| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 05/02/2000 | US6056864 Electrolytically reducing thickness; semiconductors |
| 05/02/2000 | US6056507 Article with brazed end plate within an open body end |
| 04/27/2000 | DE19848590A1 Coating process for machinery smooth metallic surface uses an electrolyte comprising a fullerene and/or a fluorine or organofluorine compound |
| 04/25/2000 | US6054225 Piston ring with a nitrided layer and composite chromium plating film over the nitrided layer in outer circumferential surface; plating film has network of cracks with spherical hard particles of given size and dispersion ratio in cracks |
| 04/25/2000 | CA2159268C Alkaline zinc and zinc alloy electroplating baths and processes |
| 04/25/2000 | CA2098273C Coated steel sheet and manufacturing process |
| 04/20/2000 | WO2000022194A2 Method of, and apparatus for, electro-plating a structure |
| 04/20/2000 | WO2000022193A2 Electrodeposition of metals in small recesses using modulated electric fields |
| 04/20/2000 | CA2314109A1 Electrodeposition of metals in small recesses using modulated electric fields |
| 04/13/2000 | WO2000020662A1 Submicron metallization using electrochemical deposition |
| 04/13/2000 | WO2000020656A1 A method of metallizing the surface of a solid polymer substrate and the product obtained |
| 04/13/2000 | WO2000019936A1 Method for producing prosthetic moulded parts for dental use and prosthetic moulded part |
| 04/13/2000 | CA2345636A1 Method for producing prosthetic moulded parts for dental use and prosthetic moulded part |
| 04/12/2000 | EP0992616A2 Apparatus for treating objects, especially electroplating apparatus for printed circuit boards |
| 04/12/2000 | EP0992062A2 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 04/11/2000 | US6048445 Metal seed layer is then deposited over a photoresist layer utilizing a directional deposition technique. a portion of the metal seed layer is then removed. a metal plating is then formed on the metal seed layer |
| 04/06/2000 | WO1999060189A3 Method for metal coating of substrates |
| 04/06/2000 | WO1999054920A3 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 04/06/2000 | DE19845506A1 Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil Process for the preparation of prosthetic moldings for the dental field and Prosthetic molding |
| 04/05/2000 | EP0990423A1 Method of manufacturing prosthetic elements for the dental field and prosthetic element |
| 04/05/2000 | CN1249541A Surficially roughened foam nickel and its preparing process |
| 04/05/2000 | CN1249366A Pd-Ni alloy and rare earth-Pd-Ni alloy plating materials for plating electric brush |
| 04/05/2000 | CN1249364A Technology and material for plating electric brush of commutator of special miniature motor with palladium |
| 04/04/2000 | US6045874 Fluid delivery method |
| 04/04/2000 | CA2021318C Method of forming fine patterns |
| 03/30/2000 | WO2000017421A1 Electric field directed construction of diodes using free-standing three-dimensional components |
| 03/30/2000 | DE19843738A1 Surface activation of group IVb, Vb and VIb metals, especially nickel-titanium shape memory elements for micro-systems, comprises two-stage pickling in hydrofluoric acid-free solutions prior to metal coating |
| 03/30/2000 | DE19842284A1 Verfahren und Vorrichtung zur Herstellung verschleißfester Oberflächen Method and apparatus for producing wear-resistant surfaces |
| 03/29/2000 | EP0989209A2 Electroplating apparatus |
| 03/29/2000 | EP0583426B2 Improved process for preparing a nonconductive substrate for electroplating |
| 03/28/2000 | US6042952 Extremely-thin steel sheets and method of producing the same |
| 03/28/2000 | US6042891 Roll forming structural steel profiles with galvanised coating |
| 03/28/2000 | US6042712 Apparatus for controlling plating over a face of a substrate |
| 03/28/2000 | US6042711 Metal foil with improved peel strength and method for making said foil |
| 03/23/2000 | WO2000016597A1 Printed wiring board and its manufacturing method |
| 03/23/2000 | WO2000015878A1 Zinc coated steel plates coated with a pre-lubricating hydroxysulphate layer and methods for obtaining same |
| 03/23/2000 | WO2000015877A2 Method and device for producing wear resisting surfaces |
| 03/23/2000 | WO2000015876A1 Metal material |
| 03/23/2000 | WO1999064647A9 Method and apparatus for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipolar electrode assembly |
| 03/22/2000 | EP0987931A2 Composite foil of aluminum and copper |
| 03/22/2000 | EP0986818A1 Medicinal, radioactive ruthenium radiation sources with high dosage rate and method for producing the same |
| 03/22/2000 | EP0934158A4 Multiple layered article having a bright copper layer |
| 03/22/2000 | CN1050730C Method of manufacturing printed circuit board |
| 03/21/2000 | US6040067 Low coefficient of friction and high resistance to abrasion and suitable fo connectors, charging-sockets of electric automobiles |
| 03/21/2000 | US6039860 Method for chromium plating titanium alloy |
| 03/21/2000 | US6039858 Plating process for x-ray mask fabrication |
| 03/16/2000 | WO2000014307A1 Pellistor |
| 03/16/2000 | CA2341033A1 Pellistor |
| 03/15/2000 | EP0862665B1 Process for the electrolytic deposition of metal layers |
| 03/15/2000 | EP0791084B1 Arrangement and method for electrophoretic enamelling by the 2-coat 1-bake method |
| 03/15/2000 | CN2368857Y Electrolyzed gradient functional membrane for increasing service life of die |
| 03/15/2000 | CN1247239A High speed electroplating method and appts. thereof |
| 03/14/2000 | US6036837 Simultaneously plating ends of large numbers of elongated electrodes before soldering, efficiency, materials handling, times |
| 03/14/2000 | US6036835 Exposing copper underlying the electroconductive polymer by removing polymer with mixture of hydrogen peroxide, sulfuric and carboxylic acids before electroplating through holes connecting metal layers of a printed circuit board |
| 03/14/2000 | US6036834 Selective electroplating of supported electrodes, then charging yields miniaturized biosensors |
| 03/14/2000 | US6036833 Plating with periodic reverse pulses and a sulfonated naphthalene additive in bath containing nickel or cobalt chlorides and/or sulfates yields platings free of internal stress |
| 03/09/2000 | WO2000013175A1 Method of forming plating film and upper magnetic pole of induction write head |
| 03/09/2000 | DE19937553A1 High speed coating of components involves delivery of a predetermined amount of electric current into a coating cell via a programmable rectifier reserved exclusively for this cell |
| 03/07/2000 | US6033790 Protective coating having improved acid resistance comprising: nickel layer; layer comprised of zirconium, titanium or zirconium-titanium alloy; sandwich layer |
| 03/07/2000 | US6033540 Plating apparatus for plating a wafer |
| 03/07/2000 | US6032356 Wafer-level test and burn-in, and semiconductor process |
| 03/02/2000 | WO2000011245A2 Device for partial electrochemical treatment of bar-shaped objects |
| 03/02/2000 | WO2000011244A2 Coating for components made of hardened steel or cast iron and method for applying same |
| 03/02/2000 | WO1999061182A3 Layer system for protecting light metals and light metal alloys against corrosion |
| 02/29/2000 | US6030512 Device for forming bumps by metal plating |
| 02/29/2000 | US6029344 Composite interconnection element for microelectronic components, and method of making same |
| 02/24/2000 | DE19837431A1 Hardened steel or cast iron is electroplated with a zinc-cobalt or zinc-nickel alloy layer from an acidic bath and then a zinc-nickel alloy layer from an alkaline bath, especially for corrosion protection of automobile components |
| 02/24/2000 | DE19829481A1 Production of metal coated optical fiber by application of an electrically conductive coating to fiber surface and subsequent precipitation of required metal onto coating in galvanic bath |
| 02/23/2000 | EP0922303B1 Process and device for producing a cis-strip solar cell |
| 02/22/2000 | US6027862 Electroless deposition of first silver layer followed by electrodeposition of second silver layer from cyanide-free bath, heat treating silver layer at least after depositing first layer |
| 02/22/2000 | US6027817 Plated molded article and process for producing a plated molded article |
| 02/22/2000 | US6027631 Shields are disposed in the electroplating apparatus to selectively alter the electric field characteristics between the anode and the cathode to adjust or control the electrodepositin rate at selected areas of plating surface |
| 02/22/2000 | US6027630 Method for electrochemical fabrication |
| 02/16/2000 | CN1244460A Composite foil of aluminium and copper |
| 02/15/2000 | US6025205 Apparatus and methods of forming preferred orientation-controlled platinum films using nitrogen |
| 02/10/2000 | WO2000006806A2 Device for the electrodeposition and removal of metal |
| 02/10/2000 | WO1999066106A3 Method and apparatus for electroplating |
| 02/10/2000 | DE19835332A1 Installation for treating articles, in particular, for galvanizing circuit boards comprises additional current supply to the articles undergoing treatment by means of at least one additional contact |
| 02/09/2000 | EP0978575A1 Process and device for removing dendrites |
| 02/09/2000 | EP0978224A2 Device for electrolytic treatment of plate-shaped articles and method for electronic shielding of edge areas of articles during electrolytic treatment |
| 02/09/2000 | EP0788728B1 Process for coating electrically non-conducting surfaces with connected metal structures |
| 02/08/2000 | US6022631 Nickelled steel sheet proofed against tight adhesion during annealing and process for production thereof |
| 02/08/2000 | US6022468 Electrolytic hardening process |
| 02/08/2000 | US6022466 Internally connecting first and second copper features; depositng etch-resist; masking second copper features and exposing region of first copper features; etching copper; removing etch-resist; plating gold on copper |
| 02/03/2000 | WO2000005775A1 Bipolar collector for fuel cell |
| 02/03/2000 | WO2000005747A2 Metallization structures for microelectronic applications and process for forming the structures |
| 02/03/2000 | WO2000005432A1 Method of forming metal film, and method of forming electrode |
| 02/03/2000 | DE19834759A1 Verfahren und Vorrichtung zum Entfernen von Dendriten Method and apparatus for removing dendrites |
| 02/03/2000 | CA2337319A1 Bipolar collector for fuel cell |
| 02/02/2000 | EP0975824A1 A method for electroplating with a refractory metal |
| 02/01/2000 | US6019883 Process for producing a deposit on a removable support |
| 02/01/2000 | CA2203087C Process for producing porous iron metal body |
| 02/01/2000 | CA2162230C Passivate for tungsten alloy electroplating |
| 01/26/2000 | EP0974686A2 Electroplating process for oldham ring and scroll member type compressor comprising the same |
| 01/26/2000 | EP0974685A1 Metal foil with improved bonding to substrates and method for making said foil |
| 01/26/2000 | EP0815292B1 Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials |
| 01/25/2000 | US6017967 Forming a stable aqueous dispersion of a metal sulfide with a dispersant and a stabilizer having at least three alkylene oxide groups in a chain and a hydrophilic--lipophilic balance; providing a uniform metal coatings over substrate |
| 01/25/2000 | US6017438 Method for producing circuit substrate having bump contact point and jet stream type plating apparatus used therefor |
| 01/25/2000 | US6017437 Process chamber and method for depositing and/or removing material on a substrate |
| 01/25/2000 | US6017427 Apparatus for testing high speed electroplating |