| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 01/21/2003 | US6509107 Polyolefin blend comprising a propylene-containing polymer formed from a semi-crystalline homo or copolymer of propylene with ethylene or an alpha olefin, styrene- monoolefin and styrene-diolefin copolymeric compatibilizer; an ABS polymer |
| 01/21/2003 | US6508926 Method and device for partial electrochemical treatment of bar-shaped objects |
| 01/21/2003 | US6508925 Automated brush plating process for solid oxide fuel cells |
| 01/21/2003 | US6508920 Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device |
| 01/16/2003 | WO2003004732A1 Electrochemically textured surface having controlled peak characteristics and the method of manufacture |
| 01/16/2003 | WO2003004239A1 Method for producing and recycling operating material for enamelling purposes |
| 01/16/2003 | WO2003004174A1 Masking article for use in vehicle manufacturing |
| 01/16/2003 | US20030012975 Composite copper foil and manufacturing method thereof |
| 01/16/2003 | US20030012968 Piece having a portion of its visible surface galvanized, wherein the non-galvanized portion of its visible surface is covered in a film of non-galvanizable material that adheres strongly to the galvanized material |
| 01/16/2003 | US20030010646 Comprising enhanced brightener concentrations which accelerate the plating rate in recesses and microvias as carrier molecules become incorporated into the plating deposit; computer printed circuits; semiconductors |
| 01/16/2003 | US20030010642 Hydrodynamically inaccessible recesses of printed circuits are plated using a pulsed reversing current with cathodic pulses having a duty cycle <50%; plating hydrodynamically accessible recesses using a pulsed reversing current of <50% |
| 01/16/2003 | US20030010585 Braking member and method of manufacturing same |
| 01/16/2003 | US20030010406 Carburizing slide surfaces of iron or steel, plating with chromium, and impulsing by shot peening for lubricant retaining cavities; wear resistance |
| 01/16/2003 | CA2452333A1 Method for producing and recycling operating material for enamelling purposes |
| 01/16/2003 | CA2450498A1 Masking article for use in vehicle manufacturing |
| 01/15/2003 | EP1274885A1 Electrical contacting element made of an elastic material |
| 01/14/2003 | US6506293 Process for the application of a metal film on a polymer surface of a subject |
| 01/09/2003 | WO2003002786A1 Electroplating method and printed wiring board manufacturing method |
| 01/09/2003 | WO2002004713A2 A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 01/09/2003 | US20030006147 Method and apparatus for electro-chemical mechanical deposition |
| 01/09/2003 | US20030006135 Plating apparatus and plating method, and method of manufacturing semiconductor device |
| 01/09/2003 | US20030006133 Electroplating apparatus using a non-dissolvable anode and ultrasonic energy |
| 01/09/2003 | DE19937271C2 Verfahren zur Herstellung von tiefzieh- oder abstreckziehfähigem, veredeltem Kaltband, sowie Kaltband, vorzugsweise zur Herstellung von zylindrischen Behältern und insbesondere Batteriebehältern A process for the production of deep-drawing or abstreckziehfähigem, refined cold rolled strip, and cold-rolled strip, preferably for the production of cylindrical containers and in particular containers battery |
| 01/09/2003 | CA2415341A1 A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 01/08/2003 | EP1272692A1 Electro-plating apparatus and method |
| 01/08/2003 | CN1390268A Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 01/07/2003 | US6503642 Hard-chrome plated layer |
| 01/07/2003 | US6503348 Method of making a metal membrane foil made of a palladium alloy for hydrogen separation |
| 01/07/2003 | CA2190817C Zinciferous plated steel sheet and method for manufacturing same |
| 01/03/2003 | WO2003000937A2 Heat treatment method for a cold-rolled strip with an ni and/or co surface coating, sheet metal producible by said method and battery can producible by said method |
| 01/03/2003 | WO2003000395A1 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus |
| 01/02/2003 | US20030003320 Plating film onto an object at a first current density in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. |
| 01/02/2003 | US20030003319 Coated metal wire, wire-reinforced elastomeric article containing the same and method of manufacture |
| 01/02/2003 | US20030000843 Immersing a planar substrate in an electrolyte that contains the catalytically active metallic; applying an electrical voltage; depositing a layer of catalytically active metallic material by electrochemical deposition on the planar substrate |
| 01/02/2003 | US20030000830 Stacked panel processing apparatus and methods |
| 01/02/2003 | EP1271566A2 Thin-film resistor and method for manufacturing the same |
| 01/02/2003 | EP1270764A1 Surface treated tin-plated steel sheet and chemical treatment solution |
| 01/02/2003 | EP1268881A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 01/02/2003 | EP1268880A2 Process for the direct metal-plating of a plastic substrate |
| 01/01/2003 | CN1388841A Laser hole drilling copper foil |
| 01/01/2003 | CN1097644C Ornament |
| 01/01/2003 | CN1097643C Process for making copper foil |
| 12/31/2002 | US6500886 Plating solution an electrically conductive salt, an adsorbent, one of mono- to hexavalent metal ions and 0.01-30 g aliphatic amine or aliphatic amine polymer; corrosion resistant zinc alloy coating |
| 12/31/2002 | US6500585 Method for manufacturing a bipolar plate |
| 12/31/2002 | US6500325 Method of plating semiconductor wafer and plated semiconductor wafer |
| 12/31/2002 | US6500324 Process for depositing a layer of material on a substrate |
| 12/27/2002 | WO2002103165A1 Method for forming abrasion-resistant layer for moving blade, abrasion-resistant layer and method for regeneration thereof, and gas turbine |
| 12/27/2002 | WO2002103086A1 Connector wire, and manufacturing method thereof |
| 12/27/2002 | WO2002103085A1 Method and electrode for defining and replicating structures in conducting materials |
| 12/27/2002 | WO2002102894A1 Resin composition for plating substrate and resin moldings using the same, and metal plated parts |
| 12/27/2002 | CA2462098A1 Method and electrode for defining and replicating structures in conducting materials |
| 12/27/2002 | CA2450654A1 Method of forming abrasion-resistant layer on rotor blade, an abrasion-resistant layer and a method of regenerating the same, and a gas turbine |
| 12/26/2002 | US20020197854 Selective deposition of materials for the fabrication of interconnects and contacts on semiconductor devices |
| 12/26/2002 | US20020197811 Thin-film resistor and method for manufacturing the same |
| 12/26/2002 | US20020197505 Tin-plated steel sheet |
| 12/26/2002 | US20020197504 Laminated hard Cr plating layer comprising a plurality of hard Cr plating layers laminated on the sliding sliding surface; micro-cracks of each plating layer forming independent micro-pores in the film forming direction |
| 12/26/2002 | US20020197492 Electrolessly depositing a metal coating; depositing a photoresist coating; imaging and developing the photoresist coating; electroplating a metal on the exposed electrolessly deposited metal; and stripping the cured coating |
| 12/26/2002 | US20020195347 Process for depositing a layer of material on a substrate and a plating system |
| 12/25/2002 | CN1387239A Circuit board, semiconductor device mfg. method, and electroplating system |
| 12/25/2002 | CN1386914A Process for preparing Pd nano-particle film on surface of gold electrode |
| 12/25/2002 | CN1386903A Tinned steel plate |
| 12/25/2002 | CN1096937C Metal finishing process and articles thereby |
| 12/24/2002 | US6497806 Method of producing a roughening-treated copper foil |
| 12/24/2002 | US6497800 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 12/19/2002 | US20020192492 Protective coating of tin/tin alloy having an outer surface doped for wisker-growth inhibition; e.g., gold or palladium dopes; used as an electrical connector or lead frame for integrated circuits; solderability; corrosion resistance |
| 12/19/2002 | US20020190759 Electrochemically accelerated self-assembly of molecular devices |
| 12/19/2002 | US20020189716 Deposition and thermal diffusion of borides and carbides of refractory metals |
| 12/19/2002 | US20020189665 Preparation of CIGS-based solar cells using a buffered electrodeposition bath |
| 12/18/2002 | EP1266976A1 Steel sheet for porcelain enameling and method for production thereof, and enameled product and method for production thereof |
| 12/18/2002 | EP1266052A1 Electro-plating apparatus and a method of electro-plating |
| 12/18/2002 | EP1266051A1 Method for the surface treatment of objects and means for carrying out said method |
| 12/18/2002 | EP1265725A1 Brazing sheet product and method of manufacturing an assembly using the brazing sheet product |
| 12/17/2002 | US6495211 Process for producing a substrate and plating apparatus |
| 12/17/2002 | US6495022 Electolysis to create an alloy of copper, tungsten and/or molybdenum, nickel, cobalt, iron and/or zinc and chlorine |
| 12/17/2002 | US6495018 A single delivery channel is formed by, and between, inner wall 2 and baffle 3. electrolyte 5 is pumped up the interior of channel 1 and is directed onto substrate 4 being a cathode maintained at -10 volts. the upper part of the inner wall 2 of |
| 12/17/2002 | US6494219 Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits |
| 12/17/2002 | CA2082989C Dipping composition for the treatment of chromatized or passivated galvanizing coatings |
| 12/12/2002 | WO2002068727A3 Copper-plating solution, plating method and plating apparatus |
| 12/12/2002 | US20020187599 Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece |
| 12/12/2002 | US20020187364 Electrodeposition; electronics |
| 12/12/2002 | US20020185716 Metal article coated with multilayer finish inhibiting whisker growth |
| 12/11/2002 | EP1264918A1 Electrolytic copper plating method |
| 12/11/2002 | EP1264009A2 Method for applying a metal layer to a light metal surface |
| 12/11/2002 | CN1384782A Treated copper foil and process for making treated copper foil |
| 12/11/2002 | CN1095882C Electrolytic treating device for plate-like workpieces, in particular print circuit boards |
| 12/10/2002 | US6492262 Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies |
| 12/10/2002 | US6492039 Composite multilayer material for plain bearings |
| 12/10/2002 | US6491806 Electroplating bath composition |
| 12/05/2002 | WO2002098194A1 Copper plated circuit layer-carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer-carrying copper clad laminated sheet |
| 12/05/2002 | WO2002098193A1 A method for applying thick copper on substrates |
| 12/05/2002 | WO2002097165A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 12/05/2002 | WO2002070789A3 Electrical potential-assisted assembly of molecular devices |
| 12/05/2002 | US20020182434 Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer |
| 12/05/2002 | US20020182433 Composite metal layer, comprises (I) copper, (II) tungsten or molybdenum and (III) nickel, cobalt, iron or zinc; and a roughened layer of copper formed on the composite metal layer. |
| 12/05/2002 | US20020179450 Selective shield/material flow mechanism |
| 12/05/2002 | DE10123585C1 Production of metals which foam on heat treatment or metal foams comprises suspending a propellant which splits gas on heat treatment in a galvanic electrolyte, and galvanically depositing the metal with the electrolyte on a substrate |
| 12/04/2002 | EP1262782A2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 12/04/2002 | EP1261990A1 Flexible metal substrate for cis solar cells, and method for producing the same |
| 12/04/2002 | EP1114207B1 Pellistor |
| 12/04/2002 | CN1382833A Electroplating method with rotating hanger |