| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 06/27/2002 | WO2002050336A2 Integrated mutli-step gap fill and all feature planarization for conductive materials |
| 06/27/2002 | WO2002050326A1 Steel sheet for porcelain enameling and method for production thereof, and enameled product and method for production thereof |
| 06/27/2002 | US20020080588 Probe card assembly and kit, and methods of making same |
| 06/27/2002 | US20020079228 Rectifiers that pulse direct current several hundred times per second in order to repeatedly and intermittently establish an electric field between a supply of plating material and the gravure cylinder |
| 06/27/2002 | US20020079215 Workpiece processor having processing chamber with improved processing fluid flow |
| 06/27/2002 | US20020079133 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same |
| 06/27/2002 | US20020078669 Nonwoven metal fabric and method of making same |
| 06/26/2002 | EP1216486A1 Methods and apparatus for treating seed layer in copper interconnections |
| 06/25/2002 | USRE37765 Pretreating the material with a carbon black dispersion followed by a graphite dispersion before the electroplating step. |
| 06/25/2002 | US6410178 Separator of fuel cell and method for producing same |
| 06/25/2002 | US6409904 Method and apparatus for depositing and controlling the texture of a thin film |
| 06/25/2002 | US6409903 Multi-step potentiostatic/galvanostatic plating control |
| 06/25/2002 | US6409892 Reactor vessel having improved cup, anode, and conductor assembly |
| 06/25/2002 | US6409850 Heating to tin melting point and quenching; brightness, free of woodgrain surface; di- or trihydroxybenzenesulfonic acids |
| 06/20/2002 | WO2002049077A2 Barrier layer for electrical connectors and methods of applying the layer |
| 06/20/2002 | WO2000075401A9 Simultaneous electrical and fluid connection for anode |
| 06/20/2002 | US20020076515 Heat resistant resin film with metal thin film, manufacturing method of the resin film, endless belt, manufacturing method of the belt, and image forming apparatus |
| 06/20/2002 | US20020074662 Substrate for manufacturing a semiconductor device with three element alloy |
| 06/20/2002 | US20020074234 Immersing the wafer, under bias, in a plating solution at forward current density of 10-30 mA/cm2 and a duration of 2-60 seconds followed by reverse current and bulk fill plating |
| 06/20/2002 | US20020074233 Altering the structure of each deposited copper layer by annealing |
| 06/20/2002 | US20020074230 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 06/19/2002 | EP1215304A1 Two-layer chrome-plating process |
| 06/19/2002 | EP1214739A2 Copper deposit process |
| 06/19/2002 | EP1214191A1 Treated copper foil and process for making treated copper foil |
| 06/19/2002 | CN1354588A Honeycomb telephone shell |
| 06/18/2002 | US6407047 For pretreatment of aluminum prior to electroplating, to remove smut that results from the etching step of the aluminum pretreatment |
| 06/13/2002 | WO2002047139A2 Methode of forming a copper film on a substrate |
| 06/13/2002 | WO2002046526A1 Doctor or coater blade and method in connection with its manufacturing |
| 06/13/2002 | WO2002046500A2 Improvements relating to metal finishes |
| 06/13/2002 | WO2002045476A2 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 06/13/2002 | WO2002014583A3 Electroplated aluminum parts and process of production |
| 06/13/2002 | WO2000045625A3 Method for the direct electroplating of through-holes in printed circuit boards |
| 06/13/2002 | US20020072335 Cellular phone housing |
| 06/13/2002 | US20020071961 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 06/13/2002 | US20020071207 Thin film magnetic head having gap layer made of nip and method of manufacturing the same |
| 06/13/2002 | US20020070434 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| 06/13/2002 | US20020070126 Polishing method, polishing apparatus, plating method, and plating apparatus |
| 06/13/2002 | US20020070119 Masking techniques for metal plating |
| 06/13/2002 | US20020070118 Plating cathode with layer of first metal, and a layer of second metal, using an electrolytic plating process; wherein a plating current is controlled to obtain desired current density at the cathode within a predefined range |
| 06/13/2002 | US20020070117 Electrochemical processing power device |
| 06/13/2002 | US20020069943 Method for producing a tin-nickel alloy film |
| 06/12/2002 | EP1213372A2 Process and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses and use of the process |
| 06/12/2002 | CN1353779A System for electrochemically processing workpiece |
| 06/12/2002 | CN1353778A Workpiece processor having processing chamber with improved processing fluid flow |
| 06/11/2002 | US6403234 Plated material for connectors |
| 06/11/2002 | US6402925 Prevent accumulation by polishing |
| 06/11/2002 | US6402924 Programmed pulse electroplating process |
| 06/11/2002 | US6402922 Pulse plating |
| 06/11/2002 | US6402592 Electrochemical methods for polishing copper films on semiconductor substrates |
| 06/06/2002 | US20020068438 Method for fabricating semiconductor devices |
| 06/06/2002 | US20020067181 Probe card assembly and kit, and methods of making same |
| 06/06/2002 | US20020066673 Method for plating copper conductors and devices formed |
| 06/05/2002 | EP1211011A1 Solder coating material and production method therefor |
| 06/04/2002 | US6399220 Conformable nickel coating and process for coating an article with a conformable nickel coating |
| 06/04/2002 | US6399163 Optical displays with liquid crystals |
| 06/04/2002 | US6399153 Method and apparatus for air masking portion of component during plating or coating |
| 06/04/2002 | US6398939 An electrowinning cell and an electrolyte circulation system for forming copper, where fresh electrolytic solution entering the tank is directed uniformly between the cathode and anode plates |
| 06/04/2002 | US6398937 Vibration of an electrolysis solution to increase uniformity of copper electrodeposition using transducers positioned between anodes |
| 06/04/2002 | CA2193467C Article with protective coating thereon |
| 05/30/2002 | WO2001032951A9 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 05/30/2002 | US20020064677 Electric connector |
| 05/30/2002 | US20020064591 Substrate plating method and apparatus |
| 05/30/2002 | US20020063064 Connecting electronically resistive substrate to a negative terminal of electrical power source; disposing substrate and an anode in solution comprising metal compound and supporting electrolyte; electrodepositing metal onto substrate |
| 05/30/2002 | US20020063062 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
| 05/30/2002 | US20020062663 Articles with selectively deposited overlay |
| 05/29/2002 | EP0956600B1 PREPARATION OF Cu x In y Ga z Se n (x=0-2, y=0-2, z=0-2, n=0-3) PRECURSOR FILMS BY ELECTRODEPOSITION FOR FABRICATING HIGH EFFICIENCY SOLAR CELLS |
| 05/29/2002 | CN1351678A 合金电镀 Alloy plating |
| 05/29/2002 | CN1351531A Method and apparatus for plating and polishing a semiconductor substrate |
| 05/29/2002 | CN1351530A Method and apparatus for deposition on and polishing of a semiconductor surface |
| 05/28/2002 | US6395642 Semiconductor substrate |
| 05/28/2002 | US6395230 Pellistor |
| 05/28/2002 | US6395163 Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
| 05/23/2002 | US20020060159 Chrome-plated sliding member and manufacturing method thereof |
| 05/23/2002 | DE10052188A1 Production of a metallized electrode used as a gas diffusion electrode for a polymer-electrolyte-membrane fuel cells comprises applying a catalyst onto a conducting substrate coated with a polymer by electrochemical deposition |
| 05/21/2002 | US6391476 Aluminum alloy cladding layer comprising silicon, magnesium, zinc, copper, manganese, indium, iron, strontium, bismuth, lead, lithium, and/or antimony |
| 05/21/2002 | US6391473 Cu plated ceramic substrate and a method of manufacturing the same |
| 05/21/2002 | US6391181 Coloring, metal alloys of zinc, copper and zinc |
| 05/21/2002 | US6391179 Plating and antideposit agents |
| 05/21/2002 | US6391168 Plating apparatus utilizing an auxiliary electrode |
| 05/21/2002 | US6391166 Plating apparatus and method |
| 05/21/2002 | US6390356 Method of forming cylindrical bumps on a substrate for integrated circuits |
| 05/16/2002 | WO2002038834A1 Porous nickel foil for alkaline battery cathode, production method therefor and production device therefor |
| 05/16/2002 | WO2002038830A1 Surface treated tin-plated steel sheet and chemical treatment solution |
| 05/16/2002 | WO2002038827A1 Plasma electroplating |
| 05/16/2002 | WO2002038326A2 Brazing product having a low melting point |
| 05/16/2002 | US20020056649 Method of fabricating thin magnetic film and electrolytic plating apparatus for fabricating thin magnetic film |
| 05/16/2002 | US20020056647 Plating method and plating apparatus |
| 05/16/2002 | US20020056645 Immersing electrically conductive substrate having smooth surface having small recesses therein in electroplating bath containing ions of metal to be deposited, immersing counter electrode, passing modulated pulsing current between |
| 05/16/2002 | US20020056644 Pulse plating by pulsed electrolysis by periodically applying electricity while controlling pulse frequency and current density |
| 05/15/2002 | EP1205602A1 Nonwoven metal fabric and a method of making same |
| 05/15/2002 | EP1204787A2 Method for continuous nickel-plating of an aluminium conductor and corresponding device |
| 05/15/2002 | EP1204786A1 Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement |
| 05/15/2002 | CN1349659A Burless castellation via process and product for plastic chip carrier |
| 05/14/2002 | US6387229 Alloy plating |
| 05/09/2002 | US20020053734 Probe card assembly and kit, and methods of making same |
| 05/09/2002 | US20020053519 Seed layer repair |
| 05/09/2002 | US20020053517 Electolysis to create an alloy of copper, tungsten and/or molybdenum, nickel, cobalt, iron and/or zinc and chlorine |
| 05/09/2002 | US20020053510 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 05/08/2002 | CN1348511A Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
| 05/08/2002 | CN1348326A Production method of copper foil for fine line use |