Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
01/2002
01/10/2002US20020003084 Cathode current control system for a wafer electroplating apparatus
01/10/2002DE10129648A1 Production of a solderable layer and a contact layer on metal elements used in the production of leadframes and relay contacts comprises using an electrochemical coating process
01/09/2002EP1170401A2 Process for the manufacture of one side platinised panels and expanded mesh sheets made of refractory metals
01/09/2002EP1169162A1 Method and apparatus for plating and polishing a semiconductor substrate
01/09/2002CN1330734A Double-dip Pd/Sn crossliker
01/09/2002CN1329969A Method for preparing one-sided platinum plated refractory metal plate and extended metal grid
01/08/2002US6337145 Electroplating on overlay of lead-tin-copper from a ternary fluoroborate-free electroplating bath without brighteners and with non-ionic wetting agent and free alkyl sulfonic acid; heat treating galvanic overlay
01/08/2002US6336979 Wear resistant copper base alloy, method of preparing the same and electrical part using the same
01/08/2002US6336269 Method of fabricating an interconnection element
01/03/2002WO2000061837A9 Workpiece processor having processing chamber with improved processing fluid flow
01/03/2002US20020001712 Electronic component, method for producing electronic component, and circuit board
01/03/2002US20020000383 Placing the substrate surface within an enclosure, introducing liquid material into enclosure, and directing the liquid angularly toward substrate surface flowing rotationally upon contact; semiconductors
01/03/2002US20020000382 Contacting metal seed layer on substrate with acidic electrolyte bath containing acids, copper compounds, suppressors and water, then subjecting to current
01/03/2002US20020000381 Process for galvanic depositing of a dispersion layer on a work piece surface
01/03/2002US20020000379 Electroplating apparatus and electroplating method
01/03/2002US20020000372 Dry contact assemblies, methods for making dry contact assemblies, and plating machines with dry contact assemblies for plating microelectronic workpieces
01/03/2002US20020000271 Filling recessed microstructures on semiconductor surface with copper metallization; particle sizes; annealing; electroplating; robotics
01/03/2002DE10029837A1 Verfahren zur Herstellung von einseitig platinierten Platten und Streckmetallgittern aus Refraktärmetallen Process for the preparation of platinum-plated plates on one side and expanded metal grids made from refractory metals
01/02/2002EP1167584A1 Decorative chrome electroplate on plastics
01/02/2002EP1167583A2 Copper-plating liquid, plating method and plating apparatus
01/02/2002EP1042092A4 Component of printed circuit boards
01/02/2002EP0978224B1 Device for electrolytic treatment of plate-shaped articles and method for electronic shielding of edge areas of articles during electrolytic treatment
01/02/2002CN1329681A Method and apparatus for electrochemical mechanical deposition
01/02/2002CN1077040C Squeegee for screen printing and its production method
01/01/2002US6335107 Useful as an electrical connector
12/2001
12/27/2001US20010055729 Metallic pattern on support
12/27/2001US20010054905 Probe card assembly and kit
12/27/2001US20010054557 Electroplating of metals using pulsed reverse current for control of hydrogen evolution
12/27/2001US20010054556 Metal plating apparatus and process
12/26/2001CN1328434A Method for producing prosthetic moulded parts for dental use and prosthetic moulded part
12/25/2001US6333560 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies
12/25/2001US6333120 Plating copper underlayer which comprises layer of electroplated copper onto substrate; subjecting copper coated substrate to oxygen-containing gaseous ambient to roughen surface of copper; electroplating second layer of copper
12/25/2001US6332967 Multilayer electrodeposition baths
12/25/2001US6332963 Cup-type plating apparatus and method for plating wafer using the same
12/20/2001US20010053647 Porous structures having a pre-metallization conductive polymer coating and method of manufacture
12/20/2001US20010053562 Process for producing a substrate and plating apparatus
12/20/2001US20010052465 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles
12/20/2001DE10051140A1 Method of forming cylindrical elevations on surface of substrate for integrated circuits, involves filling openings formed in screening material with pure copper or with high-melting point metal by galvanizing
12/19/2001EP1164208A2 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse
12/19/2001CN1327489A Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
12/18/2001US6331239 Applying a catalyst for electroless plating using a colloidal solution containing a tin compound and a palladium compound, copper, reducing agent consisting of a saccharide, a complexing agent and an alkali metal hydroxide
12/18/2001US6331237 Method of improving contact reliability for electroplating
12/18/2001CA1341327C Methods for depositing finish coatings on substrates of anodisable metals and the products thereof
12/13/2001US20010051282 Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
12/13/2001US20010050233 Method for enhancing the uniformity of electrodeposition or electroetching
12/13/2001US20010050179 Single bath electrodeposition
12/13/2001US20010050100 Semiconductors
12/13/2001DE10125323A1 Electronic component, such as ceramic capacitor, has outer electrode layer containing polycrystalline tin and tin crystal grains with boundaries and atoms of another metal than tin at tin crystal grain boundaries
12/12/2001EP1162289A1 Palladium electroplating bath and process for electroplating
12/12/2001CN1326593A Battery sheath made of formed cold-rolled sheet and method for producing battery sheaths
12/12/2001CN1326017A Antirusting technology for liquid reservoir made of carbon steel in air conditioner or refrigerator
12/12/2001CN1326016A Local electroplating system
12/12/2001CN1326015A Tin electrolyte
12/11/2001US6329071 Chrome plated parts and chrome plating method
12/11/2001US6328872 Method and apparatus for plating and polishing a semiconductor substrate
12/11/2001US6328871 Depositing a barrier layer comprising tantalum over the surface; annealing the barrier layer to form high conductance barrier layer; depositing a seed layer over the barrier layer
12/06/2001WO2001092596A2 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part
12/06/2001WO2001052307A3 Semiconductor workpiece proximity plating methods and apparatus
12/06/2001WO2001029878A3 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
12/06/2001US20010047943 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels
12/06/2001DE10103445A1 Stahlwerkstoff mit hoher Ermüdungsfestigkeit sowie Verfahren zur Herstellung des Stahlmaterials Steel material having high fatigue resistance as well as methods for producing the steel material
12/05/2001EP1160846A2 Method of application of electrical biasing to enhance metal deposition
12/05/2001EP1036221B1 Electroplating formulation and process for plating iron directly onto aluminum or aluminum alloys
12/05/2001CN1324699A Rubber surface treating process
12/04/2001US6325910 Palladium colloid solution and its utilization
11/2001
11/29/2001WO2001091163A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
11/29/2001WO2001090446A2 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
11/29/2001WO2001090434A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
11/29/2001WO2001034881A3 Device for electrolytically treating board-shaped workpieces, especially printed circuits
11/29/2001US20010045361 Seeding; solvent selective removal
11/29/2001US20010045360 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse
11/28/2001EP1157149A1 DOUBLE-DIP Pd/Sn CROSSLINKER
11/28/2001EP1157148A2 Methods for coating metallic articles
11/28/2001EP0785584B1 Precoated steel sheet for positive electrode can of alkaline dry cell
11/28/2001CN1324412A Method for metallizing surface of a solid polymer substrate and the product obtd.
11/28/2001CN1323921A Metal and plastic composite, and its mfg. method
11/27/2001US6322730 Method of repairing damaged metal surfaces
11/27/2001US6322689 Anodizing method and apparatus for performing the same
11/27/2001US6322686 Tin electrolyte
11/27/2001US6322684 Apparatus and method for electroplating or electroetching a substrate
11/27/2001US6322674 Cathode current control system for a wafer electroplating apparatus
11/25/2001CA2349156A1 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse
11/22/2001WO2001088226A2 Method of manufacturing an aluminium product
11/22/2001WO2001059185A8 Pre-plate treating system
11/22/2001US20010042690 Method and apparatus for electroplating and electropolishing
11/22/2001US20010042689 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
11/22/2001DE10120847A1 Verfahren zum galvanischen Abscheiden einer Dispersionsschicht auf einer Oberfläche eines Werkstückes A method for the galvanic deposition of a dispersion layer on a surface of a workpiece
11/21/2001EP1155168A1 Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
11/21/2001CN1322863A Electroplating apparatus
11/21/2001CN1074974C Apparatus for cutting masking tape
11/20/2001US6319387 Copper alloy electroplating bath for microelectronic applications
11/20/2001US6319386 Submerged array megasonic plating
11/20/2001US6319385 Process for electrochemically applying a surface coating
11/20/2001US6319384 Immersion substrate and counterelectrode in electroplating bath; electrolysis with modulated reversing electric current of cathodic pulses; free of brighteners; filling, leveling
11/20/2001US6319383 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
11/20/2001US6319190 Medicinal radioactive ruthenium radiation sources with high dosage rate and method for producing the same
11/15/2001WO2001086028A1 Platable engineered polyolefin alloys
11/15/2001US20010040180 Brazing sheet product and method of manufacturing an assembly using the brazing sheet product
11/15/2001US20010040100 Plating apparatus and method
11/14/2001EP1153430A1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits