Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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07/31/2003 | US20030142409 Method of manufacturing micro-lens array, electrolyte and manufacturing apparatus used therefor |
07/31/2003 | US20030141195 Zinc, or alloy thereof, matte finishing; automobile protective coating |
07/31/2003 | US20030141193 Sintered wet electrolyte high voltage capacitors; insertable medical devices |
07/31/2003 | US20030141192 Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied |
07/31/2003 | US20030141185 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces |
07/30/2003 | EP1331088A1 Copper foil for high-density ultrafine wiring board |
07/30/2003 | CN1433572A Novel chip interconnect and packaging deposition methods and structures |
07/30/2003 | CN1432661A Metal layer forming process and laminated metal foil-based product |
07/30/2003 | CN1116706C Process for production of surficially roughened foam nickel |
07/30/2003 | CN1116446C Process for alloying surface of low carbon steel |
07/29/2003 | US6600629 Thin film magnetic head having gap layer made of nip and method of manufacturing the same |
07/29/2003 | US6599834 Process of manufacturing a semiconductor device with an electroplated wiring layer |
07/29/2003 | US6599412 In-situ cleaning processes for semiconductor electroplating electrodes |
07/29/2003 | US6599411 Method of electroplating a nickel-iron alloy film with a graduated composition |
07/29/2003 | US6599402 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
07/24/2003 | WO2003060959A2 Method for applying metal features onto barrier layers using electrochemical deposition |
07/24/2003 | WO2003060201A1 System and method for items to be electrochemically treated |
07/24/2003 | WO2003059531A2 Method for coating a substrate having holes |
07/24/2003 | US20030139036 Semiconductor device and method for fabricating the same |
07/24/2003 | US20030136683 Method for electroplating a body-centered cubic nickel-iron alloy thin film with a high saturation flux density |
07/24/2003 | US20030136547 Heat transfer surface with a microstructure of projections galvanized onto it |
07/23/2003 | EP1330146A2 Via filling method |
07/23/2003 | CN1432072A Method for producing three-dimensional, selectively metallized parts and three-dimensional, selectively metallied part |
07/22/2003 | US6596413 Brazing product having a low melting point |
07/22/2003 | US6596410 Chrome-plated sliding member and manufacturing method thereof |
07/17/2003 | WO2003058696A1 Method of producing metal film |
07/17/2003 | WO2003057946A1 A method for the manufacture of electrodes |
07/17/2003 | WO2002055762A3 Electrochemical co-deposition of metals for electronic device manufacture |
07/17/2003 | US20030134510 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed |
07/17/2003 | US20030134509 Manufacturing method of semiconductor device |
07/17/2003 | US20030134142 Varying an electroplating current to electrodeposit alloy species with different properties in a controlled manner, e.g. the gold-tin alloy system; first alloy and second alloy species differ in stoichiometry, e.g., Au5n and AuSn |
07/17/2003 | US20030134133 Waterproofing the dielectric surfaces and exterior electrodes of a multilayer capacitor by forming a protective coating of a dehydrated/condensed epoxyhydrocarbyl silanetriol; improved dielectrics and soldering properties and thus accuracy |
07/16/2003 | EP1327517A2 Method of metal layer formation and metal foil-based layered product |
07/16/2003 | EP1327483A1 Process for coating a substrate comprising holes |
07/16/2003 | EP1230442B1 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
07/16/2003 | CN1429933A Method for electroplating of selected surface of component |
07/16/2003 | CN1115084C Slice solid electrolytic capacitor and its manufacturing method |
07/16/2003 | CN1114719C Surface treated aluminium material with good processing sealing and connection and crossion-resisting |
07/15/2003 | US6592743 Integrated with gas flow channel of fuel cells efficiently at low costs without deteriorating processing accuracy |
07/15/2003 | US6592739 By electrodeposition combined with substrate transportation of a roll-to-roll system; prevent occurrence of impact marks due to due floating in the bath; transporting the continuous length substrate under electrification |
07/10/2003 | WO2003056609A2 Apparatus and method for electroplating a wafer surface |
07/10/2003 | WO2003056072A2 Method for fixing by electrodeposition reagents on a substrate planar surface |
07/10/2003 | WO2003056058A1 A method of producing a composite electroconductive material |
07/10/2003 | US20030129442 Surface treated tin-plated steel sheet and chemical treatment solution |
07/10/2003 | US20030129441 Plated copper alloy material and process for production thereof |
07/10/2003 | US20030129440 Method of metal layer formation and metal foil-based layered product |
07/10/2003 | US20030128497 Dielectric structure |
07/10/2003 | US20030127337 Apparatus and methods for electrochemical processing of microelectronic workpieces |
07/10/2003 | US20030127336 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
07/10/2003 | US20030127320 Apparatus for electrochemically depositing a material onto a workpiece surface |
07/09/2003 | EP1325970A1 Process for local plating of an article |
07/09/2003 | EP1325529A2 Electrochemical cell system output control method and apparatus |
07/09/2003 | CN1113983C Method and device for electrochemical treatment of items with processing fluid |
07/09/2003 | CN1113981C Technology of palladium-plating electric brush for commutator of special miniature motor |
07/09/2003 | CN1113980C High fatigue ductility electrodeposited copper foil |
07/08/2003 | US6590491 Structure for composite materials of positive temperature coefficient thermistor devices and method of making the same |
07/08/2003 | US6589593 Method for metal coating of substrates |
07/08/2003 | US6589413 Method of making a copper on INVAR® composite |
07/08/2003 | US6589412 Forming sulfide based solid lubricating layer |
07/08/2003 | US6589400 Apparatus for metal coating of bands by electroplating |
07/03/2003 | WO2003053621A2 Wire for high-speed electrical discharge machining |
07/03/2003 | US20030121792 Electrolytic cell; vibration, agitation |
07/03/2003 | US20030121791 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
07/03/2003 | US20030121790 Contact composite of metal and plastic; press fitting |
07/03/2003 | US20030121774 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same |
07/02/2003 | EP1324384A2 Via filling method |
07/02/2003 | EP1323850A1 Electroplating method of printed circuit with pulsed current density |
07/02/2003 | EP1323849A1 Nickel electroplating solution |
07/02/2003 | EP1323848A1 Nickel electroplating solution |
07/02/2003 | EP1015669A4 Article, method, and apparatus for electrochemical fabrication |
07/02/2003 | CN1427902A Electrical contacting element made of elastic material |
07/02/2003 | CN1427901A Method of mfg. aluminium product |
07/02/2003 | CN1427668A Guide hole filling method |
07/02/2003 | CN1427094A Electroplating method |
07/01/2003 | US6585877 Acid resistance; waterproof |
07/01/2003 | US6585876 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles |
07/01/2003 | US6585875 Process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology |
07/01/2003 | US6585865 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
07/01/2003 | US6585794 Nonwoven metal fabric and method of making same |
06/26/2003 | US20030119311 Planar metal electroprocessing |
06/26/2003 | US20030116442 Method for applying a metal layer to a light metal surface |
06/26/2003 | US20030116439 Electroless deposition of barrier material; forming aperture pattern by photolithography |
06/25/2003 | CN2557536Y Improved circuit board electroplating device |
06/25/2003 | CN1426495A Electro-plating apparatus and method |
06/25/2003 | CN1425804A Process for producing electroplating plate for drawing |
06/24/2003 | US6582887 Electrically conductive patterns, antennas and methods of manufacture |
06/20/2003 | CA2365749A1 An electrodeposition process and a layered composite material produced thereby |
06/19/2003 | WO2003050328A1 Plating apparatus, plating method, and method for manufacturing semiconductor device |
06/19/2003 | WO2003023848A3 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
06/19/2003 | WO2002033153A3 Copper bath and method of depositing a matt copper coating |
06/19/2003 | US20030113996 Semiconductor production device and production method for semiconductor device |
06/19/2003 | US20030111351 Surface treatment method of copper foil with silane coupling agent |
06/19/2003 | US20030111339 Plating system |
06/18/2003 | EP1319093A2 Ternary tin zinc alloy, electroplating solutions and galvanic method for producing ternary tin zinc alloy coatings |
06/18/2003 | EP1198625B1 Brazing sheet product and method of its manufacture |
06/18/2003 | CN1425080A Electro-plating apparatus and method of electro-plating |
06/17/2003 | US6579568 Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
06/17/2003 | US6579437 Acid resistance |
06/17/2003 | CA2172613C Process for the galvanic application of a surface coating |
06/12/2003 | WO2003049219A1 Coated carbon nanotube array electrodes |