| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 04/24/2003 | WO2003033771A2 Method and system for selective electro-coating of the surfaces of metals |
| 04/24/2003 | WO2003033770A2 System and method for electrolytic plating |
| 04/24/2003 | US20030077510 Surface-treated steel sheet for battery container, a battery container, and a battery using same |
| 04/24/2003 | US20030077411 Multilayer; polymer, rubber, thermoplastic elastomer and metal plating |
| 04/24/2003 | US20030075451 Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof |
| 04/24/2003 | US20030075450 Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields |
| 04/24/2003 | US20030075449 Method for controlling field flow decouple plating and a device thereof |
| 04/23/2003 | EP1304519A2 Process for making a fluid-impermeable layer, and an impermeable hose |
| 04/23/2003 | CN1412351A Light metal alloy surface coating method |
| 04/22/2003 | US6551722 Coated article having a stainless steel color |
| 04/22/2003 | US6551721 Forming nickel-bismuth alloy layer on steel sheet, thermally treating sheet at 300-650 degrees C in inactive gas or deoxidizing gas so that iron-nickel diffused layer and nickel-bismuth diffused layer are formed at boundary surfaces |
| 04/22/2003 | US6551661 Oxidizing pretreatment using potassium permanganate at 20-35 degrees c, washing, draining and drying; depositing pyrrole, furan, aniline, thiophen or derivatives, polymerizing to a electroconductive polymer, washing and draining |
| 04/22/2003 | US6551488 Segmenting of processing system into wet and dry areas |
| 04/22/2003 | US6551486 Process for galvanic depositing of a dispersion layer on a work piece surface |
| 04/22/2003 | US6551485 Electrodeposition of metals for forming three-dimensional microstructures |
| 04/22/2003 | US6551484 Connecting an electric source between an anode immersed in an electrolyte solution and a seed layer formed on the substrate |
| 04/22/2003 | US6551483 Mitigate corrosion of a metal seed layer on recessed features by contacting the seed layer with an electrolyte solution |
| 04/17/2003 | US20030070931 Selective plating of printed circuit boards |
| 04/17/2003 | US20030070930 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact |
| 04/16/2003 | EP1302567A1 Coating method for light metal alloys |
| 04/16/2003 | EP1302566A1 Production of a metallically conductive surface region on an oxidised Al-Mg alloy |
| 04/16/2003 | EP1302565A1 Coating method for light metal alloy surfaces |
| 04/16/2003 | EP1302564A2 Process for partially coating a metallic surface |
| 04/16/2003 | EP1302563A1 Production of metal conductive surface regions on coated light-metal alloys |
| 04/16/2003 | EP1301655A2 A method for electrolytic galvanising using electrolytes containing alkane sulphonic acid |
| 04/16/2003 | CN1411055A Wiring substrate for small electronic unit and mfg. method thereof |
| 04/16/2003 | CN1411054A Semiconductor integrated circuit, method and apparatus for mfg. same |
| 04/15/2003 | US6547946 Processing a printed wiring board by single bath electrodeposition |
| 04/15/2003 | US6547945 Electrode with an electrode chamber for receiving electrolyte and an article forming the second electrode disposed inwardly and spaced from the first electrode for electrolyte passage between |
| 04/15/2003 | US6547944 Plating cathode with layer of first metal, and a layer of second metal, using an electrolytic plating process; wherein a plating current is controlled to obtain desired current density at the cathode within a predefined range |
| 04/15/2003 | US6547937 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 04/15/2003 | US6547936 Electroplating apparatus having a non-dissolvable anode |
| 04/15/2003 | US6546751 Articles with selectively deposited overlay |
| 04/10/2003 | WO2003030186A2 Nickel coated copper as electrodes for embedded passive devices |
| 04/10/2003 | WO2003029520A1 Corrosion-resistant coating structure containing no 6-valent chromium which has resin layer and metal layer excellent in adhesion to resin layer |
| 04/10/2003 | US20030068517 Nickel coated copper as electrodes for embedded passive devices |
| 04/09/2003 | EP1088122B1 Method and apparatus for electroplating |
| 04/09/2003 | CN1408903A Improvement of adhesive property and compounding method for direct metalization |
| 04/09/2003 | CN1104967C Fluid delivery apparatus and method |
| 04/08/2003 | US6544391 Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly |
| 04/03/2003 | WO2003028048A2 Low-force electrochemical mechanical processing method and apparatus |
| 04/03/2003 | WO2003027011A2 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 04/03/2003 | WO2002009207A3 Electrochemical cell system output control method and apparatus |
| 04/03/2003 | US20030065242 Radioactive implantable devices and methods and apparatuses for their production and use |
| 04/03/2003 | US20030064669 Low-force electrochemical mechanical processing method and apparatus |
| 04/03/2003 | US20030064586 Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface |
| 04/03/2003 | US20030064278 Separator of fuel cell and method for producing same |
| 04/03/2003 | US20030064273 Separator for fuel cell and method for producing the same |
| 04/03/2003 | US20030064243 Zn-co-w alloy electroplated steel sheet with excellent corrosion resistance and welding property, and its electrolyte for it |
| 04/03/2003 | US20030064242 Method of manufacturing an aluminium joined product |
| 04/02/2003 | EP1298233A2 System and method for electroplating fine geometries |
| 04/02/2003 | EP1298232A1 Process of repairing steel surfaces on flat and/or structured press plates or endless bands |
| 04/02/2003 | EP1297537A1 Lead-coated complex porous structures, and corresponding method for conductive activation |
| 04/02/2003 | EP1115914B1 Zinc coated steel plates coated with a pre-lubricating hydroxysulphate layer and methods for obtaining same |
| 04/02/2003 | CN1407141A Tinplating |
| 04/02/2003 | CN1406687A Manufacture of aluminium cylinder with electroplated coating |
| 04/01/2003 | US6541126 Copper microparticles deposited on the surface of carrier foil and covered with the release interface layer and electrodeposited copper layer; very accurate holes formed by laser; high yield in production of printed wiring boards |
| 04/01/2003 | US6540928 Magnetic pole fabrication process and device |
| 04/01/2003 | CA2281231C Method for producing electro- or electroless-deposited film with a controlled crystal orientation |
| 03/27/2003 | WO2003025258A1 Method for the coating of electrically conducting support materials |
| 03/27/2003 | WO2003025257A1 Electrodeposition of redox polymers and co-electrodeposition of enzymes by coordinative crosslinking |
| 03/27/2003 | WO2003025256A1 Platable engineered polyolefin alloys |
| 03/27/2003 | WO2003025255A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 03/27/2003 | WO2002077327B1 Mask plate design |
| 03/27/2003 | US20030058629 Wiring substrate for small electronic component and manufacturing method |
| 03/27/2003 | US20030057099 System and method for electroplating fine geometries |
| 03/27/2003 | US20030057098 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated. |
| 03/27/2003 | US20030057097 Method and apparatus for forming metal layers |
| 03/27/2003 | CA2460879A1 Platable engineered polyolefin alloys |
| 03/26/2003 | EP1295312A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 03/26/2003 | EP0792519B1 Interconnection elements for microelectronic components |
| 03/26/2003 | EP0670916B2 Nanocrystalline metals |
| 03/26/2003 | CN1405360A Multilayer nickel-iron alloy composite coating process |
| 03/26/2003 | CN1404983A Metallization treatment method for plastic surface |
| 03/26/2003 | CN1104044C Method for producing semiconductor package in chip size |
| 03/25/2003 | US6537683 Stratified composite material for sliding elements and method for the production thereof |
| 03/20/2003 | WO2003023848A2 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
| 03/20/2003 | WO2002083968A3 Coated article having a stainless steel color |
| 03/20/2003 | WO2002078903A3 Method and apparatus for avoiding particle accumulation during an electrochemical process |
| 03/20/2003 | WO2002075797A3 Method of forming copper interconnects |
| 03/20/2003 | WO2002070144A9 Internal heat spreader plating methods and devices |
| 03/20/2003 | US20030052011 Plasma electroplating |
| 03/20/2003 | US20030051996 Apparatus for controlling flow in an electrodeposition process |
| 03/19/2003 | CN1404536A Zn-Co-W alloy electroplated steel sheet with excellent corrosion resistance and welding property, and its electrolyte for it |
| 03/19/2003 | CN1404535A Composite copper foil and manufacturing method thereof |
| 03/19/2003 | CN1404120A Method for removing stain from through-hole |
| 03/18/2003 | US6534865 Method of enhanced fill of vias and trenches |
| 03/18/2003 | US6534195 Corrosion resistance and sealing can be improved without using Pb; Sn-Zn alloy is plated on first metallic member and/or second metallic member, and soldered with Sn-Ag alloy |
| 03/18/2003 | US6534192 Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
| 03/18/2003 | US6534116 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 03/18/2003 | US6533915 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil |
| 03/13/2003 | WO2003021007A2 Ultrasonically-enhanced electroplating apparatus and methods |
| 03/13/2003 | US20030048961 Sliding member |
| 03/13/2003 | US20030048582 Soft magnetic film and thin film magnetic head using soft magnetic film, process for manufacturing soft magnetic film and process for manufacturing thin film magnetic head |
| 03/13/2003 | US20030047458 Combined adhesion promotion and direct metallization process |
| 03/13/2003 | US20030047448 Anode chamber and cathode chamber are separate by ionically connected chambers thereby keeping the anolyte substantially free of the plating additives reducing the likelihood of generating electrolyte species that inhibit bottom-up plating |
| 03/13/2003 | US20030047108 Adhesion properties and high solderability |
| 03/12/2003 | EP1291454A1 Stainless stell wire and producing method thereof |
| 03/12/2003 | EP1290246A1 Method of manufacturing an aluminium product |
| 03/12/2003 | EP1289709A1 Method of containing a phase change material in a porous carbon material and articles produced thereby |