Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
01/2001
01/24/2001EP1070156A1 Agent for sealing metallic ground coats, especially ground coats consisting of zinc or zinc alloys
01/23/2001US6176995 Improving the transfer of materials at the surface of the material for treatment consists in generating a large flow of electrolyte at the treatment point by means of rotating electrodes which move synchronously
01/23/2001US6176992 Method and apparatus for electro-chemical mechanical deposition
01/18/2001WO2001004944A2 Method and apparatus for simultaneously cleaning and annealing a workpiece
01/18/2001WO2001004386A1 Hard-chrome plated layer
01/18/2001WO2001004385A1 Device and method for the partial electrochemical treatment of bar-shaped elements
01/18/2001DE19931829A1 Galvanische Hartchromschicht Galvanic hard-chromium layer
01/18/2001DE19931230A1 Production of bipolar pulsed streams in electrolytic apparatus comprises using a pulse regulator between the exits of two direct current intermediate circuits and electrolytic cells
01/17/2001EP1069213A2 Optimal anneal technology for micro-voiding control and self-annealing management of electroplated copper
01/17/2001EP1069212A1 Electrochemical deposition for high aspect ratio structures using electrical pulse modulation
01/17/2001CN1280213A Producing technology for copper-clad panel
01/16/2001US6174426 Mono(2-(nonylphenoxypolyethoxy)ethyl phosphate, hexadecyltrimethylammonium halide or hydrolysable organosilane
01/16/2001US6174425 Electroplating process makes electrical current density across a semiconductor device substrate surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material.
01/16/2001US6174417 Electroplating machine
01/16/2001US6174416 Micromechanical component production method
01/11/2001WO2001002186A1 Coating method and products obtained by same
01/11/2001WO2001002121A1 Structure and method for joining metal members
01/11/2001DE19932045A1 Production of electrically conducting strips for transporting electrical current in cables comprises electrolytic application of electrical conducting pathways to a strip-like insulator
01/11/2001CA2376280A1 Coating method and products obtained by same
01/10/2001EP1067221A2 Method and apparatus for plating substrate and plating facility
01/10/2001EP1067220A2 Article plated with boron carbide in a nickel-phosphorus matrix, and process and bath for its preparation
01/10/2001CN1279810A High corrosion-resistant R-Fe-B-base bonded magnet and method of manufacturing the same
01/09/2001US6171468 Electroconductive carbon coating on nonconductive surface
01/03/2001EP1064656A1 Thick complex porous structures made electrically conductive, and corresponding method for conductive activation
01/03/2001EP1064417A1 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
01/03/2001EP0876306B1 Method of applying a silver layer to a glass substrate
01/03/2001CN1278873A Method for producing abrasive tips for gas turbine blades `
01/02/2001US6168704 Site-selective electrochemical deposition of copper
01/02/2001US6168691 Device for electrochemical treatment of elongate articles
12/2000
12/28/2000DE19929090A1 Verfahren zur Beschichtung eines Werkstückes mit einem Schmierstoff A method of coating a workpiece with a lubricant
12/28/2000DE19726510C2 Vorrichtung und Verfahren zur elektrolytischen Metallabscheidung mittels Pulsstrom Apparatus and method for electrolytic metal deposition by means of pulse current
12/27/2000EP1063323A2 Process for coating a work piece with a lubricant
12/27/2000EP1062373A1 A surface-treated steel wire for reinforcing structures for articles of manufacture made of elastomeric material and an article of manufacture comprising the same
12/27/2000EP0905285B1 Method for electroplating nonconductive material
12/27/2000EP0827627B1 A method of selectively metallising an inner, electrically insulating surface of an open body, and a scan velocity modulator manufactured using such a method
12/27/2000CN1278308A Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
12/26/2000US6165640 Battery can-forming plate and battery can
12/26/2000US6165630 Electrolytic graining; anodizing; immersion in zinc solution
12/26/2000US6165340 Plating a shield to a permeable core in a pattern by computer and configured to achieve a controlled leakage inductance, where the predetermined pattern covers less than the entire surface area of the permeable core
12/21/2000WO2000077278A1 Method and apparatus for electroplating depressions of a substrate simultaneously preventing plating on the substrate surface using a membrane cover
12/20/2000EP1061575A1 Process for plating metal parts of semiconductor devices
12/20/2000EP1061159A1 Plating apparatus, plating system, method for plating using the same
12/20/2000EP1060818A1 Highly porous three-dimensional chromium containing alloy structures
12/20/2000EP1060298A1 Galvanic coatings of iron-cobalt compounds with ceramic particles
12/20/2000EP1060297A2 Electrolytic copper foil having a modified shiny side
12/19/2000US6162726 Gas shielding during plating
12/19/2000US6162344 Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
12/19/2000US6162335 Apparatus for selectively electroplating an airfoil
12/14/2000WO2000075995A1 Chip and method for fitting out a chip comprising a plurality of electrodes
12/14/2000WO2000075932A1 Aqueous carbon composition and method for coating a non conductive substrate
12/14/2000WO2000075402A1 Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell
12/14/2000WO2000075401A1 Simultaneous electrical and fluid connection for anode
12/13/2000EP1059368A2 Process for metallising of moulded parts and for the manufacture of a sealed enclosure
12/12/2000CA2144486C Article having a decorative and protective multilayer coating simulating brass
12/07/2000WO2000074155A1 Surface-treated steel sheet for battery case, battery case comprising the same, methods for producing them, and battery
12/07/2000WO2000040784A3 Methods for coating metallic articles
12/07/2000DE19925373A1 Metal electroplating process, especially for producing metallic microstructures, uses a periodic succession of deposition pulses and pauses and electrolyte movement relative to the workpiece
12/06/2000CN1275819A Metal porous body and making methd thereof, current collector for cell having same
12/06/2000CN1059244C Organic rust-proof treating copper foil
12/06/2000CN1059154C Corrosion-resistant nickle plating sheet steel and its manufacturing method
11/2000
11/30/2000WO2000071921A2 Burrless castellation via process and product for plastic chip carrier
11/30/2000WO2000071784A2 Brazing sheet product and method of its manufacture
11/30/2000WO1999040615A9 Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
11/29/2000EP1056144A2 Metallic porous body and method of manufacturing the same and battery current collector having the same
11/29/2000EP1055020A2 Plating apparatus and method
11/28/2000US6153078 Providing unfired ferrite substrate; coating conductive material comprising silver/palladium particles, ferrite particles, cellulose-based binder, solvent; firing substrate; electroplating copper using copper pyrophosphate bath
11/28/2000US6152995 Etching to control thickness
11/22/2000EP1054081A2 Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating
11/22/2000EP1054080A2 Electrolytic copper plating solutions
11/22/2000CN1274021A Electrolytic copper electroplating liquid
11/22/2000CN1058667C Two-colour forming method for metal
11/21/2000US6150711 Ferroalloy substrate, first precious metal(pm) plating layer, intermediate layer of copper (alloy) plating layer and a nickel (alloy) plating layer, and a second pm plating layer formed sequentially on substrate; anticorrosion, solderable
11/21/2000US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive
11/21/2000US6149791 Process and apparatus for the selective electroplating of electrical contact elements
11/21/2000US6149790 Electroplating material with iron alloy containing 2-20 weight % of chromium to form electroplated surface with cracks, heat-treating the electroplated material at 450 to 650 degrees c, producing inter-diffusion layer at at boundary
11/16/2000WO2000068464A2 Alloy plating
11/16/2000DE19932785C1 Partial electrochemical treatment apparatus, e.g. for electroplating or etching shock-absorber or valve rods, provides masking system vertical tolerance equalization by lowering a rod workpiece and pressing down a membrane holder
11/16/2000DE19920394A1 Legierungsbeschichtung von Grauguß Alloy coating of gray cast iron
11/16/2000CA2372579A1 Alloy plating
11/15/2000EP1052321A1 Metallic non woven fabric and method for manufacturing the same
11/15/2000EP1051886A2 Device for electrolytic treatment of printed circuit boards and conductive films
11/15/2000EP1051544A2 Process chamber and method for depositing and/or removing material on a substrate
11/15/2000EP1051543A2 Method for electroplating metal coating(s) on particulates at high coating speed with high current density
11/15/2000EP1051534A1 Process for metal plating liquid crystalline polymers and compositions related thereto
11/14/2000US6146516 Method and device for the repair and/or touch-up of small surface flaws in a press plate or an endless band for surface-embossing of plastic-coated wooden or laminated panels
11/09/2000WO2000066812A1 Alloy coating of cast iron
11/09/2000WO2000011245A3 Device for partial electrochemical treatment of bar-shaped objects
11/09/2000WO2000006806A3 Device for the electrodeposition and removal of metal
11/08/2000EP1050902A2 Method for forming a copper layer over a semiconductor wafer
11/08/2000CN1272956A Apparatus and methods for controlling workpiece surface exposure to processing liquids during fabrication of microelectronic components
11/08/2000CN1272685A Method for forming copper layer on semiconductor chip
11/07/2000US6143430 Suitable as a material for a container for holding and retaining an automobile fuel such as gasoline, alcohol, gasoline containing alcohol, or the like, i.e., a fuel tank, and fuel tank peripheral components
11/07/2000US6143424 Decorative and protective multilayer metal coatings
11/07/2000US6143157 Covering core with a barrier coating to protect a magnetic property of core from alteration by subsequent plating, then plating a conductive shield to the core by depositing a seed layer in pattern defined by mask, plating on seed layer
11/07/2000US6143156 Electrode wrap to cover substrate mounted to a frame with abrasive pad adjacent electrode; substrate in motion with wrap, where frame is adjustably proximate the substrate to control abrasive force as thickness of coating increases
11/07/2000US6143155 By providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto
11/07/2000US6143145 Apparatus for continuous masking for selective electroplating and method
11/02/2000EP1048757A1 Plating method and apparatus
11/02/2000EP1048753A1 Multilayer material for sliding elements and process for the production thereof
11/02/2000EP1048748A2 Moulded polymer part which can be partially galvanised