| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 07/11/2001 | EP1114207A1 Pellistor |
| 07/11/2001 | EP0832448B1 Method of manufacturing passive elements using conductive polypyrrole formulations |
| 07/10/2001 | US6259035 Chip card |
| 07/10/2001 | US6258415 Immersion in zincate solution; electroless nickel plating;electrodeposition iron |
| 07/10/2001 | US6258242 Process for surface preparation and polyaniline deposition for the absorption of light |
| 07/10/2001 | US6258241 Process for electroplating metals |
| 07/10/2001 | US6258239 Depositing electrocatalyst by electrochemical deposition on porous, electrically conductive substrate having ion-conducting polymer film |
| 07/10/2001 | US6258235 Process and installation for coating a surface by electrophoresis |
| 07/10/2001 | US6258226 Device for preventing plating of material in surface openings of turbine airfoils |
| 07/10/2001 | US6258220 Electro-chemical deposition system |
| 07/05/2001 | WO2001048267A1 Sliding member |
| 07/05/2001 | US20010006745 Bipolar collector for fuel cell |
| 07/05/2001 | US20010006151 Providing a base foam having a conductive surface, nickel plating the base foam in an electroplating bath, removing the base foam |
| 07/04/2001 | EP1113180A2 Laminated structure for sliding bearing |
| 07/04/2001 | EP1112125A2 Metallization structures for microelectronic applications and process for forming the structures |
| 07/04/2001 | CN1302235A Low etch alkaline zincate composition and process for zincating aluminum |
| 07/04/2001 | CN1068069C zinc plated steel plate with good anti-grainy defect and its producing method |
| 07/03/2001 | US6254759 Method and apparatus for anodizing objects |
| 07/03/2001 | US6254756 Preparation of components having a partial platinum coating thereon |
| 07/03/2001 | US6254755 Electroplating process for oldham ring and scroll member type compressor comprising the same |
| 06/28/2001 | WO2000003072A9 Method and apparatus for copper plating using electroless plating and electroplating |
| 06/27/2001 | EP1111697A1 Surface-treated steel sheet for battery case, battery case comprising the same, methods for producing them, and battery |
| 06/27/2001 | EP1111096A2 Seed layer repair method |
| 06/27/2001 | EP1111091A1 Method of forming an active-element containing aluminide as stand alone coating and as bond coat and coated article |
| 06/27/2001 | EP1110262A1 Bipolar collector for fuel cell |
| 06/27/2001 | EP0876519B1 Apparatus and method for electroplating a metal onto a substrate |
| 06/27/2001 | CN1300883A Application and technology for pulsive electroplating |
| 06/26/2001 | US6251234 Electroplating machine |
| 06/21/2001 | WO2001045475A1 Surface-treated copper foil and method for manufacturing the surface-treated copper foil |
| 06/21/2001 | DE19960606A1 Process for improving the corrosion resistance of steel objects comprises galvanizing the objects, coating with a chromium and then a chromate layer, treating with a reducing agent and applying a polymer layer to the surfaces |
| 06/20/2001 | EP1108804A2 Process and apparatus for forming zinc oxide film, and process and apparatus for producing photovoltaic device |
| 06/13/2001 | EP1105245A1 Bonding of dissimilar metals |
| 06/13/2001 | EP0882145B1 Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method |
| 06/13/2001 | CN1067120C Copper foil used for printed circuit |
| 06/12/2001 | US6246247 Probe card assembly and kit, and methods of using same |
| 06/12/2001 | US6245676 Method of electroplating copper interconnects |
| 06/12/2001 | US6245463 Core body for electrode base of secondary cell, process for manufacturing the core body, electrode base of secondary cell, process for manufacturing the electrode base, and electrode and battery using them |
| 06/12/2001 | US6245445 Rough electrical contact surface |
| 06/05/2001 | US6241869 Apparatus and method for electroplating |
| 06/05/2001 | US6241860 Electroplating machine |
| 06/05/2001 | US6240934 Method and device for treating holes or recesses extending into workpieces with liquid treatment media |
| 05/31/2001 | DE10054461A1 Mehrschichtgleitlager Multilayer plain bearings |
| 05/30/2001 | EP1103639A2 Plating apparatus and method |
| 05/30/2001 | EP0883699B1 Method and devices for the electrolytic formation of a deposit on an assembly of selected electrodes |
| 05/29/2001 | US6238540 Forming circuit by immersion portion of surface in electrolytes |
| 05/29/2001 | US6238529 Device for electrolytic treatment of printed circuit boards and conductive films |
| 05/24/2001 | US20010001436 Process for applying protectiive and decorative coating on an article |
| 05/23/2001 | EP1100983A1 Reactor vessel having improved cup, anode and conductor assembly |
| 05/23/2001 | EP0672334B1 Process for production of printed circuit boards and use thereby |
| 05/23/2001 | CN1296375A Method for filling through hole |
| 05/22/2001 | US6235182 Solution for pretreatment of electrically non-conductive surfaces, and method of coating the surfaces with solid material particles |
| 05/17/2001 | WO2001034881A2 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 05/17/2001 | US20010001192 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
| 05/16/2001 | EP1099780A2 Surface treating agent |
| 05/16/2001 | EP1099012A1 Method and apparatus for copper plating using electroless plating and electroplating |
| 05/16/2001 | EP1099011A1 Method for producing a nickel foam and a nickel foam thus obtainable |
| 05/16/2001 | CN1295631A Articles having colored metallic coating with special properties |
| 05/16/2001 | CN1295426A Copper foil for printed circuit and its manufacture |
| 05/15/2001 | US6231728 Electroplating apparatus |
| 05/15/2001 | US6231619 Electroplating process |
| 05/15/2001 | CA2110281C Surface treated steel sheet reduced in plating defects and production thereof |
| 05/10/2001 | WO2001032963A1 Stainproof capable of protecting copper foil |
| 05/10/2001 | WO2001032951A2 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates |
| 05/10/2001 | WO2001032362A1 Method and apparatus for deposition on and polishing of a semiconductor surface |
| 05/10/2001 | US20010000891 Method of plating semiconductor wafer and plated semiconductor wafer |
| 05/10/2001 | DE19951325A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitenden Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens Method and apparatus for electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of electrically insulating foil material, as well as applications of the method |
| 05/09/2001 | EP1097261A2 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 05/09/2001 | EP0839215B1 Roll forming structural steel profiles with galvanised coating |
| 05/08/2001 | US6228232 Reactor vessel having improved cup anode and conductor assembly |
| 05/03/2001 | WO2001031094A1 Masking techniques for metal plating |
| 05/03/2001 | WO2001031093A1 Electroplating formulation and process for plating iron onto aluminum/aluminum alloys |
| 05/03/2001 | DE19951324A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens Method and apparatus for electrolytic treatment of electrically conductive surfaces of mutually isolated sheet and film material properties as well as application of the method |
| 05/02/2001 | CN1293719A Apparatus and method for electrolytically depositing copper on semiconductor workpiece |
| 05/02/2001 | CN1293264A Process for alloying surface of low-carbon steel |
| 05/01/2001 | US6224991 Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process |
| 05/01/2001 | US6224737 Immersing semiconductor into electroplating solution containing predetermined concentration of brighteners and levelers |
| 04/26/2001 | WO2001029878A2 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
| 04/26/2001 | WO2001029290A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 04/26/2001 | WO2001029289A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 04/26/2001 | WO2001028726A1 Solder coating material and production method therefor |
| 04/26/2001 | DE19952094C1 Removing galvanic electrolyte residues from galvanically reinforced fiber structures comprises suctioning the residues from the structures, subjecting to a high pressure |
| 04/26/2001 | DE19949549A1 Elektrolytisch beschichtetes Kaltband, vorzugsweise zur Verwendung für die Herstellung von Batteriehülsen sowie Verfahren zur Beschichtung desselben Electroplated cold-rolled strip, preferably of the same for use in the manufacture of battery sleeve as well as methods for coating |
| 04/26/2001 | CA2384249A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 04/26/2001 | CA2384244A1 Method and device for the electrolytic treatment of electrolytically conducting structures which are insulated from each other |
| 04/25/2001 | CN1292834A Electrolytic copper foil having modified shiny side |
| 04/24/2001 | US6221231 Multilayer coating with metal or metal alloy on surface of article |
| 04/24/2001 | US6221230 Conductive base, exposure of surface, plating fluids with flow and applying voltage |
| 04/24/2001 | CA2041870C Process for electrodepositing a metallic coating of a nickel-cobalt alloy on an object and electrolyte solution used therein |
| 04/19/2001 | WO2001027356A1 Method for electrochemically metallising an insulating substrate |
| 04/19/2001 | WO2001027355A1 Method for producing an electrolytically coated cold rolled strip, preferably for use in the production of battery sheaths, and battery sheath produced according to said method |
| 04/19/2001 | CA2389376A1 Method for producing an electrolytically coated cold rolled strip, preferably for use in the production of battery sheaths, and battery sheath produced according to said method |
| 04/18/2001 | EP1092790A2 Electroplating of copper from alkanesulfonate electrolytes |
| 04/18/2001 | EP1092338A1 Assembly of an electronic component with spring packaging |
| 04/17/2001 | US6218031 Method of forming an anticorrosive film for contacts for electronic parts |
| 04/17/2001 | US6217787 The printed circuit board, together with an electrode, is placed in an electrolytic liquid, voltages of different potential are applied to circuit board and the electrode, and electroconductive material is removed from the circuit board |
| 04/17/2001 | US6217736 Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment |
| 04/17/2001 | US6217735 Applying megasonic energy to transducer to create transverse ridge of electrolyte, orienting substrate horizontally and face down so transverse ridge contacts face of substrate, applying plating current between anode and moving substrate |
| 04/17/2001 | CA2025337C Process for directly metallizing circuit boards |
| 04/14/2001 | CA2322726A1 Electroplating of copper from alkanesulfonate electrolytes |
| 04/12/2001 | WO2000022193A3 Electrodeposition of metals in small recesses using modulated electric fields |