| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 06/12/2003 | WO2003048864A1 Mask forming method and removing method, and semi-conductor device, electric circuit, display module, color filter and light emitting element produced by the techniques |
| 06/12/2003 | WO2003048429A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 06/12/2003 | WO2003048427A2 Pretreatment process for coating of aluminium materials |
| 06/12/2003 | WO2003048423A1 Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof |
| 06/12/2003 | WO2001090446A3 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| 06/12/2003 | US20030106807 Semiconductors; integrated circuits |
| 06/11/2003 | WO2003091481A1 Method for activating surface of parent material and its activating system |
| 06/11/2003 | EP1318371A2 Heat exchange surface with galvanized microstructures with protrusions |
| 06/10/2003 | US6576113 Method of electroplating of high aspect ratio metal structures into semiconductors |
| 06/10/2003 | US6575635 Multi-layer sliding bearing |
| 06/10/2003 | US6575354 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film |
| 06/05/2003 | WO2003046261A1 Electrodeposition of metals for forming three-dimensional microstructures |
| 06/05/2003 | WO2003045619A1 Alloy composition and method for low temperature fluxless brazing |
| 06/05/2003 | WO2003045618A1 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals |
| 06/05/2003 | CA2736641A1 Products and compositions of layered material systems for fluxless brazing of aluminum or dissimilar metals |
| 06/04/2003 | EP1259661A4 Pad designs and structures for a versatile materials processing apparatus |
| 06/04/2003 | CN1421905A Method of and apparatus for producing semiconductor device |
| 06/03/2003 | US6573183 Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface |
| 06/03/2003 | US6572982 Electromigration-resistant copper microstructure |
| 06/03/2003 | US6572755 Pressing workpiece against polishing surface while causing relative motion between workpiece and polishing surface, supplying an electrolyte solution to polishing surface, applying a voltage between both surfaces |
| 06/03/2003 | US6572742 Apparatus for electrochemical fabrication using a conformable mask |
| 05/30/2003 | WO2003044248A1 Device for electrolytic treatment and hardening of the surface of the heat exchange tubes of steam generators of nuclear power plants |
| 05/30/2003 | WO2003044247A1 Elemental silicon nanoparticle plating and method for the same |
| 05/30/2003 | WO2003044246A1 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
| 05/30/2003 | WO2003043777A1 Improvements in fluxless brazing |
| 05/30/2003 | CA2779474A1 Improvements in fluxless brazing |
| 05/29/2003 | US20030100638 Surface treating method and surface treating agent |
| 05/29/2003 | US20030098338 Methods for fluxless brazing |
| 05/29/2003 | US20030098241 Process and apparatus for manufacturing a semiconductor device |
| 05/28/2003 | EP1315407A2 Dielectric structure |
| 05/28/2003 | EP1314799A1 Electrochemical treating method such as electroplating and electrochemical reaction device therefor |
| 05/28/2003 | EP1313895A1 Method for metal coating the surface of high temperature superconductors |
| 05/28/2003 | EP1125007A4 Submicron metallization using electrochemical deposition |
| 05/28/2003 | DE10202431C1 Apparatus for electrochemical metallization, etching, oxidation or reduction of materials uses small electrochemical cells with contact electrodes fed with electrical pulses |
| 05/27/2003 | US6569297 Workpiece processor having processing chamber with improved processing fluid flow |
| 05/22/2003 | WO2003042434A1 Method and device for surface treatment of treated object |
| 05/22/2003 | WO2003015870A3 Radioactive implantable devices and their production methods |
| 05/22/2003 | WO2002090624A3 A process and apparatus for cleaning and/or coating metal surfaces |
| 05/22/2003 | US20030096059 Semiconductors; void occurence suppressed in junction layer; occurrence of cracks, swelling, and exfoliation in the plating layer suppressed |
| 05/22/2003 | US20030095731 Sliding member |
| 05/22/2003 | US20030094364 Method and apparatus for electro-chemical mechanical deposition |
| 05/21/2003 | EP1198624A4 Process for electroplating a work piece coated with an electrically conducting polymer |
| 05/21/2003 | CN1109132C Process for producing porous iron metal body |
| 05/20/2003 | US6565731 Electrodeposition plating using solution containing reducing agent and polyelectrolyte |
| 05/20/2003 | US6565729 Using alkaline electrolyte bath; uniform overcoatings |
| 05/15/2003 | WO2003041126A2 Electrochemical mechanical processing with advancible sweeper |
| 05/15/2003 | WO2003040436A1 Method of eliminating voids in w plugs |
| 05/15/2003 | WO2003040432A1 Nickel-based surface treatment films excellent in heat-resistant adhesion to resin |
| 05/15/2003 | WO2003039609A1 Deposition of coatings on substrates |
| 05/15/2003 | US20030092261 Substrate processing method |
| 05/15/2003 | US20030089613 Method of selectively electroplating by screen-plating technology |
| 05/15/2003 | US20030089611 Elemental silicon nanoparticle plating and method for the same |
| 05/15/2003 | US20030089610 Repair method for textured and/or smooth steel surfaces on endless strips or pressing sheets |
| 05/14/2003 | EP1311145A1 Method of providing conductive tracks on a printed circuit |
| 05/14/2003 | EP1311010A1 Surface-treated steel plate for battery case and battery case |
| 05/14/2003 | EP1309741A2 Electroplated aluminum parts and process of production |
| 05/14/2003 | CN1418264A Device providing electrical contact to surface of semiconductor workpiece during metal plating |
| 05/14/2003 | CN1418050A Manufacture of wiring substrate |
| 05/13/2003 | US6562484 Steel material of high fatigue strength and a process for manufacturing the same |
| 05/13/2003 | US6562223 Using electrolyte solutions; for aluminum |
| 05/13/2003 | US6562222 Copper sulfate, sulfuric acid, chlorine, silane coupling agent; semiconductors |
| 05/13/2003 | US6562204 Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers |
| 05/13/2003 | US6561322 Plated wear surface for alloy components and methods of manufacturing the same |
| 05/13/2003 | CA2077784C Metal wire with a layer of coating for reinforcing articles made of elastomeric materials, and articles made of elastomeric materials reinforced with the said wire |
| 05/08/2003 | WO2003038158A2 Electroplating device and electroplating system for coating already conductive structures |
| 05/08/2003 | WO2003038157A1 Method for forming electroplated coating on surface of article |
| 05/08/2003 | US20030087071 Forming decorative, durable, corrosion resistant casing |
| 05/08/2003 | US20030086936 For use in hematopoietic therapy; for arresting proliferation of leukemic cells |
| 05/08/2003 | US20030085129 Method of forming zinc oxide film, method of producing semiconductor element substrate using same, and method of producing photovoltaic element |
| 05/08/2003 | US20030085118 Semiconductor wafer plating cell assembly |
| 05/08/2003 | US20030085113 Wherein surface of electroconductive workpiece forms the surface of a cathode of an electrolytic cell in which the anode direct current voltage is maintained, while immersing in foam and venting released gases |
| 05/08/2003 | DE19936036C2 Verfahren und Vorrichtung zur Herstellung eines dreidimensionalen metallischen Bauteils Method and apparatus for producing a three-dimensional metallic component |
| 05/07/2003 | EP1307905A2 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 05/07/2003 | CN1416478A Surface treated Tin-plated steel sheet and chemical treatment solution |
| 05/07/2003 | CN1416377A Brazing sheet product and method of mfg. assembly using brazing sheet product |
| 05/07/2003 | CN1415787A Method for preparing multilayer film or copper-nickel phosphor |
| 05/07/2003 | CN1415786A New technique for increasing binding force of passive film of acidity zinc plating pieces |
| 05/06/2003 | US6558739 Titanium nitride/titanium tungsten alloy composite barrier layer for integrated circuits |
| 05/06/2003 | US6558518 Method and apparatus for plating substrate and plating facility |
| 05/06/2003 | US6557237 Removable modular cell for electro-chemical plating and method |
| 05/06/2003 | CA2249970C Improved electroplating method and apparatus |
| 05/02/2003 | EP0946792B1 Production process for a micromechanical building component |
| 05/01/2003 | WO2003036710A1 Bonding wire |
| 05/01/2003 | WO2003035922A1 Method for press working, plated steel product for use therein and method for producing the steel product |
| 05/01/2003 | US20030082398 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film |
| 05/01/2003 | US20030079997 Cleaning and passivating a surface of a light metal alloy component; forming first layer on cleaned and passivated surface wherein first layer comprises zinc; forming a second layer which comprises tin |
| 05/01/2003 | US20030079910 Current carrying structure using voltage switchable dielectric material |
| 04/30/2003 | CN1413800A Manufacture method of intelligence integral dies of arc spraying and brush plating |
| 04/29/2003 | US6555170 Coating substrate with solution of film forming amine and acid prior to plating; increased speed and efficiency |
| 04/29/2003 | US6554976 Electroplating apparatus |
| 04/29/2003 | US6554630 Movable terminal, coaxial connector, and communication apparatus |
| 04/24/2003 | WO2003034478A2 Apparatus and method for electro chemical plating using backside electrical contacts |
| 04/24/2003 | WO2003033779A2 Coating method for light metal alloys |
| 04/24/2003 | WO2003033778A1 Production of a surface area with metallic conductivity on oxidised al-mg alloys |
| 04/24/2003 | WO2003033777A1 Coating method for light metal alloy surfaces |
| 04/24/2003 | WO2003033776A1 Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields. |
| 04/24/2003 | WO2003033775A1 Method of copper-plating small-diameter holes |
| 04/24/2003 | WO2003033774A1 Submerged transfer plating device with plating fluid jetting tube |
| 04/24/2003 | WO2003033773A1 Selective plating of printed circuit boards |
| 04/24/2003 | WO2003033772A1 Production of metallically conductive surface areas on coated light metal alloys |