Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
08/2000
08/08/2000US6099710 Method of controlling excessive electroforming portion of an oscillating plate
08/08/2000US6099624 Aqueous sulfate-free electroplating bath for producing electrodeposited nickel-phosphorus coatings, comprising a nickel alkanesulfonate such as nickel methanesulfonate, phosphoric acid, phosphorous acid, and hypophosphorous acid
08/03/2000WO2000045625A2 Method for the direct electroplating of through-holes in printed circuit boards
08/03/2000DE19903108A1 Verfahren zur direkten galvanischen Durchkontaktierung von Leiterplatten Method for direct galvanic through-hole plating of printed circuit boards
08/02/2000EP1024212A2 Wear resistant copper or copper base alloy, method of preparing the same and electrical part using the same
08/02/2000EP1023469A1 Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
08/02/2000EP1023373A1 Duroplastic molding materials for conductive mold parts for direct galvanization and a method for the production and use thereof
08/02/2000CN1261632A Selective electrolytic metal chemical/electro plating device and method by using fluid head
07/2000
07/27/2000WO2000044042A1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
07/27/2000DE10003031A1 Plattiertes Stahlprodukt Plated steel product
07/27/2000CA2359473A1 Method for electrolytically forming conductor structures from highly pure copper when producing integrated circuits
07/25/2000US6093291 Electroplating apparatus
07/20/2000WO2000042830A1 Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards
07/20/2000DE19931692A1 Verfahren und Vorrichtung zur Herstellung von mit Dielektrikum beschichteter Kupferfolie, die auf Leiterplatten laminiert wird Method and apparatus for the production of dielectric-coated copper foil is laminated to printed circuit boards
07/19/2000EP1019954A1 Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
07/19/2000EP1019566A1 Electrochemical dissolution of nuclear fuel pins
07/18/2000US6090263 Process for coating an article with a conformable nickel coating
07/18/2000US6090261 Method and apparatus for controlling plating over a face of a substrate
07/18/2000US6090260 While the object to be plated is being dipped in a plating bath and no electroplating is carried out, additional current is supplied so that the object always has cathode potential in the plating bath and no corrosion can occur; batches
07/14/2000CA2270845A1 A color coating method on surface of metal materials
07/13/2000WO2000040784A2 Methods for coating metallic articles
07/13/2000DE19758513C2 Vorrichtung zum selektiven galvanischen Beschichten von elektrischen Kontaktelementen An apparatus for selective electroplating of electrical contact elements
07/13/2000CA2358105A1 Methods for coating metallic articles
07/12/2000EP1017884A2 Electro-plating process
07/12/2000EP1017881A1 Composition and method for priming substrate materials
07/12/2000CN1259589A Article coated with multiple layer coatings
07/11/2000US6086742 Successively electrodepositing a lead- or tin-based binary layer and a molybdenum-based running-layer
07/11/2000US6086731 Composite plating apparatus
07/11/2000US6085804 Apparatus and method for forming leads and removing tin dust from leads
07/06/2000DE19958741A1 Component transport method for circuit boards etc. in electroplating systems uses vibrators positioned on carrier bars near goods frame suspension
07/05/2000EP1017068A2 Process for forming device comprising metallized magnetic substrates
07/05/2000EP1015669A1 Article, method, and apparatus for electrochemical fabrication
07/05/2000EP1015668A1 Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
07/05/2000EP1015666A1 Simplified process and apparatus for production of copper foil
06/2000
06/29/2000WO2000037716A1 Plating apparatus, plating system, method for plating using the same
06/29/2000WO2000037715A1 Bismuth thin film structure and method of construction
06/29/2000WO2000011244A3 Coating for components made of hardened steel or cast iron and method for applying same
06/29/2000WO2000000672A3 Galvanic bath, method for producing structured hard chromium layers and use thereof
06/29/2000DE19906417C1 Passage opening support structure, especially a medical stent, has a gold layer between a special steel substrate and a platinum surface layer to avoid platinum cracking
06/28/2000CN1257941A Coated articles
06/27/2000US6080504 Electrodeposition of catalytic metals using pulsed electric fields
06/27/2000US6080447 Low etch alkaline zincate composition and process for zincating aluminum
06/27/2000US6080291 Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
06/27/2000CA2122562C Inorganic skin film and process for forming the same
06/22/2000WO2000036189A1 DOUBLE-DIP Pd/Sn CROSSLINKER
06/22/2000CA2355260A1 Double-dip pd/sn crosslinker
06/21/2000EP1010778A2 Coated article
06/21/2000EP1010777A2 Article coated with multilayer coating
06/21/2000DE19953318A1 Chromium plated part, especially a hard chromium plated part useful as a shock absorber piston rod or engine piston ring, has compressively stressed crack-free chromium layer
06/20/2000US6077412 Processing chamber for depositing and/or removing material onto/from a semiconductor wafer
06/15/2000DE19857290A1 Verfahren zur direkten Metallisierung der Oberfläche eines Kunststoffgegenstandes A process for direct metallization of the surface of a plastic article
06/14/2000EP1007766A2 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
06/13/2000US6074766 Hard carbon coating-clad base material
06/13/2000US6074544 Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
06/13/2000CA2141533C Method for crown plating a camplate and a metal-plated camplate formed thereby
06/07/2000EP1006218A2 Plated metal part and method of manufacturing same
06/06/2000US6071631 Heat-resistant and anticorrosive lamellar metal-plated steel material with uniform processability and anticorrosiveness
06/06/2000US6071629 Facing adhesion for rustproofing, zinc or zinc alloy layer and organic resin
06/06/2000US6071400 Brushes which touch the structured surfaces to be treated with their electrically conductive and thin fibres. a large number of brushes which are arranged transversely to the direction of transportation
06/06/2000US6071398 Programmed pulse electroplating process
06/06/2000CA2155209C Process for making copper foil
06/01/2000CA2291363A1 Article coated with multilayer coating
05/2000
05/31/2000EP1004689A2 Coated metal wire, wire-reinforced elastomeric article containing the same and method of manufacture
05/31/2000EP1004498A2 Joining structure and method of vehicle panel sheets
05/31/2000DE19854740A1 Iron, especially a steam iron, has a steel sole plate with a hard and scratch resistant electroplated metal layer
05/30/2000US6068938 Zn layer of an average thickness of 0.6 mum or more, or a zn deposition of 0.43 mg/cm2 or more formed on the mg alloy base material.
05/30/2000US6068755 Process for forming zinc oxide film and processes for producing semiconductor device plate and photo-electricity generating device using the film
05/30/2000CA2020638C Continuous electroplating of conductive foams
05/25/2000WO2000030188A1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths
05/25/2000WO2000029647A2 Stratified composite material for sliding elements and method for the production thereof
05/25/2000WO2000029646A1 Process for metallizing a plastic surface
05/25/2000WO2000029227A1 Metal-coated plastic part and method for making same
05/25/2000WO2000029134A1 Fully automatic plating wax removing device and method thereof
05/25/2000DE19853692A1 Zinc-nickel layer application onto a ferrous metal workpiece, especially an alloy cast iron brake saddle, involves workpiece pretreatment adapted to a workpiece parameter, especially surface quality
05/25/2000DE19853293A1 Verfahren zur Herstellung eines innenseitig mit einer Hartchromschicht versehenen Waffenrohres A process for the preparation of a inner side provided with a hard chromium layer gun barrel
05/25/2000DE19852202A1 Batteriehülse aus umgeformtem, kaltgewalztem Blech sowie Verfahren zur Herstellung von Batteriehülsen Battery shell made of formed sheet, cold rolled sheet and method for producing battery shells
05/25/2000CA2351610A1 Fully automatic plating wax removing device and method thereof
05/25/2000CA2350422A1 Process for metallizing a plastic surface
05/25/2000CA2348924A1 Battery sheath made of a formed cold-rolled sheet and method for producing battery sheaths
05/24/2000EP1003230A1 Surface-treated steel plate for battery case, battery case and battery using the case
05/24/2000EP1003008A1 Method for manufacturing a gun barrel with an inner chromium liner
05/18/2000WO2000028115A1 Plating method and apparatus
05/18/2000WO2000028114A1 Electrodeposition of catalytic metals using pulsed electric fields
05/18/2000WO2000027947A1 Liquid crystal composition and liquid crystal displays
05/18/2000DE19852481A1 Schichtverbundwerkstoff für Gleitelemente und Verfahren zu seiner Herstellung Composite multilayer material for sliding elements and process for its preparation
05/17/2000EP1001052A2 Method for metallizing a plastic surface
05/17/2000EP0910489B1 Element of a continuous metal casting ingot mould with a copper or copper alloy cooled wall comprising on its external surface a metal coating, and method of coating
05/17/2000CN2378401Y Electroplating net sprayer
05/17/2000CN1253376A Method for making semi-conductor device
05/16/2000US6063253 Apparatus and method for electroplating a metal onto a substrate
05/11/2000WO2000026444A1 Copper metallization structure and method of construction
05/11/2000WO2000026443A2 Method and apparatus for electrochemical mechanical deposition
05/11/2000WO2000025961A1 Component of printed circuit boards
05/11/2000DE19851278A1 Manufacturing electrically conducting optimally adhering surface regions on injection molded magnesium alloy parts comprises chromating the parts, re metallizing and applying a silicone paste
05/10/2000EP0999584A2 Method for manufacturing semiconductor device
05/10/2000EP0999295A2 Arrangement for the electrogalvanic metal coating of strips
05/10/2000CN1252458A Device for electroplating metal film of strip
05/03/2000EP0997555A1 Process for producing a thin ceramic coating on a metallic substrate
05/03/2000EP0997543A1 Nanostructure alloy anodes, process for their preparation and lithium batteries comprising said anodes
05/03/2000EP0997061A1 Method for metallization of a substrate containing electric non-conductive surface areas