| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 11/02/2000 | EP1047811A1 Articles having a colored metallic coating with special properties |
| 11/01/2000 | CN2403792Y Apparatus for auxiliary anode spraying zinc liquid electroplating steel conduit inwall |
| 10/31/2000 | US6140234 Method to selectively fill recesses with conductive metal |
| 10/31/2000 | US6139977 Useful in packaging integrated circuit devices. |
| 10/31/2000 | US6139703 Cathode current control system for a wafer electroplating apparatus |
| 10/31/2000 | CA2211870C Apparatus and method for selective coating of metal parts |
| 10/26/2000 | WO2000063465A1 ACTIVE CARBON ELECTRO-DEPOSITED WITH Ag-I SYSTEM HAVING STERILIZING EFFECT |
| 10/26/2000 | DE19918833A1 Non-conductive substrate surfaces, especially polymer resist layer and copper surface regions of circuit boards, are electroplated after precious metal nucleation and contact with an electroless reduction copper bath |
| 10/25/2000 | EP0820351B1 Fluid delivery apparatus and method |
| 10/24/2000 | US6136708 Preventing the diffusion of contaminants by forming a barrier film on a back surface of a semiconductor substrate; significant reduction in production steps |
| 10/24/2000 | US6136107 Surface treated steel sheet for battery containers, a battery container, and a battery produced thereof |
| 10/19/2000 | WO2000061837A1 Workpiece processor having processing chamber with improved processing fluid flow |
| 10/19/2000 | WO2000061498A2 System for electrochemically processing a workpiece |
| 10/19/2000 | WO2000022194A3 Method of, and apparatus for, electro-plating a structure |
| 10/18/2000 | EP1044776A1 Nickel plating of a mould using pulsating current |
| 10/18/2000 | CN1270642A Cathode current control system for a wafer electroplating apparatus |
| 10/17/2000 | US6133061 Method of forming thin zinc oxide film, and method of producing semiconductor element substrate and photovoltaic element using thin zinc oxide film |
| 10/17/2000 | US6132888 Stainless steel wire and producing method thereof |
| 10/17/2000 | US6132887 Heat treatment |
| 10/17/2000 | US6132589 To improve its adhesion to non-dicy prepregs by applying layer of zinc metal and layer of hexavalent chromium oxide |
| 10/17/2000 | US6132586 Electrochemical metal plating of integrated circuit wafers to form multilevel integrated circuit structures |
| 10/17/2000 | US6132584 Process and circuitry for generating current pulses for electrolytic metal deposition |
| 10/12/2000 | WO2000060142A1 Method for applying metallic coatings on articles made of magnesium and alloys thereof |
| 10/12/2000 | WO2000059727A1 Improved gravure printing rollers |
| 10/12/2000 | WO2000059682A1 Method and apparatus for plating and polishing a semiconductor substrate |
| 10/12/2000 | WO2000026443A3 Method and apparatus for electrochemical mechanical deposition |
| 10/12/2000 | WO1999067321A3 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 10/12/2000 | DE19914867A1 Electrochemical writing process, for flat or curved electrically conductive e.g. metallic surfaces, uses flat character segment electrodes individually connected to a switch unit for controlled current supply |
| 10/11/2000 | EP1042541A1 Method for producing abrasive tips for gas turbine blades |
| 10/11/2000 | EP1042540A1 Programmed pulse electroplating process |
| 10/11/2000 | EP1042539A1 Printed circuit manufacturing process using tin-nickel plating |
| 10/11/2000 | EP1042092A1 Component of printed circuit boards |
| 10/11/2000 | EP0840994B1 Process and device for producing through-connected printed circuit boards and multilayered printed circuit boards |
| 10/11/2000 | CN1269848A Electrochemical dissolution of nuclear fuel pins |
| 10/11/2000 | CN1269432A Anodic oxygenation method and operation apparatus thereof |
| 10/10/2000 | US6129995 An overcoating oxide layer comprising iron, nickel and zinc; corrosion resistant protective coatings |
| 10/10/2000 | US6129830 In short time, using deposition bath containing copper ions, compounds that increase electroconductivity of the bath, additives to influence material properties of the copper, and compounds of an electrochemically reversible redox system |
| 10/05/2000 | WO2000029647A3 Stratified composite material for sliding elements and method for the production thereof |
| 10/04/2000 | EP1041178A2 Anodizing method and apparatus for performing the same |
| 10/03/2000 | US6127205 Process for manufacturing a molded electronic component having pre-plated lead terminals |
| 10/03/2000 | US6126808 A reaction chamber holding an electrolyte for surface treating the head of aluminum pistons used in combustion engines |
| 10/03/2000 | US6126761 Process of controlling grain growth in metal films |
| 09/28/2000 | WO2000056953A1 Process for electrolytic coating of a substrate |
| 09/28/2000 | WO2000056453A1 Method for producing a catalyst by means of electrodeposition |
| 09/28/2000 | WO2000056452A1 Method for producing a catalyst |
| 09/28/2000 | WO2000056425A1 Hydrogen-permeable metal membrane and method for producing the same |
| 09/28/2000 | WO2000028114A9 Electrodeposition of catalytic metals using pulsed electric fields |
| 09/28/2000 | DE19912897A1 Katalysator und Verfahren zur Herstellung eines Katalysators Catalyst and process for the preparation of a catalyst |
| 09/28/2000 | DE19912896A1 Verfahren zur Herstellung eines Katalysators A process for the preparation of a catalyst |
| 09/28/2000 | CA2367893A1 Method for producing a catalyst by means of electrodeposition |
| 09/28/2000 | CA2367848A1 Method for producing a catalyst |
| 09/27/2000 | EP1038990A1 Method of reducing elution of lead in lead-containing copper alloy, and city water service fittings made of lead-containing copper alloy |
| 09/27/2000 | EP0656025B2 Solution for coating non conductors with conductive polymers and their metallization process |
| 09/26/2000 | US6123998 Continuously changing composition of ceramic material and metal to form ceramic coated film of ceramic oxides wherein metallic substrate is formed of heat resistant alloy of an element selected from iron, cobalt, nickel |
| 09/26/2000 | US6123984 Method and apparatus for plating a substrate |
| 09/26/2000 | US6123825 Electromigration-resistant copper microstructure and process of making |
| 09/26/2000 | US6123824 Zinc oxide layer is provided with an unevenness at its surface suitable for constituting a light-confining layer of a resultant photo-electricity generating device. |
| 09/26/2000 | US6123815 Plating apparatus |
| 09/26/2000 | US6123788 Copper wire and process for making copper wire |
| 09/20/2000 | EP1036862A1 Zn-Mg electroplated metal sheet and fabrication process thereof |
| 09/20/2000 | EP1036221A1 Electroplating formulation and process for plating iron directly onto aluminum or aluminum alloys |
| 09/20/2000 | CN1267341A Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated |
| 09/19/2000 | US6120669 Bipolar electrochemical connection of materials |
| 09/14/2000 | WO2000020662A9 Submicron metallization using electrochemical deposition |
| 09/14/2000 | DE19911186A1 Hard magnetic layer, useful for electronic memories, is electrodeposited from an electrolyte containing cobalt, optionally nickel, carboxylic acid, sodium hypophosphite and ammonium sulfate |
| 09/12/2000 | US6117703 Process and device for producing a CIS-strip solar cell |
| 09/08/2000 | WO2000052231A1 Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
| 09/05/2000 | US6114051 Method for electroplating high-impact plastics |
| 09/05/2000 | US6113771 Electro deposition chemistry |
| 08/30/2000 | EP1031647A2 Apparatus and method for plating a wafer |
| 08/30/2000 | EP1031165A1 Intergrated manufacturing tool comprising electroplating, chemical-mechanical polishing, clean and dry stations, and method therefor |
| 08/29/2000 | US6110823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method |
| 08/29/2000 | US6110817 Method for improvement of electromigration of copper by carbon doping |
| 08/29/2000 | US6110346 Preventing the plated layer become concave, first start with a low current density, then later increasing the current flow |
| 08/29/2000 | US6110011 Integrated electrodeposition and chemical-mechanical polishing tool |
| 08/24/2000 | WO1999016935A3 Simplified process and apparatus for production of copper foil |
| 08/24/2000 | WO1998049374A3 Device for electrolytic treatment of printed circuit boards and conductive films |
| 08/24/2000 | DE19908755A1 Metal electrodeposition process, especially for plastic and copper surface regions of circuit boards, uses a nickel and-or cobalt reduction plating bath containing a stabilizer to prevent autocatalytic deposition |
| 08/23/2000 | EP1029953A1 Process for surface treatment and for deposition of polyaniline for absorbing light |
| 08/23/2000 | EP1029949A2 Supporting structure |
| 08/23/2000 | EP1029948A2 Using electroplated cu as cold layer for cold/hot deposition |
| 08/23/2000 | EP1029342A1 Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components |
| 08/22/2000 | US6107730 Alloyzation reaction of steel and zinc with only heat in calcinating, baking, sealing and exhausting of gas; prevent the corrosion and the oxidation before a thermal treatment |
| 08/22/2000 | US6106958 Coating provides color of brass to articles such as door knobs, handles, trivets, lampes and other brass articles and also provides abrasion and corrosion protection |
| 08/22/2000 | US6106689 Process for forming zinc oxide film and processes for producing semiconductor device substrate and photo-electricity generating device using the film |
| 08/22/2000 | US6106687 Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate |
| 08/17/2000 | WO2000015877A3 Method and device for producing wear resisting surfaces |
| 08/16/2000 | EP1028437A1 HIGH CORROSION-RESISTANT R-Fe-B-BASE BONDED MAGNET AND METHOD OF MANUFACTURING THE SAME |
| 08/16/2000 | EP1027481A1 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 08/16/2000 | CN1263570A Process for manufacture of high quality very low profile copper foil and copper foil produced thereby |
| 08/15/2000 | US6103086 Method of forming reliable copper interconnects with improved hole filling |
| 08/15/2000 | US6103085 Semiconductor wafers |
| 08/10/2000 | DE19904665A1 Metallization of plastic surfaces used for decorative purposes involves pickling under moderate conditions, treating with metal salt and with sulfide solution and metallizing |
| 08/09/2000 | EP1026287A1 Process for production of copper or copper base alloys |
| 08/09/2000 | EP1026286A2 Method and apparatus for plating substrate with copper |
| 08/09/2000 | EP1025283A1 Cathode current control system for a wafer electroplating apparatus |
| 08/09/2000 | CN1262789A Surface-treated steel sheet for battery case, battery case, and battery manufactured by using case |
| 08/08/2000 | US6099977 Comprising base material of a metal or a metal alloy, a surface coating of tin or a tin alloy, an intermetallic phase, carbon embedded in an outer edge section of the coating, said coating being applied galvanically |
| 08/08/2000 | US6099712 Benefit of reducing the amount of organic additives consumed in the plating process. this is believed to occur because films that otherwise may form on the anode are not disrupted by the flow of plating liquids thereover. |
| 08/08/2000 | US6099711 Process for the electrolytic deposition of metal layers |