| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 08/22/2002 | WO2002064862A2 Method for producing plated molded product |
| 08/22/2002 | US20020112963 Methods for fabricating high-precision thermally stable electromagnetic coils |
| 08/22/2002 | US20020112884 Circuit board and method of manufacturing the same |
| 08/21/2002 | EP1232828A1 Wire bonding, severing, and ball forming |
| 08/20/2002 | US6436266 Masking techniques for metal plating |
| 08/15/2002 | WO2002004713A3 A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 08/15/2002 | WO2001052307A9 Semiconductor workpiece proximity plating methods and apparatus |
| 08/15/2002 | US20020110645 Conductive polymer colloidal compositions with selectivity for non-conductive surfaces |
| 08/15/2002 | US20020108851 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 08/14/2002 | EP1231300A1 Plating method and device, and plating system |
| 08/14/2002 | EP1230443A1 Method for electrodeposition of metallic multilayers |
| 08/14/2002 | EP1230442A2 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 08/14/2002 | EP1230441A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 08/14/2002 | CN1364205A Method for producing improved cold rolled strip that is capable of being deep drawn or ironed, and cold rolled strip, preferably used for producing cylindrical containers and, in particular, battey |
| 08/14/2002 | CN1089120C Plating method |
| 08/13/2002 | US6432821 Method of copper electroplating |
| 08/13/2002 | US6432215 Waxes for separation and cleaning for turbines |
| 08/08/2002 | WO2002060639A1 Brazing product |
| 08/08/2002 | US20020104761 Coated substrate and process for production thereof |
| 08/08/2002 | US20020104755 Electroplating current supply system |
| 08/07/2002 | EP1229580A2 Electrochemical reduction of copper seed for reducing voids in electrochemical deposition |
| 08/07/2002 | EP1228528A1 Magnetic pole fabrication process and device |
| 08/07/2002 | EP1228267A1 An improved process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
| 08/07/2002 | EP1228266A1 Method for electrochemically metallising an insulating substrate |
| 08/07/2002 | EP1228265A1 Masking techniques for metal plating |
| 08/07/2002 | CN2504282Y Palte plating appts. |
| 08/07/2002 | CN1362538A Method for forming copper for chrome-plating of printed circuit board |
| 08/06/2002 | US6428674 Transporting fiber structure frame into suction station, inserting porous support between frame and suction port, suctioning galvanic electrolyte residues from frame, washing with liquid in wash station, removing wash liquid by suction |
| 08/06/2002 | US6428662 Reactor vessel having improved cup, anode and conductor assembly |
| 08/06/2002 | US6428661 Plating apparatus |
| 08/06/2002 | US6428660 Reactor vessel having improved cup, anode and conductor assembly |
| 08/01/2002 | WO2002059398A2 Plating apparatus and method |
| 08/01/2002 | WO2002059397A1 Method for the continuous deposition of a nickel-containing coating on a metallic film |
| 08/01/2002 | WO2001029878A9 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
| 08/01/2002 | US20020102837 Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
| 08/01/2002 | US20020100694 Electroplated aluminum parts and process of production |
| 08/01/2002 | US20020100693 Forming a copper seed layer over a semiconductor body, wherein copper oxide forms at a surface of copper seed layer electrochemically reducing copper oxide; electrochemically depositing copper layer on copper seed layer |
| 07/31/2002 | EP1225972A2 Pattern dependent surface profile evolution of electrochemically deposited metal |
| 07/31/2002 | EP1133588B1 Stratified composite material for sliding elements and method for the production thereof |
| 07/31/2002 | EP0997061B1 Method for metallization of a substrate containing electric non-conductive surface areas |
| 07/31/2002 | CN1361915A Aqueous carbon composition and method for coating a non conductive substrate |
| 07/25/2002 | WO2002058113A2 Electrochemical methods for polishing copper films on semiconductor substrates |
| 07/25/2002 | WO2002022913A3 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 07/25/2002 | US20020098374 Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
| 07/25/2002 | US20020097562 Electronic device and manufacturing same |
| 07/25/2002 | US20020096435 Causing a first impregnated member containing a plating solution in electrical contact with an anode to face the conductive layer on a substrate and moving it; preferentially forming a thin film in a depression, e.g. groove or hole |
| 07/25/2002 | US20020096433 Radiating with a pulse laser (pulse width < picosecond) to excite solely electrons on the substrate surface to generate a nonequilibrium state in either temperature or energy and deposit a thin film; metal plating; energy conservation |
| 07/25/2002 | DE10147659A1 Chrom-plattiertes Gleitelement und Verfahren zu seiner Herstellung Chromium-plated sliding element and process for its preparation |
| 07/24/2002 | EP1224341A1 Process for electrolytic coating of a substrate |
| 07/24/2002 | CN1088323C Method for forming protection layer on surface of cooper foil for mfg. printed circuit board |
| 07/23/2002 | US6424046 Substrate for manufacturing a semiconductor device with three element alloy |
| 07/23/2002 | US6423389 Electrodeposition of copper/or alloys, stainless steels and aluminum on metallic conduits to form protective devices for optical fibers |
| 07/23/2002 | US6423200 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
| 07/23/2002 | CA2092747C Hot-dip coated roofing material |
| 07/18/2002 | WO2002055764A1 Ni-plated steel plate for alkali-manganese dry cell anode can and alkali-manganese dry cell anode can |
| 07/18/2002 | WO2002055762A2 Electrochemical co-deposition of metals for electronic device manufacture |
| 07/18/2002 | WO2001088226A3 Method of manufacturing an aluminium product |
| 07/18/2002 | WO2001078154A3 Preparation of cigs-based solar cells using a buffered electrodeposition bath |
| 07/18/2002 | US20020092891 Method for manufacturing a multiple walled tube |
| 07/18/2002 | US20020092772 Barrier layer for electroplating processes |
| 07/18/2002 | US20020092764 Method of forming a conductive layer and an electroplating apparatus thereof |
| 07/18/2002 | US20020092585 A layer of the refractory metal deposited on the substrate, atleast one of the elements boron and carbon is deposited from other source, workpiece is heated to diffuse metal into substrate, deposited boron or carbon form a bond with metal |
| 07/18/2002 | DE10065643A1 Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut Apparatus and method for electrochemical treatment of strip-shaped and board-shaped |
| 07/17/2002 | EP1222321A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 07/17/2002 | CN1359110A Method for preparing composite conductive material |
| 07/16/2002 | US6420053 Articles having a colored metallic coating with special properties |
| 07/16/2002 | US6419811 Roughening to deposit copper protrusions by subjecting foil near or above limiting current density in electrolytic bath with titanium and tungsten ions to cathodic electrolysis, and rust-proofing (chromates or silane coupling agents) |
| 07/16/2002 | US6419728 Hydrogen-permeable metal membrane and method for producing the same |
| 07/15/2002 | CA2330982A1 Deposition and thermal diffusion of borides and carbides of refractory metals |
| 07/11/2002 | WO2002053809A1 Spouted bed apparatus for contacting objects with a fluid |
| 07/11/2002 | WO2002053807A1 Device and method for electrochemically treating a band-shaped product |
| 07/11/2002 | US20020090484 Plating bath |
| 07/11/2002 | US20020088845 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for elecronic parts having the film |
| 07/11/2002 | US20020088717 To produce brazed assembly such as heat-exchanger or electrochemical fuel cell or brazing sheet; for joining two structural elements |
| 07/11/2002 | US20020088713 Providing metal seed layer substantially free of discontinuities disposed on substrate by contacting metal seed layer disposed on a substrate with electroplating bath comprising one or more sources of copper in electrolyte |
| 07/10/2002 | CN1358410A Surface treated copper foil and mehtod for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358409A Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358408A Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358407A Surface treated copper foil and method for preparing the same and copper-cload laminate using the same |
| 07/10/2002 | CN1357949A Manufacture of electric connector |
| 07/09/2002 | US6416648 Excellent corrosion resistance; automobiles; controlling conditions of temperature, ph, electric current density of an electrolyte consisting of zinc sulfate hydrate, iron sulfate, ammonium sulfate and potassium chloride as well as the coating |
| 07/09/2002 | US6416647 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 07/09/2002 | CA2041121C High speed electroplating of tinplate |
| 07/04/2002 | WO2002052068A1 Zn-co-w alloy electroplated steel sheet with excellent corrosion resistance and welding property, and its electrolyte for it |
| 07/04/2002 | WO2002052055A1 Steel sheet for porcelain enameling and method for production thereof, and enameled product and method for production thereof |
| 07/04/2002 | WO2002015245A3 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 07/04/2002 | US20020084193 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound |
| 07/04/2002 | US20020084190 Method and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses |
| 07/04/2002 | US20020084189 Immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features, especially by mechanical vibration |
| 07/04/2002 | US20020084183 Apparatus and method for electrochemically processing a microelectronic workpiece |
| 07/03/2002 | EP1218937A2 Novel chip interconnect and packaging deposition methods and structures |
| 07/02/2002 | US6413652 Blend of propylene homopolymers or copolymers, acrylonitrile-butadiene-styrene polymers, and hydrogenated styrenic block copolymers plated with metal; enhanced rigidity, toughness, and dimensional stability; molded for use in automobiles |
| 07/02/2002 | US6413584 Electrodepositing platinum on a nickel superalloy, vapor depositing aluminum to form aluminide, and allowing interdiffusion; improved durability |
| 07/02/2002 | US6413405 Active carbon electro-deposited with Ag-I system having sterilizing effect |
| 07/02/2002 | US6413404 Method of forming bumps by electroplating |
| 07/02/2002 | US6413403 Controlling electrolyte flow and distribution of electric, magnetic or electromagnetic field; depositing, removing, polishing, and/or modifying conductive material; uniformity; chemical mechanical polishing |
| 07/02/2002 | US6413391 Masking techniques for metal plating |
| 07/02/2002 | US6413388 Pad designs and structures for a versatile materials processing apparatus |
| 06/27/2002 | WO2002050887A1 Electronic device and method of manufacturing the electronic device |
| 06/27/2002 | WO2002050342A2 Composite plating film and a process for forming the same |