Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
03/2003
03/12/2003EP1204786B1 Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement
03/12/2003CN1401822A Coating method
03/11/2003US6531046 Contacting metal seed layer on substrate with acidic electrolyte bath containing acids, copper compounds, suppressors and water, then subjecting to current
03/11/2003US6531045 Acid resistance
03/06/2003WO2003019641A1 Dummy structures to reduce metal recess in electropolishing process
03/06/2003WO2003019579A1 Conductive paste and conductive film using it, plating method and production method for fine metal component
03/06/2003WO2003018881A1 Device for continuous electrodeposition and electrical or electronic components manufactured in strip comprising a plated layer by electrodeposition
03/06/2003WO2003018875A1 Electrodeposition apparatus and method using magnetic assistance and rotary cathode for ferrous and magnetic particles
03/06/2003WO2002097165A3 Apparatus and methods for electrochemical processing of microelectronic workpieces
03/06/2003WO2002069679A3 Stacked panel processing apparatus and methods
03/06/2003US20030045095 Method for filling recessed micro-structures with metallization in the production of a microelectronic device
03/06/2003US20030044303 Ultra high saturation moment soft magnetic thin film and its manufacturing method
03/06/2003US20030042146 Method of plating and pretreating aluminium workpieces
03/06/2003US20030042145 Ultrasonically-enhanced electroplating apparatus and methods
03/06/2003US20030042144 Multilayer coating of copper and silver, nickel alloy
03/06/2003US20030041924 Hardness; lubricity; friction resistance; wear resistance; for use as automotive/aeronautical component, tool for injection molding, or for use in medicine (joint replacement)
03/06/2003CA2456301A1 Dummy structures to reduce metal recess in electropolishing process
03/05/2003EP1289352A2 High-frequency circuit device and method for manufacturing the same
03/05/2003EP1288340A2 Galvanic apparatus
03/05/2003EP1287179A2 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part
03/05/2003EP1115913B1 Method for producing wear resisting surfaces
03/05/2003CN1401137A Electronic device and method of manufacturing the electronic device
03/04/2003US6528424 Method of electroplating a copper-zinc alloy thin film on a copper surface using a chemical solution
03/04/2003US6528182 Zinc coated steel plates coated with a pre-lubricating hydroxysulphate layer and methods for obtaining same
03/04/2003US6528181 Surface-treated steel sheet having lowered contact resistance and connecting terminal members made by using the same
03/04/2003US6527925 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
03/04/2003US6527881 Depositing tin layer and nickel layer on substrate sequentially forming multilayered film; irradiating laser beams onto the multilayered film to form the tin-nickel alloy film
02/2003
02/27/2003WO2003016595A1 Member excellent in antibacterial and/or antialgae effects and process for producing the same
02/27/2003WO2003015870A2 Radioactive implantable devices and their production methods
02/27/2003WO2002077327A3 Mask plate design
02/27/2003US20030039754 Preactivation of plastic surfaces to be metallized
02/27/2003US20030038161 Method for manufacturing a multiple walled tube
02/27/2003US20030038107 Method and apparatus for removal of unwanted electroplating deposits
02/27/2003US20030038038 Using a no-contact process with electrochemical deposition, followed by a contact process with electrochemical mechanical deposition
02/27/2003US20030038036 Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith
02/27/2003US20030038035 Actively changing the first current distribution to produce a second current distribution different from the first in the electrolytic fluid while the microelectronic workpiece is in contact therewith
02/27/2003US20030038034 Rotary flow-through electrodeposition system comprising a cell for holding electrolytic fluid and substrate material particles; an electrode; and magnets for drawing substrate material particles in the cell against the electrode
02/26/2003EP1285979A1 Displacement gold plating solution
02/25/2003US6524462 Electroplating electroconductive regions with tool
02/25/2003US6524461 Electrodeposition of metals in small recesses using modulated electric fields
02/25/2003US6524458 Process and installation for coating a surface by electrophoresis
02/20/2003WO2003014426A1 Method for producing electroconductive particles
02/20/2003WO2003014425A1 Copper on invar composite and method of making
02/20/2003WO2003014424A1 Device and method for galvanic surface treatment of work pieces
02/20/2003US20030036269 Method of removing smear from via holes
02/20/2003US20030035977 Barrier layer for electrical connectors and methods of applying the layer
02/20/2003US20030034251 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
02/20/2003US20030034250 Reverse voltage bias for electro-chemical plating system and method
02/20/2003DE10209365C1 Process for electrolytically metallizing the walls of holes in e.g. circuit boards, conductor foils and strips comprises inserting the material into a working container, contacting with an electrolyte, and further processing
02/19/2003CN1397468A Brake and its mfg. method
02/19/2003CN1397420A Local welding method for parts otd. by jet moulding process
02/18/2003US6521358 Lead frame for semiconductor device and method of producing same
02/13/2003WO2003012175A2 Method for selectively electroplating a strip-shaped, metal support material
02/13/2003WO2003012174A1 Electrolytic process for depositing a layer of copper on a steel wire
02/13/2003WO2002045476A3 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
02/13/2003US20030032205 Apparatus for use in the application of components of one or more source materials to preferential positions on substrate
02/13/2003US20030029732 Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
02/13/2003US20030029730 Copper on INVAR® composite
02/13/2003DE10129900C1 Verfahren zur Wärmebehandlung eines Kaltbandes mit einer Oberflächenbeschichtung aus Ni und/oder Co, durch das Verfahren herstellbares Blech und durch das Verfahren herstellbarer Batteriebecher A method of heat treatment of a cold strip with a surface coating of Ni and / or Co, producible by the method and sheet producible by the method of battery cans
02/12/2003CN1396305A Process for metallizing surface of ultra-hard material
02/11/2003US6518182 Via-filling process
02/11/2003US6517894 Method for plating a first layer on a substrate and a second layer on the first layer
02/11/2003US6517893 Method of manufacture of printed wiring boards having multi-purpose finish
02/11/2003US6517698 System and method for providing rotation to plating flow
02/06/2003WO2003010365A1 Plating method and plating apparatus
02/06/2003WO2003010364A2 Dynamic pulse plating for high aspect ratio features
02/06/2003WO2003010357A1 Electroconductive structure and electroplating method using the structure
02/06/2003US20030026913 Multilayer stacks of tin and zinc; applying laser radiation
02/06/2003US20030024819 Method of providing conductive tracks on a printed circurt and apparatus for use in carrying out the method
02/06/2003US20030024613 Multilayered film of tin and zinc layers is heated to a given temperature to form a tin-zinc alloy film through the diffusion of the tin elements of the tin layer into the zinc layer.
02/05/2003EP1281793A1 Method of metallising plastic surfaces
02/05/2003EP1281792A2 A combined adhesion promotion and direct metallization process
02/05/2003EP1281789A1 A plated copper alloy material and process for production thereof
02/05/2003CN1394988A Multi-layer nickel-plating process by adopting single bath process
02/05/2003CN1394985A Composite deposition process on surface of piston ring
02/04/2003US6514400 Method for producing a fuel cell separator
01/2003
01/30/2003WO2003009361A2 Planar metal electroprocessing
01/30/2003WO2003008671A1 Composite foil and its manufacturing process
01/30/2003US20030019756 Reaction is executed in a reaction vessel containing matter in a supercritical or subcritical state and an electrolytic solution; free of generated liquid waste, no need to clean the electrode
01/30/2003US20030019755 Metal electrodeposition with at least one time interval pulses of zero electrical voltage or current, gradually decreased pulses to provide a void-free and seam-free coatings
01/30/2003US20030019653 Intermetallic contact surface structure and connector
01/30/2003CA2454377A1 Composite foil and its manufacturing process
01/29/2003EP1278899A1 Method and device for the electrolytic coating of a metal strip
01/29/2003EP1278898A1 Textured metal article
01/29/2003EP1097261B1 Galvanic bath, method for producing structured hard chromium layers and use thereof
01/28/2003US6512667 Supercapacitor using iron oxide as active material of electrodes formed on current collector which is portion of peripheral surface of case, chassis, compartment, cover, frame or housing of appliance or vehicle
01/23/2003WO2003007412A1 Polymer electrolyte membrane for electrochemical and other applications
01/23/2003WO2003006193A1 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll
01/23/2003US20030015433 Electrolytic copper plating method
01/23/2003DE10134074C1 Casting roller used for casting molten metal, especially molten steel, comprises a metallic rolling body having a metallic layer which is harder than the material of the rolling body
01/23/2003CA2450564A1 Continuous casting roll for casting molten baths and method for producing one such continuous casting roll
01/22/2003EP1277983A1 Brake device & method using Ni-W alloy plating
01/22/2003EP1277852A1 Process for partially galvanising a workpiece made by injection moulding
01/22/2003EP1276919A2 Electroplating bath composition and method of using
01/22/2003EP1042539A4 Printed circuit manufacturing process using tin-nickel plating
01/22/2003CN1392572A Thin film resistor element and its producing method
01/22/2003CN1392294A Plating method of electrocytic copper
01/22/2003CN1099475C Electroplating apparatus
01/22/2003CN1099334C Component of printed circuit boards
01/21/2003US6509275 Method of manufacturing thin film and pretreating method thereof