| Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883) |
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| 01/20/2000 | WO2000003072A1 Method and apparatus for copper plating using electroless plating and electroplating |
| 01/20/2000 | WO2000003067A1 Reactor vessel having improved cup, anode and conductor assembly |
| 01/20/2000 | DE19837973C1 Apparatus for electrochemical treatment of parts of bar-shaped workpieces in immersion bath installations |
| 01/19/2000 | EP0973176A1 Nickel barrier end termination and method |
| 01/19/2000 | EP0972861A2 Laminated chromium plating layers having superior wear resistance and fatigue strength |
| 01/18/2000 | US6015482 Printed circuit manufacturing process using tin-nickel plating |
| 01/17/2000 | CA2277319A1 Electroplating process for oldham ring and scroll member type compressor comprising the same |
| 01/12/2000 | EP0970530A2 Method for manufacturing a bipolar plate |
| 01/12/2000 | EP0874921B1 Process and system for electrochemical treatment of long stretched-out items |
| 01/12/2000 | EP0786021B1 Process for making copper foil |
| 01/12/2000 | EP0502023B1 Metallization of non-conductors |
| 01/12/2000 | CN1048292C Hard carbon coating-clad base material |
| 01/11/2000 | US6013380 Composite chromium plating film and sliding member covered thereof |
| 01/11/2000 | US6013379 Coated steel sheet for alkaline dry cell positive electrode cans |
| 01/11/2000 | CA2069865C Metallization of non-conductors |
| 01/06/2000 | WO2000001208A1 Assembly of an electronic component with spring packaging |
| 01/06/2000 | WO2000000673A1 Method for producing a nickel foam and a nickel foam thus obtainable |
| 01/06/2000 | WO2000000672A2 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 01/06/2000 | WO1999057342A8 Method and device for plating substrate |
| 01/06/2000 | CA2334708A1 Galvanic bath, method for producing structured hard chromium layers and use thereof |
| 01/05/2000 | CN1240259A Nickel-ceramic compound plating technology for aluminium alloy cylinder inner wall |
| 01/04/2000 | US6010610 Stirring, sedimentation, electroplating cycles |
| 12/30/1999 | DE19828846A1 Verfahren zum Beschichten eines Substrats A method for coating a substrate |
| 12/29/1999 | WO1999067321A2 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 12/29/1999 | EP0967846A2 Apparatus for treating objects, especially circuit boards |
| 12/29/1999 | EP0967649A2 Palladium surface coatings suitable for wirebonding and process for forming palladium surface coatings |
| 12/29/1999 | EP0967296A2 Method for coating a substrate |
| 12/29/1999 | EP0966557A1 Circuitry and method for an electroplating plant or etching plant pulse power supply |
| 12/29/1999 | EP0966556A1 Graded metal hardware component for an electrochemical cell |
| 12/28/1999 | US6007866 Swelling, treating with alkaline permanganate, rinsing with water and acidic aqueous solution and water, neutralizing manganese dioxide layer with alkaline solution, rinsing with water and ethylene-3,4-dioxythiophene, acid, then coppering |
| 12/28/1999 | US6007758 Using conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent, firing of the substrate onto which the ink has been coated, and plating of copper thereon |
| 12/23/1999 | WO1999066106A2 Method and apparatus for electroplating |
| 12/23/1999 | WO1999066098A1 Method for preparation of target material for spattering |
| 12/23/1999 | DE19827529A1 Einrichtung zur Behandlung von Gegenständen, insbesondere Leiterplatten Device for treating objects, in particular printed circuit boards |
| 12/21/1999 | US6004684 Article having a protective and decorative multilayer coating |
| 12/21/1999 | US6004633 Microstructured dies made of non-conductive resins. |
| 12/21/1999 | US6004548 Polypeptides possessing primary structural conformation and biological properties of mammalian pluripotent granulocyte colony stimulating factor wherein at least one cysteine residue at positions 17,36,42,64,74 is replaced by alanine |
| 12/21/1999 | US6004440 Cathode current control system for a wafer electroplating apparatus |
| 12/21/1999 | CA2076964C Process for manufacturing galvannealed steel sheets having excellent press-formability and anti-powdering property |
| 12/16/1999 | WO1999065071A1 Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly |
| 12/16/1999 | WO1999064647A1 Method and apparatus for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipolar electrode assembly |
| 12/15/1999 | CN1238394A Process of controlling grain growth in metal films |
| 12/14/1999 | US6001235 Rotary plater with radially distributed plating solution |
| 12/14/1999 | US6001234 Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot |
| 12/14/1999 | CA2195218C Copper wire and process for making copper wire |
| 12/10/1999 | CA2270303A1 Palladium surface coatings suitable for wirebonding and process for forming palladium surface coatings |
| 12/08/1999 | EP0962553A1 Process and apparatus for coating a surface by electrophoresis |
| 12/07/1999 | US5998228 Method of testing semiconductor |
| 12/07/1999 | US5997721 Dissolving aluminium oxide and maintained at a temperature of at least 70.degree. c. under conditions such that the surface of the workpiece is cleaned with any oxide film thereon being non-porous and no more than about 20 nm thick. |
| 12/04/1999 | CA2272839A1 Electrophoresis surface-coating procedure and system |
| 12/02/1999 | WO1999061182A2 Layer system for protecting light metals and light metal alloys against corrosion |
| 12/02/1999 | DE19924687A1 Protecting light metals and their alloys from corrosion damage, especially for use in the vehicle construction industry |
| 12/01/1999 | CN1237215A Circuitry and method for electroplating plant or etching plant pulse power supply |
| 12/01/1999 | CN1236829A Surface-treated metal component for reinforcing structures and article of manufactured comprising the same |
| 11/30/1999 | US5993994 Surface treated steel sheet for battery containers, a battery container, and a battery produced thereof |
| 11/25/1999 | WO1999060189A2 Method for metal coating of substrates |
| 11/25/1999 | CA2331757A1 Process for coating substrates with metals |
| 11/24/1999 | EP0959153A2 An electroplating machine |
| 11/24/1999 | CN1236026A Electroplating machine |
| 11/24/1999 | CN1236024A Processing method and device for drum electroplating |
| 11/24/1999 | CN1235879A Fluid delivery apparatus and method |
| 11/23/1999 | US5989735 Protective coating for metal components providing good corrosion resistance in a saline atmosphere, and method of producing said coating |
| 11/23/1999 | US5989732 Plating nickel on stainless steel core wire containing carbon, silicon, manganese, chromium and nickel, depositing potassium sulfate or borax film on plate layer, drawing wire, coiling the drawn wire |
| 11/23/1999 | US5989730 Article having a decorative and protective multi-layer coating |
| 11/23/1999 | US5989727 Electrolytic copper foil having a modified shiny side |
| 11/23/1999 | CA2119050C Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
| 11/18/1999 | WO1999058283A1 Polished soldering tip and method of manufacturing |
| 11/18/1999 | WO1999058256A1 Low etch alkaline zincate composition and process for zincating aluminum |
| 11/18/1999 | WO1999052336B1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 11/18/1999 | DE19822196A1 Selective coating of parts of metal components |
| 11/18/1999 | DE19822075A1 Metallization of polymeric substrates for production of circuit boards |
| 11/18/1999 | DE19821151A1 Apparatus for electrolytic metal precipitation |
| 11/17/1999 | EP0956600A1 PREPARATION OF Cu x?In y?Ga z?Se n? (x=0-2, y=0-2, z=0-2, n=0-3) PRECURSOR FILMS BY ELECTRODEPOSITION FOR FABRICATING HIGH EFFICIENCY SOLAR CELLS |
| 11/17/1999 | EP0956377A1 A process for manufacturing a frame for color picture tubes |
| 11/17/1999 | EP0698132B1 Carbon compositions and processes for preparing a non-conductive substrate for electroplating |
| 11/16/1999 | US5985733 Semiconductor device having a T-shaped field oxide layer and a method for fabricating the same |
| 11/16/1999 | US5985468 Nickel, nickel-palladium alloy, zirconium and/or titanium compounds; polished brass simulation; wear and corrosion resistance; door knobs, lamps |
| 11/16/1999 | US5985125 Forming barrier metal patterns on wafer, depositing copper only on barrier metal patterns by electrochemistry |
| 11/16/1999 | US5985123 Apparatus which uniformly distributes electroplating material on substrates of varying sizes and/or substrates being transferred through electroplating tank at different speeds, while maintaining in proper vertical alignment |
| 11/16/1999 | US5985122 Method for preventing plating of material in surface openings of turbine airfoils |
| 11/16/1999 | US5983493 Method of temporarily, then permanently, connecting to a semiconductor device |
| 11/16/1999 | CA2173696C Zincate-treated article of al-mg-si base alloy and method of manufacturing the same |
| 11/11/1999 | WO1999057342A1 Method and device for plating substrate |
| 11/10/1999 | EP0954385A1 Fluid delivery apparatus and method |
| 11/10/1999 | EP0876518A4 Rough electrical contact surface |
| 11/10/1999 | CN1234454A Method for forming zinc-oxide film and method of preparing semiconductor element matrix and photoelectric elements |
| 11/09/1999 | US5981084 Electrolytic process for cleaning electrically conducting surfaces and product thereof |
| 11/09/1999 | US5980722 Anodic etching of silicon-containing aluminum alloy to protrude silicon from surface of aluminum alloy |
| 11/03/1999 | EP0839440B1 Copper foil for the manufacture of printed circuits and method of producing same |
| 11/02/1999 | US5977620 Lead frame having a Ni-Mn alloy layer and a Pd layer |
| 11/02/1999 | US5974662 Method of planarizing tips of probe elements of a probe card assembly |
| 10/28/1999 | WO1999054920A2 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 10/28/1999 | WO1999045176A3 Electrolytic copper foil having a modified shiny side |
| 10/27/1999 | EP0952242A1 Electro deposition chemistry |
| 10/27/1999 | EP0868545B1 Process and circuitry for generating current pulses for electrolytic metal deposition |
| 10/26/1999 | US5972526 A copper primary layer, a tin-copper-palladium alloy plate layer covering the primary plate layer, and a finishing plate layer composed of atlest one element selected from palladium, rhodium and platinum; free of nickel; multi or single color |
| 10/26/1999 | US5972193 Method of manufacturing a planar coil using a transparency substrate |
| 10/26/1999 | US5972192 Pulse electroplating copper or copper alloys |
| 10/21/1999 | WO1999053503A1 Device for activating conductivity in porous structures |
| 10/21/1999 | WO1999053119A1 Method and apparatus for enhancing adhesion between barrier layer and metal layer formed by plating |