Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
---|
11/14/2001 | EP0808921B1 Ornamental member |
11/13/2001 | US6316359 Interconnect structure in a semiconductor device and method of formation |
11/08/2001 | WO2001083857A1 Method and device for the electrolytic coating of a metal strip |
11/08/2001 | WO2001083855A1 Textured metal article |
11/08/2001 | WO2001083854A2 Electroplating bath composition and method of using |
11/08/2001 | CA2407660A1 Method and device for the electrolytic coating of a metal strip |
11/07/2001 | EP1152071A1 Copper plating method |
11/07/2001 | EP1152070A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
11/07/2001 | CN1321121A Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil |
11/07/2001 | CN1321061A Method for surface treatment of copper foil |
11/07/2001 | CN1320960A Interconnection method without lead bosses |
11/07/2001 | CN1320722A Method for making metal-plastic compoiste article |
11/06/2001 | US6312762 Process for production of copper or copper base alloys |
11/06/2001 | US6312580 Electroplating with an acid gold plating solution comprising: soluble alkali metal complex salt of gold an acid electrolyte where an adjusted ph range is 0.1-3.0; eliminates multistage stripping on chromium automobile emblems |
11/06/2001 | US6312579 Bearing having multilayer overlay and method of manufacture |
11/01/2001 | WO2001081659A1 Electrical contacting element made of an elastic material |
11/01/2001 | WO2001081043A1 Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate and layer structure made thereby |
11/01/2001 | US20010036560 Article having a decorative and protective coating |
11/01/2001 | US20010036514 Partial plating system |
11/01/2001 | US20010035355 Patterning photoresist |
11/01/2001 | US20010035346 Apparatus and method for electroplating |
11/01/2001 | US20010035343 Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same |
11/01/2001 | CA2405573A1 Electrical contact element made of an elastic material |
10/31/2001 | EP1149936A2 Plating system |
10/31/2001 | EP1148976A1 Method and apparatus for deposition on and polishing of a semiconductor surface |
10/31/2001 | DE10019720A1 Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen Method and apparatus for electrically contacting of sheet material to be treated in electrolytic processes |
10/31/2001 | CN1319685A Equipment and technology for electroplating steel pipe inner wall by using auxiliary anode and spray-plating zinc solution |
10/30/2001 | US6309529 Method for producing sputtering target material |
10/30/2001 | US6309528 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
10/30/2001 | US6309524 Methods and apparatus for processing the surface of a microelectronic workpiece |
10/30/2001 | CA2236156C Article having a coating |
10/25/2001 | WO2001079592A1 Apparatus and method for electrochemical processing of substrates |
10/25/2001 | WO2001079591A1 Apparatus and method for electrochemical processing of substrates |
10/25/2001 | WO2001007685A3 Method for continuous nickel-plating of an aluminium conductor and corresponding device |
10/25/2001 | US20010032788 Divided housing |
10/24/2001 | EP1148548A2 Method of forming lead-free bump interconnections |
10/24/2001 | EP1148157A1 Process to decorate an article and article decorated by this process |
10/24/2001 | EP0895549A4 Electrochemical fluidized bed coating of powders |
10/24/2001 | CN1318655A Electroplating method |
10/23/2001 | US6306274 Method for making electrodeposition blades |
10/18/2001 | WO2001078154A2 Preparation of cigs-based solar cells using a buffered electrodeposition bath |
10/18/2001 | WO2001077420A1 Laser hole drilling copper foil |
10/18/2001 | WO2001077419A2 Process for the direct metal-plating of a plastic substrate |
10/18/2001 | US20010031375 High porosity three-dimensional structures in chromium based alloys |
10/18/2001 | CA2404946A1 Process for the direct metal-plating of a plastic substrate |
10/17/2001 | CN1317825A Electroplating appts. |
10/16/2001 | US6303181 Providing substrate having non-conductive surface; contacting with conditioning agent comprising cationic substantive conditioner effective to deposit film; contacting with carbon dispersion comprising conductive carbon and binder |
10/16/2001 | US6303014 Electrodeposition of metals in small recesses using modulated electric fields |
10/16/2001 | US6303010 Methods and apparatus for processing the surface of a microelectronic workpiece |
10/16/2001 | US6301784 Method of fabricating plain bearings |
10/16/2001 | CA2135978C Corrosion resistant stainless steel and method of making same |
10/11/2001 | DE10113767A1 Elektrolytisches Plattierungsverfahren und Vorrichtung für eine Leiterbahnplatine Electrolytic plating method and apparatus for a printed wiring board |
10/11/2001 | DE10013736A1 Process for surface hardening of screwdriver blades comprises galvanically chromium plating the blade, sand blasting to roughen the chromium layer, galvanically activating the roughened layer, and galvanically chromium plating the blade |
10/10/2001 | EP1142041A1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths |
10/10/2001 | EP1141443A1 A method of metallizing the surface of a solid polymer substrate and the product obtained |
10/10/2001 | CN1316551A Process for electroplating Cr onto surface of thin steel sheet |
10/09/2001 | US6299932 Lead frame processing method and apparatus |
10/09/2001 | US6299749 Method of fabricating an electrical component |
10/04/2001 | WO2001021294A3 Pattern dependent surface profile evolution of electrochemically deposited metal |
10/04/2001 | US20010027035 Electrical connector |
10/04/2001 | EP1138806A2 Electroplating apparatus having a non-dissolvable anode |
10/04/2001 | EP1138805A2 Tin electolyte |
10/03/2001 | CN1316023A Method and apparatus for copper plating using electroless plating and electroplating |
10/03/2001 | CN1315894A Structure and method for jointing metal members |
10/03/2001 | CN1315591A Forming method of plating chrome on copper layer of printed circuit board |
10/03/2001 | CN1072280C Method for preventing cooling pipe of carbon-steel cooler from corrosion by sea water and apparatus thereof |
10/03/2001 | CN1072047C Element of continuous metal casting ingot mould with copper or copper alloy cooled wall comprising on its external surface metal coating, and method of coating |
10/03/2001 | CA2342954A1 Process for decorating an item, and item decorated using the process |
10/02/2001 | US6297157 Time ramped method for plating of high aspect ratio semiconductor vias and channels |
10/02/2001 | US6297155 Method for forming a copper layer over a semiconductor wafer |
10/02/2001 | US6296951 Laminated chromium plating layers having superior wear resistance and fatigue strength |
09/27/2001 | WO2001071780A2 Apparatus and method for electrochemically processing a microelectronic workpiece |
09/27/2001 | WO2001071066A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
09/27/2001 | US20010023830 Electrolytic plating method and device for a wiring board |
09/27/2001 | US20010023828 Process and installation for coating a surface by electrophoresis |
09/27/2001 | DE10014260A1 Electroplating enhanced by brightening agents, is preceded by cleaning bath containing only the metallic plating addition, which removes disruptive cleaning residues |
09/26/2001 | EP1136592A2 Method and apparatus for removal of unwanted electroplating deposits |
09/25/2001 | US6294826 Molded electronic component having pre-plated lead terminals and manufacturing process thereof |
09/25/2001 | US6294425 Methods of forming integrated circuit capacitors by electroplating electrodes from seed layers |
09/25/2001 | US6294218 Process for coating a substrate |
09/20/2001 | WO2001069640A2 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens |
09/20/2001 | WO2001068951A1 Electro-plating apparatus and a method of electro-plating |
09/20/2001 | WO2001068950A1 Method for the surface treatment of objects and means for carrying out said method |
09/20/2001 | WO2001068949A1 Electro-plating apparatus and method |
09/20/2001 | WO2001068942A1 Spring steel wire |
09/20/2001 | WO2001068312A2 Brazing sheet product and method of manufacturing an assembly using the brazing sheet product |
09/20/2001 | DE10013298A1 Applying metal layer to surfaces of light metals comprises electrolytically depositing iron from deposition bath containing iron (II) compounds formed during oxidation of iron (II) compounds at anodes |
09/20/2001 | DE10011455A1 Applying metallic conducting pathways as electrodes to a glass channel plate for large surface flat screens comprises roughening the channel plate in the electrode regions of the channels |
09/20/2001 | CA2403122A1 Electro-plating apparatus and method |
09/20/2001 | CA2403116A1 Electro-plating apparatus and a method of electro-plating |
09/19/2001 | EP1133588A2 Stratified composite material for sliding elements and method for the production thereof |
09/19/2001 | CN1314009A Surface-treated steel sheet for battery case, battery case comprising the same, methods for producing them, and battery |
09/18/2001 | US6291083 Multilayer steel plated product with steel member, nickel plating layer, copper plating layer and zinc nickel plating layer |
09/18/2001 | US6291081 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
09/18/2001 | US6290833 Providing electroplating bath including copper sulfate, ammonium sulfate, complexing agenta and ethylene glycol; exposing workpiece surface on which microelectronic devices are to be formed; applying electroplating power to deposit |
09/18/2001 | US6290832 Pre-metallizing with a conductive polymer a material selected from foams, felts and fabrics, wherein pre-metallizing comprising oxidizing, rinsing and drying, depositing wet pahse, polymerization; electroplating metal |
09/13/2001 | WO2001066830A2 Method for applying a metal layer to a light metal surface |
09/13/2001 | WO2001011098A3 Copper deposit process |
09/13/2001 | US20010020583 Reactor vessel having improved cup, anode and conductor assembly |
09/13/2001 | US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |