Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
09/2001
09/13/2001US20010020545 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
09/13/2001DE10010910A1 Electroconductive film used as anti-static packaging material and moisture sensor comprises a blend of starch and synthetic polymers dosed with metal
09/12/2001EP1133220A2 Copper foil with low profile bond enhancement
09/12/2001EP1132500A2 Method for electrochemical deposition of metal using modulated waveforms
09/12/2001EP1051543B1 Method for electroplating metal coating(s) on particulates at high coating speed with high current density
09/12/2001EP0904427B1 Galvanized aluminium sheet
09/12/2001EP0725453B1 Surface-treated steel sheet for battery case and battery case
09/11/2001US6287446 Electrodeposition in bath
09/11/2001US6287434 Plating cell apparatus for x-ray mask fabrication
09/11/2001CA2232279C Zinciferous coated steel sheet and method for producing the same
09/06/2001US20010019888 Metal deposit process
09/05/2001EP1129237A2 Method and apparatus for electrochemical mechanical deposition
09/05/2001EP1128969A1 Metal-coated plastic part and method for making same
09/05/2001EP1128915A1 Fully automatic plating wax removing device and method thereof
09/04/2001US6284123 Electroplating iron layer onto activated aluminum or aluminum alloy surface of cathode in solution from iron containing anode without use of undercoating layer
09/04/2001US6284120 Method of electroplating and electrodeposit structure
09/04/2001US6284108 Method and apparatus for momentum plating
08/2001
08/30/2001WO2001063018A1 Pad designs and structures for a versatile materials processing apparatus
08/30/2001WO2001063016A1 Composite copper foil and manufacturing method thereof
08/30/2001US20010018299 Electrical connector and method of preparing same for soldering
08/30/2001US20010017258 Wafer plating apparatus
08/30/2001US20010017105 Wafer plating apparatus
08/29/2001CN2444962Y Positioner for integral circuit lead frame plating selection production line
08/28/2001US6280852 Process for producing laminated steel sheet, laminated steel sheet, and surface-treated steel sheet used therefor
08/28/2001US6280596 Electrolytic tinplating of steel substrate and apparatus
08/28/2001US6280583 Reactor assembly and method of assembly
08/28/2001US6280582 Reactor vessel having improved cup, anode and conductor assembly
08/28/2001CA2236150C Coated article
08/23/2001WO2001061079A1 Process for electroplating a work piece coated with an electrically conducting polymer
08/23/2001WO2001061078A1 Glass reinforcement structure
08/23/2001US20010016267 Composite multilayer material for plain bearings
08/23/2001US20010015652 Probe card assembly and kit, and methods of making same
08/23/2001US20010015321 Contacting the surface with an electroplating solution comprising metal ions, a suppressor, an accelerator and a leveler additives, in succession applying direct cathodic current density optimized to form conformal thin film
08/23/2001DE10007435A1 Verfahren zum Galvanisieren eines mit einem elektrisch leitenden Polymer beschichteten Werkstücks A method for electroplating a substrate coated with an electrically conductive polymer workpiece
08/23/2001CA2369687A1 Process for electroplating a work piece coated with an electrically conducting polymer
08/22/2001EP1126049A2 Composition for desmutting aluminum
08/22/2001EP1125007A1 Submicron metallization using electrochemical deposition
08/22/2001CN1309881A Method for metal coating of substrates
08/22/2001CN1069864C Method of making stainless steel printing pattern
08/21/2001US6277263 Alkaline electrolytic copper bath is used to electroplate copper onto a barrier layer or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer
08/21/2001US6277261 Method of producing electrolyte units by electrolytic deposition of a catalyst
08/21/2001CA2236151C Article having a coating
08/21/2001CA2236145C Article having a coating thereon
08/16/2001WO2001059185A2 Pre-plate treating system
08/16/2001WO2001016402A8 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
08/16/2001US20010014410 Acid resistance; waterproof
08/16/2001US20010014409 Article, method, and apparatus for electrochemical fabrication
08/16/2001US20010014408 Surface -treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
08/16/2001US20010014407 Acid resistance
08/16/2001US20010014406 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
08/16/2001US20010013473 Pre-plate treating system
08/16/2001US20010013472 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization
08/16/2001EP1123988A1 Method of forming chromium coated copper for printed circuit boards
08/16/2001DE10006823A1 Flexible metallic substrate for CIS solar cells produced without vacuum technology, comprises copper foil strip with electroplated layered structure containing specified metals and alloys
08/16/2001DE10005680A1 Flexible metallic substrate for CIS solar cells produced without vacuum technology, comprises copper foil strip with electroplated layered structure containing specified metals and alloys
08/16/2001CA2337374A1 Composition for desmutting aluminum
08/15/2001CN1308010A Garbage coating stripper for local electroplating equipment
08/14/2001US6274254 Electrodeposited precious metal finishes having wear resistant particles therein
08/14/2001US6274022 Method for producing electro- or electroless-deposited film with a controlled crystal orientation
08/09/2001WO2001057932A1 Flexible metal substrate for cis solar cells, and method for producing the same
08/09/2001WO2000071921A3 Burrless castellation via process and product for plastic chip carrier
08/09/2001DE10005089A1 Vorrichtung zur elektrolytischen Herstellung einer Schicht auf einem einen geschlossenen Umfang und eine flexible oder feste Wandung mit mehreren Öffnungen aufweisenden Körper Apparatus for the electrolytic production of a layer on a a closed circumference and a flexible or rigid wall with a plurality of foraminous body
08/08/2001EP1122989A2 Method of plating for filling via holes
08/08/2001EP1122339A2 Megasonic plating using a submerged transducers-array
08/08/2001EP0944749B1 Process for the electrolytic deposition of copper layers
08/08/2001CN2441817Y Supersonic plating device
08/08/2001CN1307793A Assembly of an electronic component with spring packaging
08/08/2001CN1307652A Galvanic bath, method for producing structured hard chromium layers and use thereof
08/08/2001CN1307651A Method for producing nickel foam and nickel foam thus obtainable
08/07/2001US6270922 Surface-treated steel plate for battery case, battery case and battery using the case
08/07/2001US6270647 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
08/07/2001US6270646 Compressible porous member having a conductive surface covering substrate to be plated; conductive surface may be polyaniline material
08/07/2001US6270645 Simplified process for production of roughened copper foil
08/02/2001WO2001056345A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056344A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056343A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056342A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001004944B1 Method and apparatus for simultaneously cleaning and annealing a workpiece
08/02/2001US20010010241 Diffusion of nickel in a surface of a hot worked material containing non-metallic inclusions
07/2001
07/31/2001US6268025 Multilayer
07/26/2001WO2001053569A1 Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating
07/26/2001US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging
07/25/2001EP1118413A1 Structure and method for joining metal members
07/24/2001US6265087 Zinc plating; automobiles; chemical conversion coating to phosphophyllite
07/24/2001US6265020 Applying solution to printed circuit; inversion
07/19/2001WO2001052307A2 Semiconductor workpiece proximity plating methods and apparatus
07/18/2001EP1117283A1 Printed wiring board and its manufacturing method
07/18/2001EP1115914A1 Zinc coated steel plates coated with a pre-lubricating hydroxysulphate layer and methods for obtaining same
07/18/2001EP1115913A2 Method and device for producing wear resisting surfaces
07/18/2001EP1115912A2 Device for partial electrochemical treatment of bar-shaped objects
07/18/2001EP0810918B1 Process and device for retouching and/or repairing small superficial damages of a press plate or an endless band used for the impression of a structure into the surface portion of plastic-coated wooden or laminated boards
07/18/2001CN1304183A Method and equipment for forming zinc oxide film, and method and apparatus manufacturing photovoltaic device
07/17/2001US6261697 Oxidation surface treatment; plating
07/17/2001US6261435 Plating pretreatment method comprising vibrationally stirring treatment bath, aerating treatment bath, swinging plating target, and applying vibration to plating target simultaneously in single tank at a time
07/17/2001US6261426 Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
07/17/2001US6261425 Electroplating machine
07/12/2001WO2001050821A2 Conditioning of through holes and glass
07/12/2001WO2001050505A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
07/12/2001WO2001004944A3 Method and apparatus for simultaneously cleaning and annealing a workpiece
07/11/2001EP1114209A1 Hard-chrome plated layer