| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 10/10/2002 | WO2002079548A1 Electrolytic plating tank |
| 10/10/2002 | WO2002078903A2 Method and apparatus for avoiding particle accumulation during an electrochemical process |
| 10/10/2002 | WO2002058113A3 Electrochemical methods for polishing copper films on semiconductor substrates |
| 10/10/2002 | US20020147519 Experimental management apparatus and experimental management program for electroplating |
| 10/10/2002 | US20020145826 Method for the preparation of nanometer scale particle arrays and the particle arrays prepared thereby |
| 10/10/2002 | US20020144908 Back-end metallisation process |
| 10/10/2002 | US20020144894 Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
| 10/09/2002 | EP1247881A1 Experimental management apparatus and experimental management program for electroplating |
| 10/08/2002 | US6461677 Method of fabricating an electrical component |
| 10/08/2002 | US6461494 Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot |
| 10/03/2002 | WO2002078122A1 Electrically conductive patterns, antennas and methods of manufacture |
| 10/03/2002 | WO2002077327A2 Mask plate design |
| 10/03/2002 | WO2001092596A3 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part |
| 10/03/2002 | WO2001083854A3 Electroplating bath composition and method of using |
| 10/03/2002 | US20020139686 Conditioning with a cationic conditioning agent and an anionic dispersing agent and a binder, coating with a conductive carbon, electroplating and soldering |
| 10/03/2002 | US20020139685 Continuous nickel plating process for an aluminum conductor and corresponding device |
| 10/03/2002 | US20020139684 Pump for supplying plating fluid from the reservoir tank to the closed plating cup cyclically changes the pressure or flow rate of the plating fluid to prevent air bubbles in the blind holes of the plating member |
| 10/03/2002 | US20020139682 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits |
| 10/03/2002 | US20020139681 Automated brush plating process for solid oxide fuel cells |
| 10/03/2002 | US20020139680 Abrasive particles are adhered to a bonding material so as to have a predetermined distribution over the coated substrate; electroplating a metal layer to the bonding material to fix the predetermined spacing and concentration of particles |
| 10/03/2002 | US20020139679 Selective electroplating by etching in acidic solutions containing oxidising agents, then treated in trivalent bismuth compound solution and a sulfide solution; decorative or protective function; electronic packaging |
| 10/03/2002 | US20020139678 Automatic process control, more particularly, controlling a material deposition process; electroplating; constructing a Jacobian sensitivity matrix of the effects on plated material thickness at each of a plurality of workpiece position |
| 10/03/2002 | US20020139663 Chemical treatment system |
| 10/03/2002 | CA2441965A1 Electrically conductive patterns, antennas and methods of manufacture |
| 10/02/2002 | EP1245038A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 10/02/2002 | EP0988656B1 Production of electrolyte units by electrolytic deposition of a catalyst |
| 10/02/2002 | EP0925388B1 Electroplating of nickel-phosphorus alloys coatings |
| 10/01/2002 | US6458263 Cantilevered multilevel LIGA devices and methods |
| 10/01/2002 | US6458218 Deposition and thermal diffusion of borides and carbides of refractory metals |
| 10/01/2002 | CA2236167C Article having a decorative and protective multi-layer coating |
| 10/01/2002 | CA2236138C Coated article |
| 09/26/2002 | WO2002075797A2 Method of forming copper interconnects |
| 09/26/2002 | WO2002075020A1 Plating method of metal film on the surface of polymer |
| 09/26/2002 | WO2002049077A3 Barrier layer for electrical connectors and methods of applying the layer |
| 09/26/2002 | US20020135972 Electronic parts, and process for manufacturing electronic parts |
| 09/26/2002 | US20020135519 Electrically conductive patterns, antennas and methods of manufacture |
| 09/26/2002 | CA2426648A1 Plating method of metal film on the surface of polymer |
| 09/25/2002 | EP1243668A1 Tin-plated steel sheet |
| 09/24/2002 | US6454926 Uniform copper layer |
| 09/24/2002 | US6454917 High throughput and high performance copper electroplating tool |
| 09/24/2002 | US6454916 Selective electroplating with direct contact chemical polishing |
| 09/23/2002 | CA2359608A1 Electroplating methods for fabricating microelectronic interconnects and microelectronic structures fabricated thereby |
| 09/19/2002 | WO2002072923A2 Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
| 09/19/2002 | WO2002072915A1 Conditioning agent and use thereof |
| 09/19/2002 | WO2002038326A3 Brazing product having a low melting point |
| 09/19/2002 | US20020132137 Soft magnetic film having high saturation magnetic flux density, thin-film magnetic head using the same, and manufacturing method of the same |
| 09/19/2002 | US20020130046 Positioning substrate in an electroplating bath; forming doped copper layer on substrate; wherein the doped copper layer comprises an amount of non-metal that is controlled for increasing electromigration resistance in doped copper layer |
| 09/19/2002 | US20020130034 Pad designs and structures for a versatile materials processing apparatus |
| 09/19/2002 | US20020130033 Coating a surface of liquid crystalline polymer with palladium by sputtering or ionization plating |
| 09/19/2002 | US20020129879 Device produced by a process of controlling grain growth in metal films |
| 09/19/2002 | DE10153544A1 Vorrichtung zur Steuerung des Durchflusses in einem Galvanisierungsprozeß Apparatus for controlling the flow in a galvanizing |
| 09/18/2002 | EP1240365A1 Method for producing an electrolytically coated cold rolled strip, preferably for use in the production of battery sheaths, and battery sheath produced according to said method |
| 09/18/2002 | CN1370245A Copper electroplating bath, pre-treating liquid before copper electroplating and copdper electroplating method |
| 09/18/2002 | CN1369954A Electroplating current supply system |
| 09/18/2002 | CN1369321A Metal golf club prodn. method and its products |
| 09/17/2002 | US6451452 Lead-free; copper alloy |
| 09/17/2002 | US6451448 Surface treated metallic materials and manufacturing method thereof |
| 09/17/2002 | US6451195 Imersing silicon wafers in electrolytic cells, applying direct current voltages, then stirring the solutions using a magnetic field; protective coatings having uniform thickness |
| 09/17/2002 | US6450821 Electrical connectors adapted to reduce or prevent adherence of conductive material to contact portions as the connector |
| 09/17/2002 | US6450175 Nail care instrument |
| 09/12/2002 | WO2002070789A2 Electrical potential-assisted assembly of molecular devices |
| 09/12/2002 | WO2002070780A1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 09/12/2002 | WO2002070144A1 Internal heat spreader plating methods and devices |
| 09/12/2002 | WO2001077419A3 Process for the direct metal-plating of a plastic substrate |
| 09/12/2002 | US20020127847 Electrochemical co-deposition of metals for electronic device manufacture |
| 09/12/2002 | US20020125983 Structure for composite materials of positive temperature coefficient thermistor devices and method of making the same |
| 09/12/2002 | US20020125141 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 09/12/2002 | CA2433031A1 Internal heat spreader plating methods and devices |
| 09/11/2002 | CN1368563A Composition for removing aluminium surface stain |
| 09/11/2002 | CN1368562A Heat-resistance protection film, its manufacture method and electric electronic element |
| 09/11/2002 | CN1090890C Method for forming electroplated layer on through-hole inwall of PC board with through-hole |
| 09/10/2002 | US6447954 High energy, light weight, lead-acid storage battery |
| 09/10/2002 | US6447929 Printed circuit boards; electrodepositing layer of chromium on copper foil, electrodepositing layer of copper on said chromium layer; nodular treatment to layers to enhance the bonding characteristics and peel strength |
| 09/10/2002 | US6447666 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 09/10/2002 | US6447664 Methods for coating metallic articles |
| 09/10/2002 | US6447663 Programmable nanometer-scale electrolytic metal deposition and depletion |
| 09/06/2002 | WO2002069679A2 Stacked panel processing apparatus and methods |
| 09/06/2002 | WO2002068729A1 A process for electrochemical deposition of tantalum and an article having a surface modification |
| 09/06/2002 | WO2002068728A1 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 09/06/2002 | WO2002068727A2 Copper-plating solution, plating method and plating apparatus |
| 09/06/2002 | WO2002068007A1 Implant and process of modifying an implant surface |
| 09/06/2002 | WO2002045476A9 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 09/06/2002 | CA2438207A1 Bath for the galvanic deposition of gold and gold alloys, and the use thereof |
| 09/05/2002 | US20020121445 Mask plate design |
| 09/05/2002 | DE10107675A1 Endoprothese Endoprosthesis |
| 09/04/2002 | EP1175518B1 Alloy coating of cast iron |
| 09/04/2002 | CN1090384C Surface-treated steel sheet for battery case and battery case |
| 09/04/2002 | CN1090383C Semiconductor device and method for fabricating same |
| 09/03/2002 | US6444110 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels |
| 08/29/2002 | WO2002066705A1 Environmentally friendly surface treated steel sheet for electronic parts excellent in soldering wettability and resistance to rusting and formation of whisker |
| 08/29/2002 | WO2002065953A1 Endoprothesis with galvanised silver layer |
| 08/29/2002 | US20020119251 Depositing catalytic particles on a selected area of the stamp including raised region, applying stamp on the substrate to indent selectd region caused by raised region, transferring catalyst particles, plating selected area |
| 08/29/2002 | US20020117330 Resilient contact structures formed and then attached to a substrate |
| 08/28/2002 | EP1234487A2 Method for the direct electroplating of through-holes in printed circuit boards |
| 08/28/2002 | EP1234063A2 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 08/28/2002 | EP0837750B1 Wire bonding, severing, and ball forming |
| 08/28/2002 | CN1366563A Process for electroplating work piece coated with electrically conducting polymer |
| 08/27/2002 | US6440331 Electrically conductive coating of printed wiring boards so they can be electroplated; graphite particles, tin oxide and antimony |
| 08/27/2002 | US6440291 Applying voltage to silicon wafers or counterelectrodes prior to immersion in electrolytes, maintaining currents during a delay to prevent dissolution of copper layers, then increasing cell potential for electrodeposition; integrated circuits |
| 08/27/2002 | US6440289 Electroless deposition, followed by electrodeposition to form coating layers having uniformity and thickness; integrated circuits |