Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
11/2003
11/13/2003WO2002095091A3 Direct electrolytic metallization of non-conducting substrates
11/13/2003US20030209445 Forming electrical contactors; uniform electrodeposition; integrated circuits
11/13/2003US20030209425 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/12/2003EP1361297A1 Method for cleaning and passivation of the surfaces of zinc or zincalloys
11/12/2003EP1360347A2 Method for producing plated molded product
11/12/2003EP1360029A1 Brazing product
11/12/2003CN1127585C Method and apparatus for sequentially metalizing polymeric films and products made thereby
11/11/2003CA2088123C Process for through-hole plating of two-layer circuit boards and multilayers
11/06/2003WO2003092344A1 Production of via hole in flexible circuit printable board
11/06/2003WO2003041126A3 Electrochemical mechanical processing with advancible sweeper
11/06/2003US20030207149 Provided contact, sliding, fitting-in and ornamental members having a surface treatment structure in which contact resistance is low, and lubricating property and wear resistance are excellent, and capable of being used suitably
11/06/2003US20030206420 Extended range power supply system
11/06/2003US20030205479 Controlling formation of particulate inclusions at the surface of an aluminum alloy article, which interfere with a smooth transition from the alloy surface to an overlying aluminum oxide protective film
11/06/2003US20030205477 Periodically alternating between an electrodeposition process and electropolishing process with respect to the second electrode.
11/06/2003US20030205474 Plating solution containing up to about 0.4M of supporting electrolyte.
11/06/2003US20030205461 Removable modular cell for electro-chemical plating
11/05/2003CN1454265A Fountain bed with fluid contacting with substance
11/05/2003CN1127158C Surface treated steel plate for battery case, battery case and battery using case
11/04/2003US6641984 Method of frame plating and method of forming magnetic pole of thin-film magnetic head
11/04/2003US6641710 Pulse plating by pulsed electrolysis by periodically applying electricity while controlling pulse frequency and current density
10/2003
10/30/2003WO2003090257A2 Method for the production of thin metal-containing layers having low electrical resistance
10/30/2003WO2003089679A1 Process of masking cooling holes of a gas turbine component
10/30/2003WO2003012175A3 Method for selectively electroplating a strip-shaped, metal support material
10/30/2003US20030204016 Modified polyurethanes, a process for their preparation, and electroplated or metallized molded articles produced therefrom
10/30/2003US20030203232 Comprises sonicated bath to form undercoat/topcoat; powder coating; brush plating
10/30/2003US20030203173 Artifact with transparent and protective anti-iridescent surface layer and finishing method therefor
10/30/2003US20030201190 Using reverse polarity electrical current to dissolve plating deposits
10/30/2003US20030201185 Pretreatment; applying wavelengths to seed layer; pulsation cycles; removal impurities
10/29/2003EP1357153A1 Modified polyurethane, process for the production thereof and use thereof
10/28/2003US6639194 Method for manufacturing a multiple walled tube
10/28/2003US6638863 Electropolishing metal layers on wafers having trenches or vias with dummy structures
10/28/2003US6638861 Method of eliminating voids in W plugs
10/28/2003US6638847 Method of forming lead-free bump interconnections
10/28/2003US6638411 Method and apparatus for plating substrate with copper
10/28/2003US6638374 Device produced by a process of controlling grain growth in metal films
10/23/2003WO2003088316A2 Electropolishing and electroplating methods
10/23/2003WO2003087438A1 Method for cleaning and passivating zinc and zinc alloy surfaces
10/23/2003US20030197050 Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals
10/23/2003US20030196906 Can be used for ceramic composite materials; comprising nickel ions and at least two chelating agents selected from aminopolycarboxylic acids, polycarboxylic acids, and polyphosphonic acids
10/23/2003US20030196904 System and method for electrolytic plating
10/23/2003US20030196892 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
10/23/2003DE20215939U1 Appliance, for electrolytic metal precipitation, uses pulse reverse plating in galvanic baths with power portion with(out) capacities for current switching at any arbitrary point of bath in direct link to anode and/or cathode
10/23/2003CA2479873A1 Electropolishing and electroplating methods
10/22/2003EP1354078A1 Spouted bed apparatus for contacting objects with a fluid
10/22/2003EP1354077A1 Method for the continuous deposition of a nickel-containing coating on a metallic film
10/22/2003EP0792517B1 Electrical contact structures from flexible wire
10/22/2003CN1450207A Electric field electron current decoupling electroplating device and control method thereof
10/22/2003CN1450206A Surface treatment method for making metal container surface indicating two kinds of color and/or surface effect
10/22/2003CN1125491C Multi-layer plated lead frame
10/22/2003CN1125198C Lead frame manufacturing method
10/22/2003CN1125197C Plated aluminum alloy cylinder, planting pretreatment and planting method
10/22/2003CN1125196C Surface activating process of Ti and Ti alloy for bright electroplating
10/21/2003US6635157 Electro-chemical deposition system
10/16/2003WO2003085713A1 Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
10/16/2003WO2003085275A1 Plated fastener inserts and method of producing the same
10/16/2003WO2003027011A3 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
10/16/2003US20030196181 Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes
10/16/2003US20030194866 Method and apparatus for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
10/16/2003US20030194657 Deposition of a projection structure on a substrate using a negative mask and negative photoresist
10/15/2003EP1353228A1 Method for depositing a very thick photoresist layer on a substrate and metal plating method
10/15/2003EP1352994A1 Ni-plated steel plate for alkali-manganese dry cell anode can and alkali-manganese dry cell anode can
10/15/2003CN1449588A Surface-treated steel plate for battery case and battery case
10/15/2003CN1449453A A surface-treated steel wire for reinforcing structures for articles of manufacture made of elastomeric material and an article of manufacture
10/15/2003CN1448544A Surface protection technique for NdFeB permanent magnet material
10/15/2003CN1124656C Surface-treated steel sheet for battery case, battery case, and battery manufactured by using case
10/15/2003CN1124647C Interconnect structure in semiconductor device and method of formation
10/14/2003US6632344 Conductive oxide coating process
10/14/2003US6631546 Self-aligned void filling for mushroomed plating
10/09/2003WO2003083181A2 Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
10/09/2003WO2003083175A2 Method and apparatus for electrochemical processing
10/09/2003WO2003083171A1 Conversion coating solution
10/09/2003US20030190213 Plated fastener inserts and method of producing the same
10/09/2003US20030189082 Alloy composition and method for low temperature fluxless brazing
10/09/2003US20030188974 Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
10/09/2003US20030188972 Acceleration of coating by combining the oxidation process with the use of high-frequency electrical pulses and acoustic vibrations in the sonic frequency range in the electrolyte; quality; nonporous layer; protective coatings
10/08/2003EP1351289A1 Method and apparatus for forming fine circuit interconnects
10/08/2003EP1350860A1 Process of masking cooling holes of a gas turbine component
10/08/2003EP1349986A1 Doctor or coater blade and method in connection with its manufacturing
10/08/2003EP1072176B1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
10/08/2003CN1447402A Method of annealing electroplate metals
10/07/2003US6630060 Device for carrying out an electro-chemical treatment
10/07/2003US6630059 Workpeice proximity plating apparatus
10/02/2003US20030186540 Method and apparatus for forming fine circuit interconnects
10/02/2003US20030183532 Process for copper plating a zinc or zinc alloy article comprising the steps of: a. immersing said zinc or zinc alloy article in an aqueous nickel solution, said nickel solution comprising a source of nickel, a source of pyrophosphate, and
10/02/2003US20030183531 Methods and producing conductor layers on dielectric surfaces
10/02/2003US20030183530 Alternately electrodepositing and electro- mechanically polishing to selectively fill a semiconductor feature with metal including a) providing an anode assembly and a semiconductor wafer disposed in spaced apart relation
10/02/2003US20030183528 Combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of the pulse and continuously decreasing
10/02/2003US20030183527 Electroplating metal onto a low conductivity layer combines a potential or current reversal waveform with variation in the amplitude and duration of the applied potential or current pulse. The method includes, over time, varying the duration of
10/02/2003US20030183526 Superior filling properties and superior planarization of the deposited metal layer is provided. This is achieved by a method having a F/R ratio, the ratio of the electric current densities between the forward electrolysis and the reverse
10/02/2003US20030183308 Method for electroplated metal annealing process
10/01/2003EP1348044A1 Device and method for electrochemically treating a band-shaped product
10/01/2003EP1348041A1 Plasma electroplating
10/01/2003EP1112125A4 Metallization structures for microelectronic applications and process for forming the structures
10/01/2003CN1446359A Lead-coated complex porous structures, and corresponding method for conductive activation
10/01/2003CN1446272A Method for electrolytic galvanising using electrolytes containing alkane sulphonic acid
09/2003
09/30/2003US6627329 Bonding layer is the product of gold plating with a thiol which in turn interacts with lubricant
09/30/2003US6627051 Cathode current control system for a wafer electroplating apparatus
09/25/2003WO2003078686A1 Non-cyanide copper plating process for zinc and zinc alloys
09/25/2003US20030178319 For removing conductors of the top conductive surfaces of workpieces (copper) by applying etching solution in presence of current, forming easily removable intermediate (copper chloride)
09/25/2003US20030178318 Dipping into nickel-/iron- sulfamate, phosphorous acid, and buffer solution under electric current density; for use in nuclear power plants
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