Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
07/2003
07/31/2003US20030142409 Method of manufacturing micro-lens array, electrolyte and manufacturing apparatus used therefor
07/31/2003US20030141195 Zinc, or alloy thereof, matte finishing; automobile protective coating
07/31/2003US20030141193 Sintered wet electrolyte high voltage capacitors; insertable medical devices
07/31/2003US20030141192 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied
07/31/2003US20030141185 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
07/30/2003EP1331088A1 Copper foil for high-density ultrafine wiring board
07/30/2003CN1433572A Novel chip interconnect and packaging deposition methods and structures
07/30/2003CN1432661A Metal layer forming process and laminated metal foil-based product
07/30/2003CN1116706C Process for production of surficially roughened foam nickel
07/30/2003CN1116446C Process for alloying surface of low carbon steel
07/29/2003US6600629 Thin film magnetic head having gap layer made of nip and method of manufacturing the same
07/29/2003US6599834 Process of manufacturing a semiconductor device with an electroplated wiring layer
07/29/2003US6599412 In-situ cleaning processes for semiconductor electroplating electrodes
07/29/2003US6599411 Method of electroplating a nickel-iron alloy film with a graduated composition
07/29/2003US6599402 Electro-chemical deposition cell for face-up processing of single semiconductor substrates
07/24/2003WO2003060959A2 Method for applying metal features onto barrier layers using electrochemical deposition
07/24/2003WO2003060201A1 System and method for items to be electrochemically treated
07/24/2003WO2003059531A2 Method for coating a substrate having holes
07/24/2003US20030139036 Semiconductor device and method for fabricating the same
07/24/2003US20030136683 Method for electroplating a body-centered cubic nickel-iron alloy thin film with a high saturation flux density
07/24/2003US20030136547 Heat transfer surface with a microstructure of projections galvanized onto it
07/23/2003EP1330146A2 Via filling method
07/23/2003CN1432072A Method for producing three-dimensional, selectively metallized parts and three-dimensional, selectively metallied part
07/22/2003US6596413 Brazing product having a low melting point
07/22/2003US6596410 Chrome-plated sliding member and manufacturing method thereof
07/17/2003WO2003058696A1 Method of producing metal film
07/17/2003WO2003057946A1 A method for the manufacture of electrodes
07/17/2003WO2002055762A3 Electrochemical co-deposition of metals for electronic device manufacture
07/17/2003US20030134510 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed
07/17/2003US20030134509 Manufacturing method of semiconductor device
07/17/2003US20030134142 Varying an electroplating current to electrodeposit alloy species with different properties in a controlled manner, e.g. the gold-tin alloy system; first alloy and second alloy species differ in stoichiometry, e.g., Au5n and AuSn
07/17/2003US20030134133 Waterproofing the dielectric surfaces and exterior electrodes of a multilayer capacitor by forming a protective coating of a dehydrated/condensed epoxyhydrocarbyl silanetriol; improved dielectrics and soldering properties and thus accuracy
07/16/2003EP1327517A2 Method of metal layer formation and metal foil-based layered product
07/16/2003EP1327483A1 Process for coating a substrate comprising holes
07/16/2003EP1230442B1 Device for electrolytically treating board-shaped workpieces, especially printed circuits
07/16/2003CN1429933A Method for electroplating of selected surface of component
07/16/2003CN1115084C Slice solid electrolytic capacitor and its manufacturing method
07/16/2003CN1114719C Surface treated aluminium material with good processing sealing and connection and crossion-resisting
07/15/2003US6592743 Integrated with gas flow channel of fuel cells efficiently at low costs without deteriorating processing accuracy
07/15/2003US6592739 By electrodeposition combined with substrate transportation of a roll-to-roll system; prevent occurrence of impact marks due to due floating in the bath; transporting the continuous length substrate under electrification
07/10/2003WO2003056609A2 Apparatus and method for electroplating a wafer surface
07/10/2003WO2003056072A2 Method for fixing by electrodeposition reagents on a substrate planar surface
07/10/2003WO2003056058A1 A method of producing a composite electroconductive material
07/10/2003US20030129442 Surface treated tin-plated steel sheet and chemical treatment solution
07/10/2003US20030129441 Plated copper alloy material and process for production thereof
07/10/2003US20030129440 Method of metal layer formation and metal foil-based layered product
07/10/2003US20030128497 Dielectric structure
07/10/2003US20030127337 Apparatus and methods for electrochemical processing of microelectronic workpieces
07/10/2003US20030127336 Methods of and apparatus for making high aspect ratio microelectromechanical structures
07/10/2003US20030127320 Apparatus for electrochemically depositing a material onto a workpiece surface
07/09/2003EP1325970A1 Process for local plating of an article
07/09/2003EP1325529A2 Electrochemical cell system output control method and apparatus
07/09/2003CN1113983C Method and device for electrochemical treatment of items with processing fluid
07/09/2003CN1113981C Technology of palladium-plating electric brush for commutator of special miniature motor
07/09/2003CN1113980C High fatigue ductility electrodeposited copper foil
07/08/2003US6590491 Structure for composite materials of positive temperature coefficient thermistor devices and method of making the same
07/08/2003US6589593 Method for metal coating of substrates
07/08/2003US6589413 Method of making a copper on INVAR® composite
07/08/2003US6589412 Forming sulfide based solid lubricating layer
07/08/2003US6589400 Apparatus for metal coating of bands by electroplating
07/03/2003WO2003053621A2 Wire for high-speed electrical discharge machining
07/03/2003US20030121792 Electrolytic cell; vibration, agitation
07/03/2003US20030121791 Methods of and apparatus for making high aspect ratio microelectromechanical structures
07/03/2003US20030121790 Contact composite of metal and plastic; press fitting
07/03/2003US20030121774 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
07/02/2003EP1324384A2 Via filling method
07/02/2003EP1323850A1 Electroplating method of printed circuit with pulsed current density
07/02/2003EP1323849A1 Nickel electroplating solution
07/02/2003EP1323848A1 Nickel electroplating solution
07/02/2003EP1015669A4 Article, method, and apparatus for electrochemical fabrication
07/02/2003CN1427902A Electrical contacting element made of elastic material
07/02/2003CN1427901A Method of mfg. aluminium product
07/02/2003CN1427668A Guide hole filling method
07/02/2003CN1427094A Electroplating method
07/01/2003US6585877 Acid resistance; waterproof
07/01/2003US6585876 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles
07/01/2003US6585875 Process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology
07/01/2003US6585865 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head
07/01/2003US6585794 Nonwoven metal fabric and method of making same
06/2003
06/26/2003US20030119311 Planar metal electroprocessing
06/26/2003US20030116442 Method for applying a metal layer to a light metal surface
06/26/2003US20030116439 Electroless deposition of barrier material; forming aperture pattern by photolithography
06/25/2003CN2557536Y Improved circuit board electroplating device
06/25/2003CN1426495A Electro-plating apparatus and method
06/25/2003CN1425804A Process for producing electroplating plate for drawing
06/24/2003US6582887 Electrically conductive patterns, antennas and methods of manufacture
06/20/2003CA2365749A1 An electrodeposition process and a layered composite material produced thereby
06/19/2003WO2003050328A1 Plating apparatus, plating method, and method for manufacturing semiconductor device
06/19/2003WO2003023848A3 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
06/19/2003WO2002033153A3 Copper bath and method of depositing a matt copper coating
06/19/2003US20030113996 Semiconductor production device and production method for semiconductor device
06/19/2003US20030111351 Surface treatment method of copper foil with silane coupling agent
06/19/2003US20030111339 Plating system
06/18/2003EP1319093A2 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings
06/18/2003EP1198625B1 Brazing sheet product and method of its manufacture
06/18/2003CN1425080A Electro-plating apparatus and method of electro-plating
06/17/2003US6579568 Copper foil for printed wiring board having excellent chemical resistance and heat resistance
06/17/2003US6579437 Acid resistance
06/17/2003CA2172613C Process for the galvanic application of a surface coating
06/12/2003WO2003049219A1 Coated carbon nanotube array electrodes