| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 04/11/2001 | EP1091024A1 Method and device for plating substrate |
| 04/11/2001 | EP1090165A2 Layer system for protecting light metals and light metal alloys against corrosion |
| 04/11/2001 | EP1089830A1 Low etch alkaline zincate composition and process for zincating aluminum |
| 04/11/2001 | EP0779941B1 A process for treating aluminium alloys |
| 04/11/2001 | CN1291243A Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 04/11/2001 | CN1290963A Lead frame and its electroplating method |
| 04/11/2001 | CN1064414C Electrolytic copper foil for printed circuit board and its producing method |
| 04/05/2001 | WO2001024257A1 Methods and apparatus for treating seed layer in copper interconnctions |
| 04/05/2001 | WO2001023645A1 Method for electrodeposition of metallic multilayers |
| 04/05/2001 | WO2001007686A8 Article in which a non-conductive substrate is coated with electroplated metal and process for its manufacture |
| 04/05/2001 | WO2000068464A3 Alloy plating |
| 04/05/2001 | CA2382481A1 Method for electrodeposition of metallic multilayers |
| 04/04/2001 | EP1088122A2 Method and apparatus for electroplating |
| 04/04/2001 | EP1088121A2 Method for metal coating of substrates |
| 04/04/2001 | EP1088117A2 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 04/04/2001 | EP1087844A1 Apparatus and method for coating a multilayer article |
| 04/04/2001 | CN1290310A Plating apparatus and method |
| 04/04/2001 | CN1289864A Surface activating process of Ti and Ti alloy for bright electroplating |
| 04/03/2001 | US6210555 Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating |
| 04/03/2001 | US6210554 Supplying plating solution onto plating surface of wafer so solution flows from center of plating surface of wafer toward periphery; generating electric field between wafer and annular anode to obtain non-uniformly distributed coating that |
| 04/03/2001 | US6210537 Forming solution comprising pyrrole monomer and an electron acceptor; evenly applying film of solution onto substrate; photochemically polymerizing portions of film to form electronically conducting polymer; removing solution |
| 03/29/2001 | WO2001021294A2 Pattern dependent surface profile evolution of electrochemically deposited metal |
| 03/29/2001 | DE19944349A1 Pressure injection mold plate with electroplated areas, is mounted for plating on model frame with model penetrating mold- and model frames |
| 03/29/2001 | DE19932524C1 Verfahren und Vorrichtung zur elektrochemischen Behandlung Method and apparatus for electrochemical treatment |
| 03/28/2001 | EP1087648A2 Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
| 03/28/2001 | EP1086807A2 Metal article coated with multilayer surface finish for porosity reduction |
| 03/28/2001 | EP0898659B1 Thin-walled bearings |
| 03/28/2001 | CN1289376A Process for method plating liquid crystalline polymers and compositions related thereto |
| 03/28/2001 | CN1289225A Electro-deposition copper foil through surface-processing, its mfg. method and use thereof |
| 03/22/2001 | WO2001020647A2 Novel chip interconnect and packaging deposition methods and structures |
| 03/22/2001 | WO2001019606A1 Treated copper foil and process for making treated copper foil |
| 03/22/2001 | DE19944146A1 Production of a surface comprises pouring polyurethane or a similar porous plastic into the required mold, closing the pores in its surface with paraffin, applying a conducting lacquer, and metal electroplating |
| 03/22/2001 | DE19938409C1 Anordnung zum gleichmäßigen Umströmen einer Oberfläche einer Probe mit Flüssigkeit und Verwendung der Anordnung Arrangement for uniform flow around a surface of a sample with liquid and use of the arrangement |
| 03/20/2001 | US6203685 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
| 03/20/2001 | US6203684 Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates |
| 03/15/2001 | WO2001018859A1 Magnetic pole fabrication process and device |
| 03/14/2001 | EP1083249A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
| 03/14/2001 | EP1083248A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use therof |
| 03/14/2001 | EP1083245A2 Fluid delivery systems for electronic device manufacture |
| 03/14/2001 | CN1287469A Electro-deposition copper foil through surface processing and its producing method and use |
| 03/13/2001 | US6200692 A nickel layer (0.5-50 mu m thick) plated on an inside wall and having a nickel purity of >99% by weight, and coated with nickel oxide (50-400 ang. thick); storage stability; metal-free; used in producing semiconductors and liquid crystals |
| 03/13/2001 | US6200453 Deposition of single crystal cadmium from cadmium halide salt over a polycrystalline base metal by dissolving the cadmium halide salt in an electrolyte solution of metal halide while controlling the temperature |
| 03/13/2001 | US6200450 Method and apparatus for depositing Ni-Fe-W-P alloys |
| 03/13/2001 | US6199274 Method of making oil scraper piston rings |
| 03/08/2001 | WO2001017320A1 Current carrying structure using voltage switchable dielectric material |
| 03/08/2001 | WO2001016404A1 Method for enhanced selective plating of non-uniform objects by lowering the distribution factor |
| 03/08/2001 | WO2001016402A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 03/07/2001 | EP1081252A1 Selective plating method |
| 03/07/2001 | EP1081251A1 Electrodeposited precious metal finishes having wear resistant particles therein |
| 03/07/2001 | CN2422292Y Terminal connecting belt structure |
| 03/07/2001 | CN1286734A Printed circuit mfg. process using tin-mickel plating |
| 03/07/2001 | CN1286321A Process for plating flexible graphite products with thick silver layer |
| 03/06/2001 | US6197688 Interconnect structure in a semiconductor device and method of formation |
| 03/06/2001 | US6197180 Heat-shrinking non-conductive polymer sheet containing holes onto metal surface; electroplating metal onto metal surface with holes of non-conductive sheet to produce metal microstructures on metal surface |
| 03/06/2001 | US6197169 Apparatus and method for electroplating rotogravure cylinder using ultrasonic energy |
| 03/01/2001 | WO2001014135A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil |
| 03/01/2001 | DE19919709A1 Partiell galvanisierbares Polymerenformteil Partially galvanisierbares polymer molding |
| 02/27/2001 | US6194087 Composite multilayer bearing material |
| 02/27/2001 | US6194086 Nickel and cobalt superalloy substrate; low pressure plasma spraying of abrasives |
| 02/27/2001 | US6193861 Apparatus and method to enhance hole fill in sub-micron plating |
| 02/22/2001 | WO2001013416A1 Method and apparatus for depositing and controlling the texture of a thin film |
| 02/22/2001 | WO2001012882A1 Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement |
| 02/22/2001 | WO2000005747A3 Metallization structures for microelectronic applications and process for forming the structures |
| 02/21/2001 | EP1077484A2 Barrier layer for electroplating processes |
| 02/20/2001 | US6190530 Tank filled with electroplating solution |
| 02/20/2001 | US6190028 Surface-coated, molded resin articles for vehicle lighting equipment |
| 02/20/2001 | CA2176890C Article having a decorative and protective coating simulating brass |
| 02/15/2001 | WO2001011114A1 Method for producing improved cold rolled strip that is capable of being deep drawn or ironed, and cold rolled strip, preferably used for producing cylindrical containers and, in particular, battery containers |
| 02/15/2001 | WO2001011098A2 Copper deposit process |
| 02/15/2001 | DE19937271A1 Verfahren zur Herstellung von tiefzieh- oder abstreckziehfähigem, veredeltem Kaltband, vorzugsweise zur Herstellung von zylindrischen Behältern und insbesondere Batteriebehältern A process for the production of deep-drawing or abstreckziehfähigem, refined cold rolled strip, preferably for the production of cylindrical containers and in particular containers battery |
| 02/15/2001 | CA2381503A1 Copper deposit process |
| 02/14/2001 | EP1076116A1 Components having a partial platinum coating thereon, and preparation thereof |
| 02/14/2001 | CN1284137A Method of reducing elution of lead in lead-containing copper alloy, and ware made of lead-contg copper alloy |
| 02/13/2001 | CA2164055C Article having a decorative and protective coating simulating brass |
| 02/08/2001 | WO2001009410A1 An improved process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
| 02/08/2001 | DE19936036A1 Manufacture of diverse, three-dimensional metal micro-components, or macro-components with uniform, selective local and layered electrolytic deposition, employs insulated, mechanically-scanning orifice plate |
| 02/07/2001 | CN1283144A Component of printed circuit boards |
| 02/07/2001 | CN1061603C Steel plate plated with zine and method for preparation of same |
| 02/06/2001 | US6183888 Process for producing a coating for providing superalloys with highly efficient protection against high-temperature corrosion, a protective coating formed by the process, and articles protected by the coating |
| 02/06/2001 | US6183880 Composite foil of aluminum and copper |
| 02/01/2001 | WO2001007687A1 Plating method and device, and plating system |
| 02/01/2001 | WO2001007686A2 Article in which a non-conductive substrate is coated with electroplated metal and process for its manufacture |
| 02/01/2001 | WO2001007685A2 Method for continuous nickel-plating of an aluminium conductor and corresponding device |
| 01/31/2001 | EP1072176A1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 01/31/2001 | CN1282276A Surface-treated steel sheet having lowered contact resistance and connecting terminal members made by using the same |
| 01/30/2001 | US6180524 Rinsing in oxygen-free ammonia solution; drainage; electroless metal deposition; electroplating |
| 01/30/2001 | US6180263 Hard carbon coating-clad base material |
| 01/30/2001 | US6180174 Process for the production of a coated copper alloy |
| 01/30/2001 | US6179984 Circuit arrangement for supplying pulse current to electrolytic cells connected in parallel; method is used for electroplating of printed circuit boards in vertical dipping systems and in vertical and horizontal feed through systems |
| 01/30/2001 | US6179983 Comprising clamshell for holding substrate, plating bath having wall section, virtual anode having periphery secured to wall section, virtual anode having opening therein, and anode, virtual anode being located between clamshell and anode |
| 01/30/2001 | US6179982 Introducing and reclaiming liquid in a wafer processing chamber |
| 01/30/2001 | US6178623 Composite lightweight copper plated aluminum wire |
| 01/30/2001 | CA2222158C Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
| 01/25/2001 | WO2000071784A3 Brazing sheet product and method of its manufacture |
| 01/25/2001 | WO2000061498A3 System for electrochemically processing a workpiece |
| 01/25/2001 | DE19963385C1 Composite material layer for sliding bearings has a sliding layer made of a tin matrix in which tin-copper particles are embedded |
| 01/25/2001 | DE19934584A1 Production of contacts comprises completely covering the substrate with lacquer and then selectively removing the lacquer layer using a laser |
| 01/24/2001 | EP1070325A1 Device for activating conductivity in porous structures |
| 01/24/2001 | EP1070160A1 Outside part of a cooktop or an oven |
| 01/24/2001 | EP1070159A1 Electrodeposition of metals in small recesses using modulated electric fields |