CA2051266C Metal-film laminate resistant to delamination |
| 02/14/2002 | WO2002013289A1 Surface-treated steel plate for battery case and battery case |
| 02/14/2002 | US20020017456 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 02/13/2002 | EP1179616A2 Method and apparatuses for electrochemically treating an article |
| 02/13/2002 | EP1179615A2 Method for electrochemically treating articles and apparatus and method for cleaning articles |
| 02/13/2002 | CN1335419A Electroplating method using with combination of electroplating liquid vibrating flow and pulse type electroplating current |
| 02/13/2002 | CN1335418A Electronic element, method for producing electronic element and circuit board |
| 02/12/2002 | US6346182 Placing conductive particulate substrate and catalyst source into electrically conductive environment, aligning substrate with electric field, creating electric field sufficient to deposit catalyst on substrate at predetermined location |
| 02/12/2002 | US6346181 Electroplating process for preparing a Ni layer of biaxial texture |
| 02/07/2002 | WO2002011153A1 Lead-coated complex porous structures, and corresponding method for conductive activation |
| 02/07/2002 | US20020015782 Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
| 02/07/2002 | US20020014255 Disposing an array of dedicated cells which includes an array of electrochemical processing cells; moving tubings relative to the array of dedicated cells, disposing electrolytic fluid in electrode chamber, performing electrolysis |
| 02/07/2002 | DE10035102A1 Verfahren zur Beschichtung von Bauteilen aus gehärtetem Stahl oder Eisenguss mit Zink-Nickel-Legierungen Method for coating components made of hardened steel or cast iron with zinc-nickel alloys |
| 02/06/2002 | EP1178128A1 Method of forming chromium coated copper for printed circuit boards |
| 02/05/2002 | US6344129 Method for plating copper conductors and devices formed |
| 02/05/2002 | US6344124 To obtain sharp boundaries between successive layers, voltage is switched from an electroplating substrate to a dummy electrode before power setting is changed, to allow the electrolyte to equilibrate |
| 02/05/2002 | US6344123 To obtain sharp boundaries between successive layers, voltage is switched from an electroplating substrate to a dummy electrode before power setting is changed, to allow the electrolyte to equilibrate |
| 01/31/2002 | WO2002009207A2 Electrochemical cell system output control method and apparatus |
| 01/31/2002 | WO2001050505A3 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 01/31/2002 | US20020012811 Pretreatment, brazing aluminum, or alloy thereof |
| 01/31/2002 | US20020011673 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
| 01/31/2002 | US20020011418 Method for surface treatment of copper foil |
| 01/31/2002 | US20020011417 Method and apparatus for plating and polishing a semiconductor substrate |
| 01/31/2002 | US20020011415 Positioning electroconductive substrate in a chamber containing electrochemical bath, applying a plating bias to the substrate while immersing into bath, and depositing third conductive material in situ to fill; pulsation |
| 01/31/2002 | US20020011414 Bearing having multilayer overlay and method of manufacture |
| 01/30/2002 | EP1175518A1 Alloy coating of cast iron |
| 01/30/2002 | CN1333843A Process for metallizing a plastic surface |
| 01/30/2002 | CN1078631C Lead and lead alloy surface pretreatment agent |
| 01/29/2002 | US6342147 Iron plating on metal surface |
| 01/29/2002 | US6341998 Integrated circuit (IC) plating deposition system and method |
| 01/29/2002 | CA2164049C Article having a decorative and protective coating simulating brass |
| 01/24/2002 | WO2002006566A1 Method for coating components consisting of hardened steel or cast iron with a zinc-nickel alloy |
| 01/24/2002 | US20020008037 System for electrochemically processing a workpiece |
| 01/24/2002 | US20020008036 Multilayer; substrates, barrier on anode rod in tube, cyliner walls |
| 01/24/2002 | US20020008035 Method and apparatus for anodizing objects |
| 01/24/2002 | US20020008034 Using alkaline electrolyte bath; uniform overcoatings |
| 01/24/2002 | DE10131393A1 Herstellung von Gasseparatoren für Brennstoffzellen und dabei verwendete Apparatur Production of gas separators for fuel cells and apparatus used therein |
| 01/24/2002 | DE10033433A1 Verfahren zur elektrolytischen Verzinkung aus alkansulfonsäurehaltigen Elektrolyten Process for the electrolytic galvanizing of alkanesulfonic acid electrolyte |
| 01/24/2002 | CA2415736A1 Process for deposition of metal on a surface |
| 01/23/2002 | EP1175132A1 Surface-treated copper foil and method for manufacturing the surface-treated copper foil |
| 01/23/2002 | EP1174530A2 Methods of producing conductor layers on dielectric surfaces |
| 01/23/2002 | EP0954385A4 Fluid delivery apparatus and method |
| 01/22/2002 | CA2236153C Coated article |
| 01/22/2002 | CA2236152C Article having a decorative and protective coating |
| 01/17/2002 | WO2002004712A2 Flow diffuser to be used in electro-chemical plating system |
| 01/17/2002 | WO2001032951A3 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 01/17/2002 | WO2001020647A3 Novel chip interconnect and packaging deposition methods and structures |
| 01/17/2002 | DE10061186C1 Electroplating of nickel, cobalt, and their alloys onto rocket engine components, uses differing current densities and pulsed charge ratios at anode and cathode |
| 01/16/2002 | EP1171304A1 Improved gravure printing rollers |
| 01/16/2002 | EP1171239A1 Method for producing a catalyst |
| 01/16/2002 | EP1171238A1 Method for producing a catalyst by means of electrodeposition |
| 01/16/2002 | CN1077904C Resin shaped article with surface coating for vehicle |
| 01/10/2002 | US20020004320 Attaratus for socketably receiving interconnection elements of an electronic component |
| 01/10/2002 | US20020004301 Submicron metallization using electrochemical deposition |
| 01/10/2002 | US20020004145 Crown compounds |
| 01/10/2002 | US20020003092 Refractory metal plates of are tightly, form-fittingly joined together back to back and coated with platinum on exposed surfaces by melt electrolysis, then separating plates; use as anodes in electrolytic and electroplating processes |