Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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01/10/2002 | US20020003084 Cathode current control system for a wafer electroplating apparatus |
01/10/2002 | DE10129648A1 Production of a solderable layer and a contact layer on metal elements used in the production of leadframes and relay contacts comprises using an electrochemical coating process |
01/09/2002 | EP1170401A2 Process for the manufacture of one side platinised panels and expanded mesh sheets made of refractory metals |
01/09/2002 | EP1169162A1 Method and apparatus for plating and polishing a semiconductor substrate |
01/09/2002 | CN1330734A Double-dip Pd/Sn crossliker |
01/09/2002 | CN1329969A Method for preparing one-sided platinum plated refractory metal plate and extended metal grid |
01/08/2002 | US6337145 Electroplating on overlay of lead-tin-copper from a ternary fluoroborate-free electroplating bath without brighteners and with non-ionic wetting agent and free alkyl sulfonic acid; heat treating galvanic overlay |
01/08/2002 | US6336979 Wear resistant copper base alloy, method of preparing the same and electrical part using the same |
01/08/2002 | US6336269 Method of fabricating an interconnection element |
01/03/2002 | WO2000061837A9 Workpiece processor having processing chamber with improved processing fluid flow |
01/03/2002 | US20020001712 Electronic component, method for producing electronic component, and circuit board |
01/03/2002 | US20020000383 Placing the substrate surface within an enclosure, introducing liquid material into enclosure, and directing the liquid angularly toward substrate surface flowing rotationally upon contact; semiconductors |
01/03/2002 | US20020000382 Contacting metal seed layer on substrate with acidic electrolyte bath containing acids, copper compounds, suppressors and water, then subjecting to current |
01/03/2002 | US20020000381 Process for galvanic depositing of a dispersion layer on a work piece surface |
01/03/2002 | US20020000379 Electroplating apparatus and electroplating method |
01/03/2002 | US20020000372 Dry contact assemblies, methods for making dry contact assemblies, and plating machines with dry contact assemblies for plating microelectronic workpieces |
01/03/2002 | US20020000271 Filling recessed microstructures on semiconductor surface with copper metallization; particle sizes; annealing; electroplating; robotics |
01/03/2002 | DE10029837A1 Verfahren zur Herstellung von einseitig platinierten Platten und Streckmetallgittern aus Refraktärmetallen Process for the preparation of platinum-plated plates on one side and expanded metal grids made from refractory metals |
01/02/2002 | EP1167584A1 Decorative chrome electroplate on plastics |
01/02/2002 | EP1167583A2 Copper-plating liquid, plating method and plating apparatus |
01/02/2002 | EP1042092A4 Component of printed circuit boards |
01/02/2002 | EP0978224B1 Device for electrolytic treatment of plate-shaped articles and method for electronic shielding of edge areas of articles during electrolytic treatment |
01/02/2002 | CN1329681A Method and apparatus for electrochemical mechanical deposition |
01/02/2002 | CN1077040C Squeegee for screen printing and its production method |
01/01/2002 | US6335107 Useful as an electrical connector |
12/27/2001 | US20010055729 Metallic pattern on support |
12/27/2001 | US20010054905 Probe card assembly and kit |
12/27/2001 | US20010054557 Electroplating of metals using pulsed reverse current for control of hydrogen evolution |
12/27/2001 | US20010054556 Metal plating apparatus and process |
12/26/2001 | CN1328434A Method for producing prosthetic moulded parts for dental use and prosthetic moulded part |
12/25/2001 | US6333560 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
12/25/2001 | US6333120 Plating copper underlayer which comprises layer of electroplated copper onto substrate; subjecting copper coated substrate to oxygen-containing gaseous ambient to roughen surface of copper; electroplating second layer of copper |
12/25/2001 | US6332967 Multilayer electrodeposition baths |
12/25/2001 | US6332963 Cup-type plating apparatus and method for plating wafer using the same |
12/20/2001 | US20010053647 Porous structures having a pre-metallization conductive polymer coating and method of manufacture |
12/20/2001 | US20010053562 Process for producing a substrate and plating apparatus |
12/20/2001 | US20010052465 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles |
12/20/2001 | DE10051140A1 Method of forming cylindrical elevations on surface of substrate for integrated circuits, involves filling openings formed in screening material with pure copper or with high-melting point metal by galvanizing |
12/19/2001 | EP1164208A2 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
12/19/2001 | CN1327489A Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
12/18/2001 | US6331239 Applying a catalyst for electroless plating using a colloidal solution containing a tin compound and a palladium compound, copper, reducing agent consisting of a saccharide, a complexing agent and an alkali metal hydroxide |
12/18/2001 | US6331237 Method of improving contact reliability for electroplating |
12/18/2001 | CA1341327C Methods for depositing finish coatings on substrates of anodisable metals and the products thereof |
12/13/2001 | US20010051282 Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same |
12/13/2001 | US20010050233 Method for enhancing the uniformity of electrodeposition or electroetching |
12/13/2001 | US20010050179 Single bath electrodeposition |
12/13/2001 | US20010050100 Semiconductors |
12/13/2001 | DE10125323A1 Electronic component, such as ceramic capacitor, has outer electrode layer containing polycrystalline tin and tin crystal grains with boundaries and atoms of another metal than tin at tin crystal grain boundaries |
12/12/2001 | EP1162289A1 Palladium electroplating bath and process for electroplating |
12/12/2001 | CN1326593A Battery sheath made of formed cold-rolled sheet and method for producing battery sheaths |
12/12/2001 | CN1326017A Antirusting technology for liquid reservoir made of carbon steel in air conditioner or refrigerator |
12/12/2001 | CN1326016A Local electroplating system |
12/12/2001 | CN1326015A Tin electrolyte |
12/11/2001 | US6329071 Chrome plated parts and chrome plating method |
12/11/2001 | US6328872 Method and apparatus for plating and polishing a semiconductor substrate |
12/11/2001 | US6328871 Depositing a barrier layer comprising tantalum over the surface; annealing the barrier layer to form high conductance barrier layer; depositing a seed layer over the barrier layer |
12/06/2001 | WO2001092596A2 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part |
12/06/2001 | WO2001052307A3 Semiconductor workpiece proximity plating methods and apparatus |
12/06/2001 | WO2001029878A3 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
12/06/2001 | US20010047943 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels |
12/06/2001 | DE10103445A1 Stahlwerkstoff mit hoher Ermüdungsfestigkeit sowie Verfahren zur Herstellung des Stahlmaterials Steel material having high fatigue resistance as well as methods for producing the steel material |
12/05/2001 | EP1160846A2 Method of application of electrical biasing to enhance metal deposition |
12/05/2001 | EP1036221B1 Electroplating formulation and process for plating iron directly onto aluminum or aluminum alloys |
12/05/2001 | CN1324699A Rubber surface treating process |
12/04/2001 | US6325910 Palladium colloid solution and its utilization |
11/29/2001 | WO2001091163A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
11/29/2001 | WO2001090446A2 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
11/29/2001 | WO2001090434A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
11/29/2001 | WO2001034881A3 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
11/29/2001 | US20010045361 Seeding; solvent selective removal |
11/29/2001 | US20010045360 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
11/28/2001 | EP1157149A1 DOUBLE-DIP Pd/Sn CROSSLINKER |
11/28/2001 | EP1157148A2 Methods for coating metallic articles |
11/28/2001 | EP0785584B1 Precoated steel sheet for positive electrode can of alkaline dry cell |
11/28/2001 | CN1324412A Method for metallizing surface of a solid polymer substrate and the product obtd. |
11/28/2001 | CN1323921A Metal and plastic composite, and its mfg. method |
11/27/2001 | US6322730 Method of repairing damaged metal surfaces |
11/27/2001 | US6322689 Anodizing method and apparatus for performing the same |
11/27/2001 | US6322686 Tin electrolyte |
11/27/2001 | US6322684 Apparatus and method for electroplating or electroetching a substrate |
11/27/2001 | US6322674 Cathode current control system for a wafer electroplating apparatus |
11/25/2001 | CA2349156A1 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
11/22/2001 | WO2001088226A2 Method of manufacturing an aluminium product |
11/22/2001 | WO2001059185A8 Pre-plate treating system |
11/22/2001 | US20010042690 Method and apparatus for electroplating and electropolishing |
11/22/2001 | US20010042689 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
11/22/2001 | DE10120847A1 Verfahren zum galvanischen Abscheiden einer Dispersionsschicht auf einer Oberfläche eines Werkstückes A method for the galvanic deposition of a dispersion layer on a surface of a workpiece |
11/21/2001 | EP1155168A1 Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
11/21/2001 | CN1322863A Electroplating apparatus |
11/21/2001 | CN1074974C Apparatus for cutting masking tape |
11/20/2001 | US6319387 Copper alloy electroplating bath for microelectronic applications |
11/20/2001 | US6319386 Submerged array megasonic plating |
11/20/2001 | US6319385 Process for electrochemically applying a surface coating |
11/20/2001 | US6319384 Immersion substrate and counterelectrode in electroplating bath; electrolysis with modulated reversing electric current of cathodic pulses; free of brighteners; filling, leveling |
11/20/2001 | US6319383 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
11/20/2001 | US6319190 Medicinal radioactive ruthenium radiation sources with high dosage rate and method for producing the same |
11/15/2001 | WO2001086028A1 Platable engineered polyolefin alloys |
11/15/2001 | US20010040180 Brazing sheet product and method of manufacturing an assembly using the brazing sheet product |
11/15/2001 | US20010040100 Plating apparatus and method |
11/14/2001 | EP1153430A1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |