Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
11/2001
11/14/2001EP0808921B1 Ornamental member
11/13/2001US6316359 Interconnect structure in a semiconductor device and method of formation
11/08/2001WO2001083857A1 Method and device for the electrolytic coating of a metal strip
11/08/2001WO2001083855A1 Textured metal article
11/08/2001WO2001083854A2 Electroplating bath composition and method of using
11/08/2001CA2407660A1 Method and device for the electrolytic coating of a metal strip
11/07/2001EP1152071A1 Copper plating method
11/07/2001EP1152070A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
11/07/2001CN1321121A Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil
11/07/2001CN1321061A Method for surface treatment of copper foil
11/07/2001CN1320960A Interconnection method without lead bosses
11/07/2001CN1320722A Method for making metal-plastic compoiste article
11/06/2001US6312762 Process for production of copper or copper base alloys
11/06/2001US6312580 Electroplating with an acid gold plating solution comprising: soluble alkali metal complex salt of gold an acid electrolyte where an adjusted ph range is 0.1-3.0; eliminates multistage stripping on chromium automobile emblems
11/06/2001US6312579 Bearing having multilayer overlay and method of manufacture
11/01/2001WO2001081659A1 Electrical contacting element made of an elastic material
11/01/2001WO2001081043A1 Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate and layer structure made thereby
11/01/2001US20010036560 Article having a decorative and protective coating
11/01/2001US20010036514 Partial plating system
11/01/2001US20010035355 Patterning photoresist
11/01/2001US20010035346 Apparatus and method for electroplating
11/01/2001US20010035343 Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same
11/01/2001CA2405573A1 Electrical contact element made of an elastic material
10/2001
10/31/2001EP1149936A2 Plating system
10/31/2001EP1148976A1 Method and apparatus for deposition on and polishing of a semiconductor surface
10/31/2001DE10019720A1 Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen Method and apparatus for electrically contacting of sheet material to be treated in electrolytic processes
10/31/2001CN1319685A Equipment and technology for electroplating steel pipe inner wall by using auxiliary anode and spray-plating zinc solution
10/30/2001US6309529 Method for producing sputtering target material
10/30/2001US6309528 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
10/30/2001US6309524 Methods and apparatus for processing the surface of a microelectronic workpiece
10/30/2001CA2236156C Article having a coating
10/25/2001WO2001079592A1 Apparatus and method for electrochemical processing of substrates
10/25/2001WO2001079591A1 Apparatus and method for electrochemical processing of substrates
10/25/2001WO2001007685A3 Method for continuous nickel-plating of an aluminium conductor and corresponding device
10/25/2001US20010032788 Divided housing
10/24/2001EP1148548A2 Method of forming lead-free bump interconnections
10/24/2001EP1148157A1 Process to decorate an article and article decorated by this process
10/24/2001EP0895549A4 Electrochemical fluidized bed coating of powders
10/24/2001CN1318655A Electroplating method
10/23/2001US6306274 Method for making electrodeposition blades
10/18/2001WO2001078154A2 Preparation of cigs-based solar cells using a buffered electrodeposition bath
10/18/2001WO2001077420A1 Laser hole drilling copper foil
10/18/2001WO2001077419A2 Process for the direct metal-plating of a plastic substrate
10/18/2001US20010031375 High porosity three-dimensional structures in chromium based alloys
10/18/2001CA2404946A1 Process for the direct metal-plating of a plastic substrate
10/17/2001CN1317825A Electroplating appts.
10/16/2001US6303181 Providing substrate having non-conductive surface; contacting with conditioning agent comprising cationic substantive conditioner effective to deposit film; contacting with carbon dispersion comprising conductive carbon and binder
10/16/2001US6303014 Electrodeposition of metals in small recesses using modulated electric fields
10/16/2001US6303010 Methods and apparatus for processing the surface of a microelectronic workpiece
10/16/2001US6301784 Method of fabricating plain bearings
10/16/2001CA2135978C Corrosion resistant stainless steel and method of making same
10/11/2001DE10113767A1 Elektrolytisches Plattierungsverfahren und Vorrichtung für eine Leiterbahnplatine Electrolytic plating method and apparatus for a printed wiring board
10/11/2001DE10013736A1 Process for surface hardening of screwdriver blades comprises galvanically chromium plating the blade, sand blasting to roughen the chromium layer, galvanically activating the roughened layer, and galvanically chromium plating the blade
10/10/2001EP1142041A1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths
10/10/2001EP1141443A1 A method of metallizing the surface of a solid polymer substrate and the product obtained
10/10/2001CN1316551A Process for electroplating Cr onto surface of thin steel sheet
10/09/2001US6299932 Lead frame processing method and apparatus
10/09/2001US6299749 Method of fabricating an electrical component
10/04/2001WO2001021294A3 Pattern dependent surface profile evolution of electrochemically deposited metal
10/04/2001US20010027035 Electrical connector
10/04/2001EP1138806A2 Electroplating apparatus having a non-dissolvable anode
10/04/2001EP1138805A2 Tin electolyte
10/03/2001CN1316023A Method and apparatus for copper plating using electroless plating and electroplating
10/03/2001CN1315894A Structure and method for jointing metal members
10/03/2001CN1315591A Forming method of plating chrome on copper layer of printed circuit board
10/03/2001CN1072280C Method for preventing cooling pipe of carbon-steel cooler from corrosion by sea water and apparatus thereof
10/03/2001CN1072047C Element of continuous metal casting ingot mould with copper or copper alloy cooled wall comprising on its external surface metal coating, and method of coating
10/03/2001CA2342954A1 Process for decorating an item, and item decorated using the process
10/02/2001US6297157 Time ramped method for plating of high aspect ratio semiconductor vias and channels
10/02/2001US6297155 Method for forming a copper layer over a semiconductor wafer
10/02/2001US6296951 Laminated chromium plating layers having superior wear resistance and fatigue strength
09/2001
09/27/2001WO2001071780A2 Apparatus and method for electrochemically processing a microelectronic workpiece
09/27/2001WO2001071066A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
09/27/2001US20010023830 Electrolytic plating method and device for a wiring board
09/27/2001US20010023828 Process and installation for coating a surface by electrophoresis
09/27/2001DE10014260A1 Electroplating enhanced by brightening agents, is preceded by cleaning bath containing only the metallic plating addition, which removes disruptive cleaning residues
09/26/2001EP1136592A2 Method and apparatus for removal of unwanted electroplating deposits
09/25/2001US6294826 Molded electronic component having pre-plated lead terminals and manufacturing process thereof
09/25/2001US6294425 Methods of forming integrated circuit capacitors by electroplating electrodes from seed layers
09/25/2001US6294218 Process for coating a substrate
09/20/2001WO2001069640A2 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens
09/20/2001WO2001068951A1 Electro-plating apparatus and a method of electro-plating
09/20/2001WO2001068950A1 Method for the surface treatment of objects and means for carrying out said method
09/20/2001WO2001068949A1 Electro-plating apparatus and method
09/20/2001WO2001068942A1 Spring steel wire
09/20/2001WO2001068312A2 Brazing sheet product and method of manufacturing an assembly using the brazing sheet product
09/20/2001DE10013298A1 Applying metal layer to surfaces of light metals comprises electrolytically depositing iron from deposition bath containing iron (II) compounds formed during oxidation of iron (II) compounds at anodes
09/20/2001DE10011455A1 Applying metallic conducting pathways as electrodes to a glass channel plate for large surface flat screens comprises roughening the channel plate in the electrode regions of the channels
09/20/2001CA2403122A1 Electro-plating apparatus and method
09/20/2001CA2403116A1 Electro-plating apparatus and a method of electro-plating
09/19/2001EP1133588A2 Stratified composite material for sliding elements and method for the production thereof
09/19/2001CN1314009A Surface-treated steel sheet for battery case, battery case comprising the same, methods for producing them, and battery
09/18/2001US6291083 Multilayer steel plated product with steel member, nickel plating layer, copper plating layer and zinc nickel plating layer
09/18/2001US6291081 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
09/18/2001US6290833 Providing electroplating bath including copper sulfate, ammonium sulfate, complexing agenta and ethylene glycol; exposing workpiece surface on which microelectronic devices are to be formed; applying electroplating power to deposit
09/18/2001US6290832 Pre-metallizing with a conductive polymer a material selected from foams, felts and fabrics, wherein pre-metallizing comprising oxidizing, rinsing and drying, depositing wet pahse, polymerization; electroplating metal
09/13/2001WO2001066830A2 Method for applying a metal layer to a light metal surface
09/13/2001WO2001011098A3 Copper deposit process
09/13/2001US20010020583 Reactor vessel having improved cup, anode and conductor assembly
09/13/2001US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures