| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 05/08/2002 | CN1348224A Indium plating method for copper nail as negative pole current collector of mercury-free alkali Zn-Mn battery |
| 05/08/2002 | CN1084397C Electroplating process for metal surface of bicycle |
| 05/08/2002 | CN1084307C Glass forming mold and its producing method, and application in cathode ray tube |
| 05/07/2002 | US6383661 Method of manufacturing an aluminum product |
| 05/02/2002 | US20020050812 Tri-range power supply system |
| 05/02/2002 | US20020050628 Metallization structures for microelectronic applications and process for forming the structures |
| 05/02/2002 | US20020050459 Forming insulating film above substrate, forming a to be filled region of interconnecting groove and hole in film, forming conductive film containing catalyst which accelerates electroless plating, forming second and third conductive films |
| 05/02/2002 | US20020050458 Production of gas separators for use in fuel cells and equipment used therefor |
| 05/02/2002 | EP1201790A1 Seed layer |
| 05/02/2002 | EP1200968A1 Aqueous carbon composition and method for coating a non conductive substrate |
| 05/02/2002 | EP1200647A1 Method for producing improved cold rolled strip that is capable of being deep drawn or ironed, and cold rolled strip, preferably used for producing cylindrical containers and, in particular, battery containers |
| 05/02/2002 | EP1200646A2 Alloy plating |
| 05/02/2002 | EP1007766B1 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
| 05/02/2002 | EP0966557B1 Circuitry and method for an electroplating plant or etching plant pulse power supply |
| 04/30/2002 | US6379818 Brazing sheet product and method of its manufacture |
| 04/30/2002 | US6379661 Pharmaceutical compositions comprising pluripotent granulocyte colony-stimulating factor |
| 04/25/2002 | WO2002033153A2 Copper bath and method of depositing a matt copper coating |
| 04/25/2002 | WO2002033152A1 A reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly |
| 04/25/2002 | WO2002033150A2 Electrochemical processing power device |
| 04/25/2002 | US20020048631 Using polyvinylphenols substituted with alkoxymethyl groups and with acid-unstabilizing groups; acid generator; carboxymethyl-substituted aromatic compound |
| 04/25/2002 | US20020046953 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 04/25/2002 | US20020046951 Electrode with an electrode chamber for receiving electrolyte and an article forming the second electrode disposed inwardly and spaced from the first electrode for electrolyte passage between |
| 04/25/2002 | US20020046787 Method for producing a thin-nickel alloy film |
| 04/25/2002 | CA2419595A1 Copper bath and method of depositing a matt copper coating |
| 04/24/2002 | EP1199384A2 Plating Bath |
| 04/24/2002 | EP1199383A2 Seed layer repair bath |
| 04/24/2002 | EP1198625A2 Brazing sheet product and method of its manufacture |
| 04/24/2002 | EP1198624A1 Process for electroplating a work piece coated with an electrically conducting polymer |
| 04/24/2002 | CN1083497C Nickel-ceramic compound plating technology for aluminium alloy cylinder inner wall |
| 04/23/2002 | US6376374 Process and manufacturing tool architecture for use in the manufacturing of one or more protected metallization structures on a workpiece |
| 04/23/2002 | US6375823 Plating method and plating apparatus |
| 04/23/2002 | US6375731 Cationic conditioning agent, binder or an anionic dispersant that improve the adhesion of carbon particles and coverage, printed circuit board |
| 04/23/2002 | CA2193439C Coated article |
| 04/18/2002 | WO2002031231A1 Semiconductor production device and production method for semiconductor device |
| 04/18/2002 | US20020043468 Source of metal ions, an electrolyte and one or more branched suppressor compounds comprising branched polymers, dendrimers or star polymers |
| 04/18/2002 | US20020043467 Electrolyte |
| 04/17/2002 | EP1198001A2 Method of testing and mounting devices using a resilient contact structure |
| 04/17/2002 | EP1197587A2 Seed layer repair and electroplating bath |
| 04/17/2002 | EP1197586A2 Electrolyte |
| 04/17/2002 | CN1083234C Through-connected printed circuit board or process for producing multilayered printed circuit board |
| 04/16/2002 | US6373683 Electronic parts |
| 04/16/2002 | US6372116 Adhesion, uniformity; supersonic waves. |
| 04/16/2002 | US6372113 Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same |
| 04/11/2002 | WO2001091163A3 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 04/11/2002 | US20020040852 Stabilization with complex |
| 04/11/2002 | US20020040849 Cathode cartridge and anode cartridge of testing device for electroplating |
| 04/10/2002 | EP1195454A2 Cathode cartridge and anode cartridge of testing device for electroplating |
| 04/10/2002 | EP1194613A1 Workpiece processor having processing chamber with improved processing fluid flow |
| 04/10/2002 | EP1194297A1 Coating method and products obtained by same |
| 04/10/2002 | CN1344334A Process for electrolytic coating of substrate |
| 04/10/2002 | CN1082571C Method and equipment for processing procision parts using electroplating solution |
| 04/09/2002 | US6368966 Addition of zinc to copper in very low quantities assists in solving the diffusion and self-passivation problems, |
| 04/09/2002 | US6368484 Lining workpiece, then adding and selectively removing a seed layer before electroplating; reduces waste, cost, and time |
| 04/09/2002 | US6368482 Plating processes utilizing high intensity acoustic beams |
| 04/09/2002 | US6368475 Apparatus for electrochemically processing a microelectronic workpiece |
| 04/09/2002 | US6368467 Electro-plating plasma arc deposition process |
| 04/04/2002 | WO2002027074A1 Method for selectively metallizing dielectric materials |
| 04/04/2002 | US20020038764 Using pulsation reverse current |
| 04/04/2002 | DE10045991A1 Ternäre Zinn-Zink-Legierungen, galvanische Bäder und galvanisches Verfahren zur Erzeugung von ternären Zinn-Zink-Legierungsschichten Ternary tin-zinc alloy electroplating baths and galvanic method for generating ternary tin-zinc alloy layers |
| 04/04/2002 | DE10044209A1 Verfahren und Vorrichtung zur Behandlung von Gegenständen, besonders Leiterplatten Method and apparatus for treating objects, particularly printed circuit boards |
| 04/03/2002 | EP1193330A2 Plating apparatus and plating method for substrate |
| 04/03/2002 | EP1192298A2 System for electrochemically processing a workpiece |
| 04/02/2002 | US6365027 Preirradiation with pulsed laser |
| 03/28/2002 | WO2002024444A1 Copper foil for high-density ultrafine wiring board |
| 03/28/2002 | WO2001069640A3 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens |
| 03/28/2002 | US20020037425 Brazing sheet product and method of its manufacture |
| 03/28/2002 | US20020036146 Electrodepositing solution for low-potential electrodeposition and electrodeposition method using the same. |
| 03/28/2002 | US20020036145 Copper; an acid selected from sulfuric, methanesulfonic, amidosulfuric, aminoacetic, or fluoboric; a halogen; an accelerating agent, a suppressing agent, or an accelerating-suppressing agent |
| 03/28/2002 | DE10134961A1 Coating substrate surface with metal or alloy using electrolyte solution, e.g. for galvanizing wafer, involves applying stabilizer to substrate surface to maintain metal or alloy in electrolyte solution |
| 03/28/2002 | DE10042228A1 Verfahren zur Beschichtung einer Vielzahl gleicher Grundkörper und Verwendung des Verfahrens A process for coating a plurality of identical basic body and use of the method |
| 03/27/2002 | EP1191551A2 Resistor component with multiple layers of resistive material |
| 03/27/2002 | EP1191129A2 Metal plating method |
| 03/27/2002 | EP1191128A2 Plating method and plating apparatus |
| 03/27/2002 | EP1191127A1 Process for selective metallization of dielectric materials |
| 03/27/2002 | EP1189678A1 Hydrogen-permeable metal membrane and method for producing the same |
| 03/27/2002 | CN1342220A Electrodeposition of metals in small recesses using modulated electric fields |
| 03/26/2002 | US6361673 Electroforming cell |
| 03/26/2002 | US6361627 Process of controlling grain growth in metal films |
| 03/26/2002 | US6360437 Electrical contact having surface coating layer with irregular surface due to hard particles dispersed in the surface coating layer |
| 03/21/2002 | WO2002022915A2 Removable modular cell for electro-chemical plating |
| 03/21/2002 | WO2002022913A2 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
| 03/21/2002 | WO2001066830A3 Method for applying a metal layer to a light metal surface |
| 03/21/2002 | US20020035050 For pretreatment of aluminum prior to electroplating, to remove smut that results from the etching step of the aluminum pretreatment |
| 03/21/2002 | US20020034890 Movable terminal, coaxial connector, and communication apparatus |
| 03/21/2002 | US20020033342 Forming chip connectors; electrolytic cells |
| 03/21/2002 | US20020033341 Immersion in electrolytic cell |
| 03/21/2002 | US20020033339 Uniform thickness |
| 03/20/2002 | EP1115912B1 Device for partial electrochemical treatment of bar-shaped objects |
| 03/19/2002 | US6358392 Bismuth thin films structure and method of construction |
| 03/19/2002 | US6358390 Obtaining a surface charge on ceramic materiall depositing an electroconductive material on surface of ceramic material; activating electroconductive material; electrolytically plating metal on surface of electroconductive material |
| 03/19/2002 | US6357917 Thin-walled bearings |
| 03/14/2002 | WO2002020876A2 Segmenting of processing system into wet and dry areas |
| 03/14/2002 | US20020032499 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 03/14/2002 | US20020031684 Lead-free; copper alloy |
| 03/14/2002 | US20020029961 Electro-chemical deposition system |
| 03/13/2002 | EP1187515A2 Process and apparatus for treating objects, especially circuit boards |
| 03/13/2002 | EP1186048A1 Chip and method for fitting out a chip comprising a plurality of electrodes |
| 03/13/2002 | CN1340288A Surface-treated copper foil and its preparing method |
| 03/13/2002 | CN1339822A Base for producing semiconductor device by using three element alloy |
| 03/13/2002 | CN1339819A Lead wire frame and its producing method |