Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
09/2003
09/25/2003US20030178315 Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes
09/25/2003US20030178297 Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly
09/25/2003US20030178102 Method of depositing epitaxial layers on a substrate
09/24/2003EP1347070A1 Steel sheet for porcelain enameling and method for production thereof, and enameled product and method for production thereof
09/24/2003EP1346084A1 Zn-co-w alloy electroplated steel sheet with excellent corrosion resistance and welding property, and its electrolyte for it
09/24/2003EP1346083A2 Electrochemical co-deposition of metals for electronic device manufacture
09/24/2003EP1171239B1 Method for producing a catalyst
09/24/2003CN1444437A Through-hole filling method
09/24/2003CN1443872A Method for preparing polyester base conductive net fabric
09/24/2003CN1122120C Processing method and device for drum electroplating
09/24/2003CN1122119C Method and appts. for metal layer by electrolytic deposition
09/24/2003CN1122118C Method of making iron alloy electroplated aluminium or alaminium alloy materials, and said aluminium or aluminium alloy
09/23/2003US6624648 Probe card assembly
09/23/2003US6623614 Forming decorative, durable, corrosion resistant casing
09/18/2003WO2003077258A2 Magnetic flux concentrating cladding material on conductive lines of mram
09/18/2003WO2003076134A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
09/18/2003WO2003062499A3 Device and method for the electrochemical treatment of items with a pulse flow
09/18/2003WO2003033770A3 System and method for electrolytic plating
09/18/2003WO2002068728A8 Bath for the galvanic deposition of gold and gold alloys, and the use thereof
09/18/2003US20030173705 Method for annealing an electrodeposition structure
09/18/2003US20030173226 Metallization of optical fibers
09/18/2003US20030173225 Applying electron beam to surface of target and passing electrolyte between target and anode to deposit material on target
09/18/2003US20030173209 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
09/18/2003US20030173002 Sheet of low carbon Al-killed steel; high oxygen steel Ti-added steel sheet, Nb-added steel, Ti-Nb-added steel or B-added steel; Ni-Mo alloy plating
09/17/2003EP1345263A1 Electronic device and method of manufacturing the electronic device
09/17/2003EP1344848A2 Method for annealing an electrodeposition structure
09/17/2003EP1343924A2 Improvements relating to metal finishes
09/17/2003CN1442516A Rolling hanging type electroplating method and its rotating electroplating hanging device
09/17/2003CN1442515A Multifunction through-flow conveying roller device
09/17/2003CN1442510A Non-cyanide gold imitation electro plating method of flowers and plants
09/16/2003US6620303 Process for making nickel electroforms
09/11/2003US20030170976 Method of applying cladding material on conductive lines of MRAM devices
09/11/2003US20030168346 Introducing the semiconductor substrate into the dry area of processing system; moving semiconductor substrate into wet area; processing semiconductor substrate in an electrochemical processing cell; removing unwanted deposits on substrate
09/11/2003US20030168341 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver
09/11/2003US20030168340 Process and apparatus for electroplating microscopic features uniformly across a large substrate
09/11/2003US20030168338 Electrodepositing the redox polymers to form a redox polymer film on at least the portion of the electrode surface via application of a potential or at least one cycle of varied potential for modifying electrode surface
09/10/2003EP1341951A2 Copper bath and method of depositing a matt copper coating
09/10/2003EP1171304B1 Improved gravure printing rollers
09/10/2003CN1441087A Nickel electric plating liquid
09/10/2003CN1441086A Nickel electric plating liquid
09/10/2003CN1120902C Method for producing layered material for sliding bearings and electroplating bath for carrying out this method
09/09/2003US6615485 Probe card assembly and kit, and methods of making same
09/04/2003WO2003072855A1 Methods and devices for the electrolytic metallisation of perforated walls and structures
09/04/2003US20030165633 Plating method of metal film on the surface of polymer
09/04/2003US20030164303 Forming vias on the package substrate coated with copper film; electroplating to form electrical conductive holes; coating a resisting agent; etching the pattern; removing; electroplating substrate with nickel and gold, and removing the resist
09/04/2003US20030164302 Depositing barrier layer; depositing seed layer of metal on barrier layer; removing seed layer from barrier layer, electroplating metal using portion of seed layer and exposed portions of barrier layer; removing excess plated metal
09/04/2003US20030164301 Uniform deposition thickness
09/03/2003CN1439745A One sided platinizing refractory metal plate and preparation for extended metal grid
09/02/2003US6613451 Metallic material
09/02/2003US6613165 Process for heat treating bullets comprising two or more metals or alloys
08/2003
08/28/2003WO2003071008A2 Methods of and apparatus for making high aspect ratio microelectromechanical structures
08/28/2003WO2003071007A1 Methods of and apparatus for making high aspect ratio microelectromechanical structures
08/28/2003WO2002064862A3 Method for producing plated molded product
08/28/2003US20030162052 Steel sheet for procelain enameling and method for production thereof, and enameled product and method for production thereof
08/27/2003EP1337693A2 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
08/27/2003EP1194297B1 Coating method and products obtained by same
08/27/2003CN1438678A High-pressure electrochemical method for depositing nano Cu granule film on semiconductor Si substrate
08/27/2003CN1119435C A surface-treated metal wire for use in the realization of reinforcement structures for manufactured products in elastomer material
08/26/2003US6610600 Damascene copper electroplating process with low-pressure pre-processing
08/26/2003US6610417 Nickel coated copper as electrodes for embedded passive devices
08/26/2003US6610365 Selective electroplating by etching in acidic solutions containing oxidising agents, then treated in trivalent bismuth compound solution and a sulfide solution; decorative or protective function; electronic packaging
08/26/2003US6610191 Connecting electronically resistive substrate to a negative terminal of electrical power source; disposing substrate and an anode in solution comprising metal compound and supporting electrolyte; electrodepositing metal onto substrate
08/26/2003US6610189 Immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features, especially by mechanical vibration
08/26/2003US6609830 Bearing having multilayer overlay and method of manufacture
08/21/2003WO2003068434A1 Metal hydride composite materials
08/21/2003US20030155409 Fluxless brazing
08/21/2003US20030155248 Electroless deposition using organometallic polymer and organosilicon polymer; forming copper film
08/20/2003EP0946793B1 Process for the reflowing of electro-deposited tinplate by means of fluxing agents
08/20/2003CN1437661A Conditioning of through holes and glass
08/19/2003US6607844 Coating zinc, magnesium and/or alloys on metal sheets by electrolysis to form films having corrosion resistance
08/19/2003US6607650 Method of forming a plated layer to a predetermined thickness
08/14/2003US20030150742 Copper is plated on the printed wiring board from a bath containing nickel and copper, followed by plating nickel from the same bath
08/14/2003US20030150741 Transparent insulation has an anti-etch feature for the electrolyte to keep the exposed surface of the body smooth.
08/14/2003US20030150740 Lead-coated complex porous structures and corresponding method for conductive activation
08/14/2003US20030150531 Plating a core wire with a conductive coating to form an electrical contact that experiences internal stresses; induction heating to at least partially relieve the internal stresses.
08/13/2003EP1335392A1 Ceramic electronic device and method of manufacturing the device
08/13/2003EP1128969B1 Metal-coated plastic part and method for making same
08/13/2003CN1435498A Sintered alloy, its production method, electric fuel pump comprising sintered alloy bearing
08/13/2003CN1118099C Method for mounting intermediate connecting element to terminal of electronic module
08/13/2003CN1117891C Antirusting technology for liquid reservoir made of carbon steel in air conditioner or refrigerator
08/12/2003US6605370 Joining product having a base substrate of an aluminium alloy comprising silicon; nickel layer; welding; fuel tanks; no need for a vacuum atmosphere nor a protective gas
08/12/2003US6605369 Printed wiring boards; anticorrosion zinc or zinc alloy layer on foil and an electrodeposited chromate layer on the zinc layer and a silane coupling agent-adsorbed layer on chromate layer; drying conditions after coupling treatment; adhesion
08/12/2003US6605204 Electroplating of copper from alkanesulfonate electrolytes
08/07/2003WO2003064731A1 Methods of anodizing sintered valve metal anodes
08/07/2003US20030148136 Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminate
08/07/2003US20030146089 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
08/07/2003DE19981324C2 Verfahren zur Herstellung eines Sputtertargetmaterials A method for producing a Sputtertargetmaterials
08/07/2003CA2472155A1 Methods of anodizing sintered valve metal anodes
08/06/2003CN1434882A Pad designs and structures for universal material working equipment
08/06/2003CN1117180C Process for conditioning copper or copper-alloy external surface of element of mould for continuous casting of metals
08/06/2003CN1117179C Pd-Ni alloy and rare earth-Pd-Ni alloy plating materials for plating electric brush
08/05/2003US6603205 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components
08/05/2003US6602787 Method for fabricating semiconductor devices
08/05/2003US6602614 Coated metal wire, wire-reinforced elastomeric article containing the same and method of manufacture
08/05/2003US6602354 Method for producing a tin-nickel alloy film
07/2003
07/31/2003WO2003062499A2 Device and method for the electrochemical treatment of items with a pulse flow
07/31/2003US20030143845 Mask forming and removing method, and a semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method
07/31/2003US20030143842 Damascene copper electroplating process with low-pressure pre-processing
07/31/2003US20030143453 A metal oxide or metal sulfide capable of intercalating lithium, an electroactive carbon catalyst to reduce oxygen, and a fluoropolymeric binder; dual mode cathodes for lithium batteries; high charge and discharge rate capabilities; good charge storage capacity
07/31/2003US20030143096 Sintered alloy article, its production method and a motorized fuel pump comprising a bearing comprised of sintered alloy article